Patents by Inventor Kumiko Karouji

Kumiko Karouji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10840166
    Abstract: According to one embodiment, a semiconductor device includes a first semiconductor chip, a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip, and a sealing resin sealing the first semiconductor chip and the heat dissipation member. The heat dissipation member includes mutually interlaced metal fibers and a thermosetting resin.
    Type: Grant
    Filed: September 12, 2018
    Date of Patent: November 17, 2020
    Assignees: Kabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
    Inventors: Kumiko Karouji, Morihiko Ikemizu, Yoshihisa Imori, Hiroaki Kishi, Tomohiko Imada, Akito Shimizu
  • SEMICONDUCTOR DEVICE
    Publication number: 20190295923
    Abstract: According to one embodiment, a semiconductor device includes a first semiconductor chip, a heat dissipation member provided on one surface of the first semiconductor chip and connected to the first semiconductor chip, and a sealing resin sealing the first semiconductor chip and the heat dissipation member. The heat dissipation member includes mutually interlaced metal fibers and a thermosetting resin.
    Type: Application
    Filed: September 12, 2018
    Publication date: September 26, 2019
    Inventors: Kumiko Karouji, Morihiko Ikemizu, Yoshihisa Imori, Hiroaki Kishi, Tomohiko Imada, Akito Shimizu