Patents by Inventor Kumaravelu Ganesan

Kumaravelu Ganesan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220127720
    Abstract: Disclosed is a method of forming a conductive diamond layer on a surface of a carbon fibre substrate that is used as a component of an electrode for neural stimulation and/or electrochemical sensing. The method comprises functionalising at least a portion of the surface with a functionalising agent to facilitate coating the surface with the conductive diamond layer. The method also comprises providing a diamond precursor and depositing the diamond precursor over the functionalising agent to form the conductive diamond layer. The disclosure also relates to an electrode that is used as a component of an electrode for neural stimulation and/or electrochemical sensing.
    Type: Application
    Filed: February 11, 2020
    Publication date: April 28, 2022
    Inventors: Maryam Alsadat Hejazi, David John Garrett, Alastair Douglas Stacey, Nicholas Vincent Apollo, Kumaravelu Ganesan, Matias Ismael Maturana, Steven Prawer, Wei Tong, Melanie Elisabeth Maria Stamp, Michael Ibbotson
  • Patent number: 10543372
    Abstract: The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: January 28, 2020
    Assignees: The University of Melbourne, National ICT Australia Limtied
    Inventors: Steven Prawer, Kumaravelu Ganesan, David Garrett, Nicholas Apollo, Alastair Stacey, Mathilde Escudie, Hamish Meffin, Samantha Lichter
  • Patent number: 10119201
    Abstract: The present disclosure provides a method of fabricating a diamond membrane. The method comprises providing a substrate and a support structure. The substrate comprises a diamond material having a first surface and the substrate further comprises a sub-surface layer that is positioned below the first surface and has a crystallographic structure that is different to that of the diamond material. The sub-surface layer is positioned to divide the diamond material into first and second regions wherein the first region is positioned between the first surface and the sub-surface layer. The support structure also comprises a diamond material and is connected to, and covers a portion of, the first surface of the substrate. The method further comprises selectively removing the second region of the diamond material from the substrate by etching away at least a portion of the sub-surface layer of the substrate.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: November 6, 2018
    Assignee: The University of Melbourne
    Inventors: Afaq Habib Piracha, Steven Prawer, Kumaravelu Ganesan, Snjezana Tomljenovic-Hanic, Desmond Lau
  • Patent number: 9867286
    Abstract: A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
    Type: Grant
    Filed: June 25, 2014
    Date of Patent: January 9, 2018
    Assignees: National ICT Australia Limited, The University of Melbourne
    Inventors: Samantha Lichter, Nicholas Apollo, David Garrett, Kumaravelu Ganesan, Hamish Meffin, Steven Prawer
  • Publication number: 20170312528
    Abstract: The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively.
    Type: Application
    Filed: October 28, 2015
    Publication date: November 2, 2017
    Inventors: Steven Prawer, Kumaravelu Ganesan, David Garrett, Nicholas Apollo, Alastair Stacey, Mathilde Escudie, Hamish Meffin, Samantha Lichter
  • Publication number: 20170233891
    Abstract: The present disclosure provides a method of fabricating a diamond membrane. The method comprises providing a substrate and a support structure. The substrate comprises a diamond material having a first surface and the substrate further comprises a sub-surface layer that is positioned below the first surface and has a crystallographic structure that is different to that of the diamond material. The sub-surface layer is positioned to divide the diamond material into first and second regions wherein the first region is positioned between the first surface and the sub-surface layer. The support structure also comprises a diamond material and is connected to, and covers a portion of, the first surface of the substrate. The method further comprises selectively removing the second region of the diamond material from the substrate by etching away at least a portion of the sub-surface layer of the substrate.
    Type: Application
    Filed: October 15, 2015
    Publication date: August 17, 2017
    Applicant: The University of Melbourne
    Inventors: Afaq Habib Piracha, Steven Prawer, Kumaravelu Ganesan, Snjezana Tomljenovic-Hanic, Desmond Lau
  • Patent number: 9381341
    Abstract: The present disclosure provides an electrode and an feedthrough for an implantable medical device. In one embodiment, the implantable electrode and the implantable feedthrough both comprise electrically insulating diamond material and electrically conductive diamond material that form an interface. Further, the present disclosure provides method for fabricating the implantable electrode and the feedthrough.
    Type: Grant
    Filed: December 3, 2013
    Date of Patent: July 5, 2016
    Assignees: The University of Melbourne, National ICT Australia Limited
    Inventors: Hamish Meffin, Kate Fox, David Garrett, Kumaravelu Ganesan, Steven Prawer, Samantha Lichter, Igor Aharonovich
  • Publication number: 20160157342
    Abstract: A circuit board is described. The circuit board comprises an electrically insulating diamond material having a surface. The electrically insulating diamond material has at least one recess extending into only a portion of a thickness of the electrically insulating diamond material from the surface of the electrically insulating diamond material. The circuit board also comprises an electrically conductive material located at least partially within the recess.
    Type: Application
    Filed: June 25, 2014
    Publication date: June 2, 2016
    Inventors: Samantha Lichter, Nicholas Apollo, David Garrett, Kumaravelu Ganesan, Hamish Meffin, Steven Prawer
  • Publication number: 20150245946
    Abstract: A method of positioning an intraocular device at an intraocular position is provided. The method comprises providing a first and a second element selected such that a magnetic force attracts the first element and the second element to each other. The method also comprises positioning the first element in a suprachoroidal space of an eye and positioning the intraocular device in an intraocular space at a portion of tissue of the eye. The method further comprises positioning the second element in the intraocular space of the eye. The first element, the second element and the intraocular device are positioned such that the portion of the tissue of the eye and at least a portion of the intraocular device are positioned between the first and second elements such that the magnetic force at least contributes to securing the intraocular device at the portion of the tissue of the eye.
    Type: Application
    Filed: May 15, 2015
    Publication date: September 3, 2015
    Inventors: Kate Fox, David Garrett, Kumaravelu Ganesan, Hamish Meffin, Steven Prawer
  • Publication number: 20140094885
    Abstract: The present disclosure provides an electrode and an feedthrough for an implantable medical device. In one embodiment, the implantable electrode and the implantable feedthrough both comprise electrically insulating diamond material and electrically conductive diamond material that form an interface. Further, the present disclosure provides method for fabricating the implantable electrode and the feedthrough.
    Type: Application
    Filed: December 3, 2013
    Publication date: April 3, 2014
    Applicants: National ICT Australia Limited, The University of Melbourne
    Inventors: Hamish Meffin, Kate Fox, David Garrett, Kumaravelu Ganesan, Steven Prawer, Samantha Lichter, Igor Aharonovich