Patents by Inventor Kun-Chan Yen

Kun-Chan Yen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220301747
    Abstract: A high-power resistor includes a substrate, a resistor layer, two edge electrodes, and a seed layer. The substrate has a first surface. The resistor layer is mounted on the first surface of the substrate. The two edge electrodes are mounted on the resistor layer. The seed layer is mounted between the resistor layer and the two edge electrodes. A contacting surface between one of the two edge electrodes and the resistor layer is bigger than contacting side surfaces of a printed resistor layer and printed conduction layers from a conventional chip resistor, creating less electrical resistance. When high-power electricity passes through the resistor layer, heat generated by a large passing current can be equally dissipated in all directions on the contact surface. With less electrical resistance and better heat dissipation, the contacting surface enables the high-power resistor to tolerate greater electric power.
    Type: Application
    Filed: November 30, 2021
    Publication date: September 22, 2022
    Inventors: Jui-Hsiang Chen, Kuei-Fang Huang, I-Hung Chiang, Kun-Chan Yen