Patents by Inventor Kun-An CHIU

Kun-An CHIU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9347149
    Abstract: A method for growing epitaxial diamond is provided here. A metallic layer is deposited on a diamond substrate and is followed by an epitaxial diamond film deposited on top of the metallic layer. As a buffer layer, the metallic layer relieves stress accumulated in the thin film of the epitaxial diamond to prevent cracks. In consequence, diamond epitaxial layers with desired thickness and good quality can be obtained.
    Type: Grant
    Filed: July 12, 2013
    Date of Patent: May 24, 2016
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Li Chang, Ping-Hsun Wu, Kun-An Chiu
  • Publication number: 20140137795
    Abstract: A method for growing epitaxial diamond is provided here. A metallic layer is deposited on a diamond substrate and is followed by an epitaxial diamond film deposited on top of the metallic layer. As a buffer layer, the metallic layer relieves stress accumulated in the thin film of the epitaxial diamond to prevent cracks. In consequence, diamond epitaxial layers with desired thickness and good quality can be obtained.
    Type: Application
    Filed: July 12, 2013
    Publication date: May 22, 2014
    Inventors: Li CHANG, Ping-Hsun WU, Kun-An CHIU