Patents by Inventor Kun Chang

Kun Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250108458
    Abstract: An ingot splitting method and an ingot splitting apparatus are provided. The ingot splitting method includes the following steps. A laser provided from a laser source is focused with a focusing lens group on a plane to be split of an ingot, and a focus point of the laser is used to scan the plane to be split. An opposing first side and second side of the ingot are fixed with a chuck table and an ultrasonic source. The plane to be split is located between the first side and the second side. A pulling force is applied to the second side in a direction away from the ingot with a tensioner, and ultrasonic waves are applied to vibrate the ingot with the ultrasonic source simultaneously, so that the ingot is divided into two parts from the plane to be split.
    Type: Application
    Filed: September 9, 2024
    Publication date: April 3, 2025
    Applicant: Industrial Technology Research Institute
    Inventors: Kun-Wei Lin, Tung-Ying Lin, Miao-Chang Wu
  • Patent number: 12267559
    Abstract: Embodiments of the present disclosure provide a live streaming and device, where the method includes: receiving push information of a target creation sent by a server, where the push information is sent by the server based on that the server determines that play popularity of the target creation meets preset popularity; and in response to an operation of a user on the push information, entering a first page of a live streaming application (App). In the embodiment of the present disclosure, by pushing the target creation whose play popularity exceeds preset popularity to the user, to prompt the user that one target creation is becoming a hot creation, so as to guide the user to go live with the target creation as a topic.
    Type: Grant
    Filed: April 12, 2023
    Date of Patent: April 1, 2025
    Assignee: BEIJING BYTEDANCE NETWORK TECHNOLOGY CO., LTD.
    Inventors: Yingyue Zhou, Ke Zhong, Kun Chang, Qian Xue, Chen Zhang, Yineng Lu
  • Patent number: 12266684
    Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semicondcutor Manufacturing Company, Ltd.
    Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
  • Publication number: 20250103106
    Abstract: A display apparatus including a foldable touch display panel and a display driving device is provided. The foldable touch display panel includes a plurality of touch sensors. The display driving device is coupled to the foldable touch display panel. The display driving device is configured to determine a folding angle of the foldable touch display panel according to a capacitance variation of the touch sensors in a folded state, and drive the foldable touch display panel to operate in a full panel display mode or in a partial panel display mode according to the folding angle.
    Type: Application
    Filed: May 23, 2024
    Publication date: March 27, 2025
    Applicant: Novatek Microelectronics Corp.
    Inventors: Kun-Zheng Lin, Yi-Ying Lin, Chih-Chang Lai
  • Publication number: 20250096105
    Abstract: A package substrate is provided, in which dielectric layers are formed on a core board, and a wiring layer is embedded in at least one of the dielectric layers, so that the wiring layer has better copper adhesion to prevent delamination problems. A method of fabricating the package substrate is also provided.
    Type: Application
    Filed: September 16, 2024
    Publication date: March 20, 2025
    Inventors: Min-Yao CHEN, Yin-Ju CHEN, Sung-Kun LIN, Jiun-Hua CHIUE, Andrew C. CHANG, Chung-Hsier YANG, Zhen-Hu CHANG
  • Publication number: 20250087572
    Abstract: Provided is an electronic package, in which an external connection structure is formed on a first side of a circuit structure, at least one circuit assembly electrically connected to the circuit structure and at least one electronic element electrically connected to the circuit structure are disposed on a second side of the circuit structure, and the circuit assembly and the electronic element are encapsulated by a cladding layer. The coefficients of thermal expansion (CTEs) of the circuit assembly and the cladding layer are both greater than the CTE of the circuit structure, and the CTE of the circuit structure is greater than the CTE of the external connection structure, so as to prevent the difference in CTEs between the first side and the second side of the circuit structure from being significantly changed, thereby preventing the electronic package from warpage.
