Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

Abstract: IC packages including a heat spreading material comprising crystalline carbon. The heat spreading material may be applied directly to an IC die surface, for example at a die prep stage, prior to an application or build-up of packaging material, so that the high thermal conductivity may best mitigate any hot spots that develop at the IC die surface during operation. The heat spreading material may be applied to surface of the IC die.

Abstract: IC package including a material preform comprising graphite. The material preform may have a thermal conductivity higher than that of other materials in the package and may therefore mitigate the formation of hot spots within an IC die during device operation. The preform may have high electrical conductivity suitable for EMI shielding. The preform may comprise a graphite sheet that can be adhered to a package assembly with an electrically conductive adhesive, applied, for example over an IC die surface and a surrounding package dielectric material. Electrical interconnects of the package may be coupled to the graphite sheet as an EMI shield. The package preform may be grounded to a reference potential through electrical interconnects of the package, which may be further coupled to a system-level ground plane. System-level thermal solutions may interface with the package-level graphite sheet.

Abstract: An apparatus is provided which comprises: a package substrate, an integrated circuit device coupled to a surface of the package substrate, a first material on the surface of the package substrate, the first material contacting one or more lateral sides of the integrated circuit device, the first material extending at least to a surface of the integrated circuit device opposite the package substrate, two or more separate fins over a surface of the integrated circuit device, the two or more fins comprising a second material having a different composition than the first material, and a third material having a different composition than the second material, the third material over the surface of the integrated circuit device and between the two or more fins. Other embodiments are also disclosed and claimed.

Abstract: Ziprasidone is a known agent for treating various disorders including schizophrenia, migraine pain and anxiety. The present invention provides a method for preparing 5-(2-(4-1,2-benzisothiazol-3-yl)piperazinyl)ethyl)-6-chloro-1,3-dihydro-2H-indol-2-one (Ziprasidone) monohydrochloride-hydrate or a pharmaceutically acceptable acid addition salt thereof.

Abstract: A multipacket interface is easily adaptable to any of several link layer interfaces via a simple adaptation layer which can be provided on an ASIC or FPGA. The interface according to the invention includes (in both transmit and receive directions) a multi-bit data signal, a multi-bit channel identifier, a packet abort/error signal, a start-of-frame signal, an end-of-frame signal, a data valid signal, and an interface clock. In the transmit direction, the interface also includes a data request signal and a multi-bit PDU length indicator signal. In the receive direction the interface also includes a server signal failure signal.

Abstract: Time multiplexed processing of multiple SONET signals uses the same shared circuitry for framing, descrambling, maintenance signal processing, control byte processing and extraction, pointer tracking, retiming, and alarm indication. The signals are deserialized and multiplexed onto a byte-wide bus from which they are processed in a shared pipeline. Additional pipelines allow scaling up to higher capacity SONET signals. Each pipeline is provided with means for communicating with the other pipelines so that information derived from the processing of one stream can be shared with the processing of other streams when necessary. According to the presently preferred embodiment, bytes pass through the pipeline in five clock cycles.

Abstract: An process for the preparation of pyridine and/or picolines is disclosed. The process comprises contacting a mixture of carbonyl compound with ammonia in the presence of surface-passivated titanium-silicate catalyst in gas phase at a temperature ranging between 300-500° C., at gas space velocity in the range of 300 to 3000 h?1 and at a pressure ranging between 1 to 10 atmosphere, condensing and separating the products by conventional methods and if desired, further purifying the product using well known conventional methods.

Abstract: The present invention relates to a single step new catalytic process for the production of pyridine and picolines from a mixture of carbonyl compound and ammonia in the presence of zeolite catalyst with MFI topology containing Si and Zr and/or Sn as zeolite constituents in gas phase. The catalyst is preferably loaded with other metal ions such as lead, nickel, thallium or their mixture for increased yield. Present invention provides the novel use of above mentioned zeolite catalysts for the production of picolines for the first time, with improved yield of desired products picolines.