Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1), wherein a content of the compound is 10% by mass or less based on the total amount of the electrolytic solution, wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a nitrogen atom.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a sulfur atom.

Abstract: The present invention provides, as one aspect, an electrolytic solution comprising a compound represented by the following formula (1) and a compound represented by the following formula (2): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group comprising a sulfur atom and not comprising a nitrogen atom; and wherein R6 to R8 each independently represent an alkyl group or a fluorine atom, R9 represents an alkylene group, and R10 represents an organic group comprising a nitrogen atom and not comprising a sulfur atom.

Abstract: Disclosed is a wiring substrate 1 including a stretchable resin layer 3 and a conductor foil or conductor plating film 5 which is provided on the stretchable resin layer 3 and forms a wiring pattern.

Abstract: Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1), wherein a content of the compound is 10% by mass or less based on the total amount of the electrolytic solution, wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a nitrogen atom.

Abstract: Disclosed is a stretchable member with a metal foil including a stretchable resin base material, and a conductive metal foil provided on the stretchable resin base material. A surface of the metal foil on the stretchable resin base material side is a roughened surface having surface roughness Ra of 0.1 ?m to 3 ?m.

Abstract: One aspect of the present invention provides an electrolytic solution comprising a compound represented by the following formula (1): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group containing a sulfur atom.

Abstract: The present invention provides, as one aspect, an electrolytic solution comprising a compound represented by the following formula (1) and a compound represented by the following formula (2): wherein R1 to R3 each independently represent an alkyl group or a fluorine atom, R4 represents an alkylene group, and R5 represents an organic group comprising a sulfur atom and not comprising a nitrogen atom; and wherein R6 to R8 each independently represent an alkyl group or a fluorine atom, R9 represents an alkylene group, and R10 represents an organic group comprising a nitrogen atom and not comprising a sulfur atom.

Abstract: Disclosed is a wiring substrate 1 including a stretchable resin layer 3 and a conductor foil or conductor plating film 5 which is provided on the stretchable resin layer 3 and forms a wiring pattern.

Abstract: The present invention provides a buffer sheet composition including a thermosetting compound, which buffer sheet composition is used for producing a buffer sheet to be interposed between a heating member and an electronic component, when the electronic component is heated by the heating member so as to mount the electronic component on a substrate, as well as a buffer sheet including a thermosetting composition layer obtained by forming the buffer sheet composition into the form of a sheet.