Patents by Inventor Kumiko Doi

Kumiko Doi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9790344
    Abstract: Provided are a polybutylene terephthalate resin composition which is excellent in mold releasability and which can suppress deterioration in molding stability and aggregation of the polybutylene terephthalate resin composition due to blooming of a mold release agent; and a pellet thereof. The polybutylene terephthalate resin composition contains 0.01 to 5.0 parts by mass of (B) a saturated fatty acid ester of a polyglycerol represented by formula (I) described below with respect to 100 parts by mass of (A) a polybutylene terephthalate resin. In formula (I), R1s each may be the same or different and are C19-30 saturated aliphatic acyl groups, and n is an integer from 1 to 10.
    Type: Grant
    Filed: November 28, 2011
    Date of Patent: October 17, 2017
    Assignee: WinTech Polymer Ltd.
    Inventor: Kumiko Doi
  • Patent number: 8906988
    Abstract: Provided is an integrated molded product in which a molded resin product containing a phosphorus compound is used and an addition-reactive silicone adhesive agent is used to achieve strong bonding. The integrated molded product comprises a thermoplastic resin molded product made of a thermoplastic resin composition comprising a polybutylene terephthalate resin and a phosphorus compound, the content of the phosphorus compound being 0.5% by mass or less; an addition-reactive silicone composition; and a member; and the thermoplastic resin molded product and the addition-reactive silicone composition are brought into contact with each other. The phosphorus compound to be used is preferably a trivalent phosphorous compound.
    Type: Grant
    Filed: October 28, 2011
    Date of Patent: December 9, 2014
    Assignee: Wintech Polymer Ltd.
    Inventors: Kumiko Doi, Kouichi Sakata
  • Publication number: 20140205785
    Abstract: Provided is an injection-molded article with excellent external appearance, low warping, heat resistance, and durability to heating and cooling. An injection-molded article for which (1) deflection temperature under load according to ISO 75-1 is 165-220° C., (2) surface gloss at 45° by the JIS Z8741 testing method is 95-110, (3) the flatness of flat plates of 120 mm length, 120 mm width and 2 mm thickness with JIS B0021 is 0-2 mm, (4) after tensile property evaluation test pieces molded according to ISO 3167 were heat-treated for ten days in a 150° C. hot air oven and then treated for 24 hours at 23° C. and 50% RH, stretch at break measured according to ISO 524-1, 2 is 1.5% or more.
    Type: Application
    Filed: August 16, 2012
    Publication date: July 24, 2014
    Applicant: WINTECH POLYMER LTD.
    Inventors: Kazuya Goshima, Kazuhito Kobayashi, Kumiko Doi
  • Publication number: 20130324649
    Abstract: Provided is an integrated molded product in which a molded resin product containing a phosphorus compound is used and an addition-reactive silicone adhesive agent is used to achieve strong bonding. The integrated molded product comprises a thermoplastic resin molded product made of a thermoplastic resin composition comprising a polybutylene terephthalate resin and a phosphorus compound, the content of the phosphorus compound being 0.5% by mass or less; an addition-reactive silicone composition; and a member; and the thermoplastic resin molded product and the addition-reactive silicone composition are brought into contact with each other. The phosphorus compound to be used is preferably a trivalent phosphorous compound.
    Type: Application
    Filed: October 28, 2011
    Publication date: December 5, 2013
    Applicant: Win Tech Polymer Ltd.
    Inventors: Kumiko Doi, Kouichi Sakata
  • Publication number: 20130309500
    Abstract: Provided are a polybutylene terephthalate resin composition which is excellent in mold releasability and which can suppress deterioration in molding stability and aggregation of the polybutylene terephthalate resin composition due to blooming of a mold release agent; and a pellet thereof. The polybutylene terephthalate resin composition contains 0.01 to 5.0 parts by mass of (B) a saturated fatty acid ester of a polyglycerol represented by formula (I) described below with respect to 100 parts by mass of (A) a polybutylene terephthalate resin. In formula (I), R1s each may be the same or different and are C19-30 saturated aliphatic acyl groups, and n is an integer from 1 to 10.
    Type: Application
    Filed: December 13, 2011
    Publication date: November 21, 2013
    Applicant: WIN TECH POLYMER LTD.
    Inventor: Kumiko Doi