Patents by Inventor Kumaran Manikantan Nair
Kumaran Manikantan Nair has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9307649Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.Type: GrantFiled: April 21, 2014Date of Patent: April 5, 2016Assignee: E I DU PONT DE NEMOURS AND COMPANYInventors: Kumaran Manikantan Nair, Scott E Gordon, Mark Frederick McCombs
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Publication number: 20140224530Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.Type: ApplicationFiled: April 21, 2014Publication date: August 14, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KUMARAN MANIKANTAN NAIR, Scott E. GORDON, Mark Frederick MCCOMBS
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Publication number: 20140186521Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.Type: ApplicationFiled: December 9, 2013Publication date: July 3, 2014Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KUMARAN MANIKANTAN NAIR, Michael A. Skurski, John D. Voultos
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Patent number: 8742262Abstract: Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 ?m. Also disclosed is a process for making the LTCC structure.Type: GrantFiled: May 30, 2012Date of Patent: June 3, 2014Assignee: E I du Pont de Nemours and CompanyInventors: Scott E. Gordon, Elizabeth D. Hughes, Joao Carlos Malerbi, Deepukumar M. Nair, Kumaran Manikantan Nair, James M. Parisi, Michael Arnett Smith, Ken E. Souders
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Patent number: 8704105Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.Type: GrantFiled: December 29, 2010Date of Patent: April 22, 2014Assignee: E I du Pont de Nemours and CompanyInventors: Kumaran Manikantan Nair, Scott E Gordon, Mark Frederick McCombs
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Patent number: 8633858Abstract: The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.Type: GrantFiled: January 27, 2011Date of Patent: January 21, 2014Assignee: E I du Pont de Nemours and CompanyInventors: Deepukumar M. Nair, Kumaran Manikantan Nair, Mark Frederick McCombs, Joao Carlos Malerbi, James M. Parisi
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Patent number: 8609256Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal, with a defined silver paste composition for manufacture.Type: GrantFiled: October 1, 2009Date of Patent: December 17, 2013Assignee: E I du Pont de Nemours and CompanyInventors: Kumaran Manikantan Nair, Michael A. Skurski, John D. Voultos
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Publication number: 20130052433Abstract: Novel compositions for LTCC green tapes having low K values and low shrinkage and composite laminates of ten to twenty layers or more of green tapes together with conventional LTCC green tapes.Type: ApplicationFiled: August 28, 2012Publication date: February 28, 2013Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KUMARAN MANIKANTAN NAIR, MARK FREDERICK MCCOMBS, STEPHEN C. BEERS
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Publication number: 20120305296Abstract: Disclosed herein is a multilayer low temperature co-fired ceramic (LTCC) structure comprising a multilayer low temperature co-fired ceramic comprising glass-ceramic dielectric layers with screen printed thick film inner conductors on portions of the layers and with thin film outer conductors deposited on the upper and lower outer surfaces of the LTCC. At least a portion of the thin film outer conductors is patterned in the form of lines and the spacings between the lines are less then 50 ?m. Also disclosed is a process for making the LTCC structure.Type: ApplicationFiled: May 30, 2012Publication date: December 6, 2012Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: SCOTT E. GORDON, ELIZABETH D. HUGHES, JOAO CARLOS MALERBI, DEEPUKUMAR M. NAIR, KUMARAN MANIKANTAN NAIR, JAMES M. PARISI, MICHAEL ARNETT SMITH, KEN E. SOUDERS
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Publication number: 20120308717Abstract: Described are LTCC devices, with external silver containing electrical contacts, that are sequentially plated with a nickel containing metal and a gold containing metal.Type: ApplicationFiled: June 6, 2012Publication date: December 6, 2012Applicant: E I DU PONT DE NEMOURS AND COMPANYInventors: KUMARAN MANIKANTAN NAIR, Michael A. Skurski, John D. Voultos
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Publication number: 20120201009Abstract: The invention relates to the use of and method of forming Low Temperature Cofired Ceramic (LTCC) circuits for high frequency applications. Furthermore, the invention relates to the novel LTCC thick film compositions and the structure itself.Type: ApplicationFiled: December 30, 2011Publication date: August 9, 2012Applicant: E. I. DU PONT DE NEMOURS AND COMPANYInventors: Kenneth Warren Hang, Kumaran Manikantan Nair, Mark Frederick McCombs, Timothy Paul Mobley
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Publication number: 20110187602Abstract: The invention relates to methods of forming high frequency receivers, transmitters and transceivers from Low Temperature Co-fired Ceramic (LTCC) materials. Two or more layers of a low k thick film dielectric tape and in contact with each other and two or more layers of a low k thick film dielectric tape and in contact with each other form a low k high k LTCC structure with improved properties and the ability to support economical mass production techniques for high frequency transceivers. The invention also relates to the LTCC receiving, transmitting and transceiving structures and the devices made from such structures.Type: ApplicationFiled: January 27, 2011Publication date: August 4, 2011Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Deepukumar M. Nair, Kumaran Manikantan Nair, Mark Frederick McCombs, Joao Carlos Malerbi, James M. Parisi
