Abstract: A cover (5) of an electronic device has side walls (8) and a ceiling wall (9), and is molded by injection molding using a mold. The ceiling wall (9) has a flat plate shape. Disk-shaped thick portions (21) that locally protrude inward so as to be relatively thicker than an adjacent normal portion of the ceiling wall (9) are provided at a plurality of positions of the ceiling wall (9) corresponding to respective positions of ejection by ejection pins (25). Although a circular dent (22) is formed at a middle of the thick portion (21) due to the thick portion (21) being pressed by a tip of the ejection pin (25), even at this dent (22) portion, a thickness equal to or greater than that of the normal portion of the ceiling wall (9) is secured.

Abstract: A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).

Abstract: An electronic device and an electronic device manufacturing method according to the present invention include, as a mode thereof, a substrate on which an element that produces heat, which is rectangular, is mounted, a radiator member disposed at a position facing the element that produces heat, and a heat conductive material filling a gap between the element that produces heat and the radiator member. The radiator member includes a rectangular frame that surrounds an arrangement region of the heat conductive material in a position of a surface facing the element that produces heat outside a peripheral edge of the element that produces heat, and has a cutout in at least one of four corners of the frame. With this configuration, when assembling the substrate onto the radiator member, excess heat conductive material flows out of the frame from the cutout.

Abstract: A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).

Abstract: A caulking pin (15) is inserted into a mounting hole (21) provided in a metal case body (3), and the end portion of the caulking pin (15) is thermally caulked with a welding tip (24) to form a mold forming portion (17). A surplus absorption recess (31) is formed by enlarging the opening end of the mounting hole (21), and surplus resin is absorbed. The surplus absorption recess (31) is positioned inside a region of the mold forming portion (17). Therefore, the amount of molten surplus resin that protrudes outward from the welding tip (24) in the thermal caulking process is reduced.

Abstract: A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).

Abstract: A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

Abstract: A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

Abstract: A wiring board (3) has first and second rigid sections (11, 12) each having six metal leaf layers, and a flexible section (13) having two metal leaf layers that connect the both rigid sections (11, 12). A capacitor unit (34) and a filter unit 31, which supplies power to an inverter, are mounted on the first rigid section (11), and a CPU (21) and a pre-driver circuit element (22) are mounted on the second rigid section (12). Mutually-independent two control systems are arranged so as to be symmetrical about a board center line (M). Detection signal lines (51) of rotation sensors (37, 38) located at the middle of the first rigid section (11) extend along the board center line (M) on the flexible section (13). Each of the two control systems is configured along a wiring direction of the detection signal lines (51).

Abstract: A heat-generating component (3) is mounted on a surface (4b), on a case (12) side, of a circuit board (4). A recessed portion (5) is formed in a position facing the heat-generating component (3), on an inner wall surface (12e) side of a bottom wall (12a) of the case (12). Between an inner wall surface (5a) of this recessed portion (5) and the heat-generating component (3), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member (6) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (4b), on the case (12) side, of the circuit board (4) and the inner wall surface (12e) of the bottom wall (12a) of the case (12) on a peripheral edge side of the recessed portion (5).

Abstract: A heat-generating component (3) is mounted on a surface (4b), on a case (12) side, of a circuit board (4). A recessed portion (5) is formed in a position facing the heat-generating component (3), on an inner wall surface (12e) side of a bottom wall (12a) of the case (12). Between an inner wall surface (5a) of this recessed portion (5) and the heat-generating component (3), a predetermined-sized component clearance (Ca) is provided, and a heat radiation member (6) is interposed in a position of the component clearance (Ca). A peripheral clearance (Cb) is provided between the surface (4b), on the case (12) side, of the circuit board (4) and the inner wall surface (12e) of the bottom wall (12a) of the case (12) on a peripheral edge side of the recessed portion (5).

Abstract: An electronic device including a circuit board onto which an electronic part is installed, a radiating member, and at least one fitting member that fixes the radiating member to the circuit board, the fitting member being formed with a resilient portion that is configured to produce a resilient restoring force and holds the radiating member in a state fixed to the circuit board by the resilient restoring force.

Abstract: An electronic device including a circuit board onto which an electronic part is installed, a radiating member, and at least one fitting member that fixes the radiating member to the circuit board, the fitting member being formed with a resilient portion that is configured to produce a resilient restoring force and holds the radiating member in a state fixed to the circuit board by the resilient restoring force.