Abstract: An OCT imaging technique capable of suppressing image noise due to reflection on a wall surface of a carrier for carrying an imaging object by a simple configuration is provided. A light regulating member 28 having a transmission pattern where the high transmission parts P1 and the low transmission parts P2 are alternately arranged is placed on a side opposite to the spheroid Sp (imaging object) across the objective lens 27. The transmission pattern is rotationally symmetric with respect to an optical axis AX of the objective lens 27 and a point located at a position point-symmetric with an arbitrary point in the high transmission part with respect to a point where the optical axis of the objective lens intersects with the light regulating surface is included in the low transmission part.

Abstract: An OCT imaging technique capable of suppressing image noise due to reflection on a wall surface of a carrier for carrying an imaging object by a simple configuration is provided. A light regulating member 28 having a transmission pattern where the high transmission parts P1 and the low transmission parts P2 are alternately arranged is placed on a side opposite to the spheroid Sp (imaging object) across the objective lens 27. The transmission pattern is rotationally symmetric with respect to an optical axis AX of the objective lens 27 and a point located at a position point-symmetric with an arbitrary point in the high transmission part with respect to a point where the optical axis of the objective lens intersects with the light regulating surface is included in the low transmission part.

Abstract: In a spectroscopic ellipsometer, light emitted from a light source enters a measurement surface of a substrate through an optical system in a lighting part so as to incline to the measurement surface to be directed to a light receiving device, and ellipsometry is performed based on spectral intensity of reflected light reflected on the measurement surface, the spectral intensity being acquired by the light receiving device. In focusing of the spectroscopic ellipsometer, a focus position of the measurement surface is obtained based on a total light amount in a predetermined wavelength band of the reflected light, the total light amount being obtained by the light receiving device. In the spectroscopic ellipsometer, since the optical system for ellipsometry and the optical system for focusing are common, it is possible to eliminate influences of change of the optical systems by temperature change or the like and to achieve high accurate focusing.

Abstract: A spectroscopic ellipsometer has a polarized light generating part for generating elliptically polarized lights of a plurality of wavelengths included in a predetermined measurement wavelength band from white light and directing the elliptically polarized lights to a measurement surface of a substrate, a rotating analyzer where reflected light reflected on the measurement surface enters, and a spectrometer for acquiring spectral intensity of light from the rotating analyzer. A polarization state acquiring part in a control part acquires a polarization state at each wavelength in the measurement wavelength band of the reflected light.

Abstract: In an apparatus for detecting a position of a substrate in a film thickness measuring apparatus, an image pickup area on a substrate by an image pickup device of an imaging part is rotated by a rotation mechanism of a position detecting part. With this operation, an image of an edge of the substrate can be easily picked up at a plurality of image pickup positions around a central axis to detect a position of the substrate, without providing a mechanism for rotating a stage holding the substrate. As a result, it is possible to suppress upsizing of a structure for detecting a position of the substrate in the film thickness measuring apparatus and to achieve high-speed and high precision-position detection of the substrate, as compared with a conventional apparatus where a mechanism for rotating a substrate is provided above a mechanism for moving the substrate in a horizontal direction.

Abstract: A spectroscopic ellipsometer has a polarized light generating part for generating elliptically polarized lights of a plurality of wavelengths included in a predetermined measurement wavelength band from white light and directing the elliptically polarized lights to a measurement surface of a substrate, a rotating analyzer where reflected light reflected on the measurement surface enters, and a spectrometer for acquiring spectral intensity of light from the rotating analyzer. A polarization state acquiring part in a control part acquires a polarization state at each wavelength in the measurement wavelength band of the reflected light.

Abstract: In a spectroscopic ellipsometer, light emitted from a light source enters a measurement surface of a substrate through an optical system in a lighting part so as to incline to the measurement surface to be directed to a light receiving device, and ellipsometry is performed based on spectral intensity of reflected light reflected on the measurement surface, the spectral intensity being acquired by the light receiving device. In focusing of the spectroscopic ellipsometer, a focus position of the measurement surface is obtained based on a total light amount in a predetermined wavelength band of the reflected light, the total light amount being obtained by the light receiving device. In the spectroscopic ellipsometer, since the optical system for ellipsometry and the optical system for focusing are common, it is possible to eliminate influences of change of the optical systems by temperature change or the like and to achieve high accurate focusing.

Abstract: In an apparatus for detecting a position of a substrate in a film thickness measuring apparatus, an image pickup area on a substrate by an image pickup device of an imaging part is rotated by a rotation mechanism of a position detecting part. With this operation, an image of an edge of the substrate can be easily picked up at a plurality of image pickup positions around a central axis to detect a position of the substrate, without providing a mechanism for rotating a stage holding the substrate. As a result, it is possible to suppress upsizing of a structure for detecting a position of the substrate in the film thickness measuring apparatus and to achieve high-speed and high precision-position detection of the substrate, as compared with a conventional apparatus where a mechanism for rotating a substrate is provided above a mechanism for moving the substrate in a horizontal direction.