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Publication number: 20110155431Abstract: A composition for forming transition vias and transition line conductors is disclosed for minimizing interface effects at electrical connections between dissimilar metal compositions. The composition has (a) inorganic components selected from the group consisting of (i) 20-45 wt % gold and 80-55 wt % silver and (ii) 100 wt % silver-gold solid solution alloys, and (b) an organic medium. The composition may also contain (c) 1-5 wt %, based upon the weight of the composition, of oxides or mixed oxides of metals selected from the group consisting of Cu, Co, Mg and Al and/or high viscosity glasses mainly containing refractory oxides. The composition may be used as a multi-layer composition in a via fill. Multi-layer circuits such as LTCC circuits and devices may also be formed using the composition for forming transition vias and transition line conductors.Type: ApplicationFiled: December 29, 2010Publication date: June 30, 2011Applicant: E.I. DU PONT DE NEMOURS AND COMPANYInventors: Kumaran Manikantan Nair, Scott E. Gordon, Mark Frederick McCombs
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Patent number: 7722732Abstract: The present invention is directed to the use of a thick film paste composition comprising, in weight percent total paste composition, materials selected from mixtures of lead iron tungstate niobate solid solutions 30 to 80%, calcined mixtures of barium titanate, lead oxide and fused silica 20 to 70%, barium titanate 30 to 50%, calcined mixtures of barium titanate 30 to 50%, barium titanate and calcined mixtures of barium titanate 30 to 50%, lead oxide and fused silica 50-80%, and a lead germanate glass 3-20%, as a thick film paste via fill composition for use in the formation of multilayer low temperature cofired ceramic circuits.Type: GrantFiled: June 12, 2006Date of Patent: May 25, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Christopher R. Needes, Mark Frederick McCombs, Kumaran Manikantan Nair
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Patent number: 7687417Abstract: A glass composition consisting essentially of, based on mole percent, 46-56% B2O3, 0.5-8.5% P2O5, SiO2 and mixtures thereof, 20-50% CaO, 2-15% Ln2O3 where Ln is selected from the group consisting of rare earth elements and mixtures thereof; 0-6% M?2O where M? is selected from the group consisting of alkali elements; and 0-10% Al2O3, with the proviso that the composition is water millable.Type: GrantFiled: October 5, 2006Date of Patent: March 30, 2010Assignee: E.I. du Pont de Nemours and CompanyInventors: Kenneth Warren Hang, Kumaran Manikantan Nair, Mark Frederick McCombs
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Patent number: 7666328Abstract: The invention relates to thick film conductor compositions which are useful in application to both via-fill and/or line conductors to manufacture of Low Temperature Co-fireable Ceramic (LTCC) devices and other Multilayer Interconnect (MLI) ceramic composite circuits such as Photosensitive Tape On Substrates (PTOS); gold, silver and mixed metal multilayer circuits and devices. The invention is useful for forming microwave and other high frequency circuit components selected from the group comprising: antenna, filters, baluns, beam former, I/O's, couplers, via feedthroughs, EM coupled feedthroughs, wirebond connection, and transmission lines.Type: GrantFiled: November 16, 2006Date of Patent: February 23, 2010Assignee: E. I. du Pont de Nemours and CompanyInventors: Kumaran Manikantan Nair, Mark Frederick McCombs
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Patent number: 7611645Abstract: The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions. The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).Type: GrantFiled: April 5, 2006Date of Patent: November 3, 2009Assignee: E. I. du Pont de Nemours and CompanyInventors: Kumaran Manikantan Nair, Mark Frederick McCombs
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Publication number: 20090110939Abstract: A glass composition consisting essentially of, based on mole percent, 46-56% B2O3, 0.5-8.5% P2O5, SiO2 and mixtures thereof, 20-50% CaO, 2-15% Ln2O3 where Ln is selected from the group consisting of rare earth elements and mixtures thereof; 0-6% M?2O where M? is selected from the group consisting of alkali elements; and 0-10% Al2O3, with the proviso that the composition is water millable.Type: ApplicationFiled: December 31, 2008Publication date: April 30, 2009Inventors: Kenneth Warren Hang, Kumaran Manikantan Nair, Mark Frederick McCombs
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Publication number: 20070235694Abstract: The present invention is directed to a thick film composition for use in low temperature co-fired ceramic circuits comprising, based on weight percent total thick film composition: (a) 30-98 weight percent finely divided particles selected from noble metals, alloys of noble metals and mixtures thereof; (b) one or more selected inorganic binders and/or mixtures thereof, and dispersed in (c) organic medium, and wherein said glass compositions are immiscible or partially miscible with remnant glasses present in the low temperature co-fired ceramic substrate glasses at the firing conditions. The present invention is further directed to methods of forming multilayer circuits utilizing the above composition and the use of the composition in high frequency applications (including microwave applications).Type: ApplicationFiled: April 5, 2006Publication date: October 11, 2007Inventors: Kumaran Manikantan Nair, Mark Frederick McCombs