Patents by Inventor Kumiko Kawada

Kumiko Kawada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for production of fluorine-containing polyimide film
    Patent number: 7364771
    Abstract: A method for producing a fluorine-containing polyimide film excelling in heat resistance, resistance to chemicals, water repellency, dielectric properties, electrical properties, and optical properties and a spin coater suitable for the method are to be provided. A method for the production of a fluorine-containing polyimide film which comprises forming a coating film of a fluorine-containing polyimide precursor in an atmosphere having a relative humidity thereof adjusted to a level of not more than 50 RH % and then subjecting the fluorine-containing polyimide precursor to heat treatment thereby forming a fluorine-containing polyimide film is provided. By adjusting the relative humidity in accordance with this method, the fluorine-containing polyimide precursor can be prevented from being decomposed by the absorption of moisture and consequently prevent effectively the fluorine-containing polyimide film from forming piriform spots and scratches.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: April 29, 2008
    Assignee: Nippon Shokubai Co., Ltd.
    Inventors: Kozo Tajiri, Shinichi Goto, Yoshinobu Asako, Kumiko Kawada
  • Method and apparatus for production of fluorine-containing polyimide film
    Publication number: 20040234686
    Abstract: A method for producing a fluorine-containing polyimide film excelling in heat resistance, resistance to chemicals, water repellency, dielectric properties, electrical properties, and optical properties and a spin coater suitable for the method are to be provided. A method for the production of a fluorine-containing polyimide film which comprises forming a coating film of a fluorine-containing polyimide precursor in an atmosphere having a relative humidity thereof adjusted to a level of not more than 50 RH % and then subjecting the fluorine-containing polyimide precursor to heat treatment thereby forming a fluorine-containing polyimide film is provided. By adjusting the relative humidity in accordance with this method, the fluorine-containing polyimide precursor can be prevented from being decomposed by the absorption of moisture and consequently prevent effectively the fluorine-containing polyimide film from forming piriform spots and scratches.
    Type: Application
    Filed: March 5, 2004
    Publication date: November 25, 2004
    Inventors: Kozo Tajiri, Shinichi Goto, Yoshinobu Asako, Kumiko Kawada