    Type: Application
    Filed: September 6, 2024
    Publication date: March 13, 2025
    Inventors: Yin-Ju CHEN, Min-Yao CHEN, Sung-Kun LIN, Andrew C. CHANG
  • Publication number: 20250076369
    Abstract: A minimum IC operating voltage searching method includes acquiring a corner type of an IC, acquiring ring oscillator data of the IC, generating a first prediction voltage according to the corner type and the ring oscillator data by using a training model, generating a second prediction voltage according to the ring oscillator data by using a non-linear regression approach under an N-ordered polynomial, and generating a predicted minimum IC operating voltage according to the first prediction voltage and the second prediction voltage. N is a positive integer.
    Type: Application
    Filed: April 16, 2024
    Publication date: March 6, 2025
    Applicant: MEDIATEK INC.
    Inventors: Ronald Kuo-Hua Ho, Kun-Yu Wang, Yen-Chang Shih, Sung-Te Chen, Cheng-Han Wu, Yi-Ying Liao, Chun-Ming Huang, Yen-Feng Lu, Ching-Yu Tsai, Tai-Lai Tung, Kuan-Fu Lin, Bo-Kang Lai, Yao-Syuan Lee, Tsyr-Rou Lin, Ming-Chao Tsai, Li-Hsuan Chiu
  • Publication number: 20250079571
    Abstract: A thermal management module includes a substrate, a computing unit, a heat dissipation block, and at least one piezoelectric cooling unit. The computing unit is disposed on the substrate. A heating part of the computing unit is covered by the heat dissipation block, and the heat dissipation block can absorb heat energy generated by the computing unit. The piezoelectric cooling unit includes a piezoelectric actuator module and a heat dissipation sheet. The piezoelectric actuator module is disposed on the substrate. The piezoelectric actuator module is electrically coupled to an alternating voltage, and can generate a mechanical vibration. A fixed end of the heat dissipation sheet is fixed on the piezoelectric actuator module. When the piezoelectric actuator module generates the mechanical vibration, the free end can swing and create an airflow that passes through the heat dissipation block.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventors: CHIH-KUN YANG, YU-CHUN WANG, JUI-YANG CHANG
  • Publication number: 20250079550
    Abstract: A battery device includes a battery pack and multiple piezoelectric cooling units. A fixing seat of the battery pack has multiple accommodating grooves that are adjacent to each other. A heat dissipation channel is formed between two adjacent ones of the accommodating grooves. Multiple batteries of the battery pack are respectively accommodated in the accommodating grooves. Each of the piezoelectric cooling units corresponds in position to one of the heat dissipation channels, and includes a piezoelectric actuator module and a heat dissipation sheet. The piezoelectric actuator module is electrically coupled to an alternating voltage and can generate a mechanical vibration. A fixed end of the heat dissipation sheet is fixed on the piezoelectric actuator module. When the piezoelectric actuator module generates the mechanical vibration, a free end of the heat dissipation sheet is configured to swing and create an airflow that passes through the heat dissipation channel.
    Type: Application
    Filed: August 29, 2023
    Publication date: March 6, 2025
    Inventors: CHIH-KUN YANG, YU-CHUN WANG, JUI-YANG CHANG
  • Patent number: 12240947
    Abstract: The invention discloses a flame-retardant semi-aromatic polyamide derived from the following monomers: a diacid monomer A: where A1 is terephthalic acid or terephthalic acid and other diacid, terephthalic acid accounts for 50 to 100 mol % of A1, and A2 is [(6-oxido-6H-dibenzo-(c,e)(1,2)-oxaphosphorin-6-ketone)-methyl]-butanedioic acid, A1+A2=100 mol %, A1=90 to 99 mol %, A2=1 to 10 mol %; and diamine monomer B: one or more of diamine monomers containing 4 to 36 carbon atoms. In the present invention, by an in situ polymerization, a specific flame-retardant monomer [(6-oxido-6H-dibenzo-(c,e)(1,2)-oxaphosphorin-6-ketone)-methyl]-butanedioic acid is copolymerized in a semi-aromatic polyamide chain segment, excellent mechanical properties and low water absorption can be obtained.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: March 4, 2025
    Assignee: KINGFA SCI. & TECH. CO., LTD.
    Inventors: Xianbo Huang, Huan Chang, Nanbiao Ye, Min Cao, Chuanhui Zhang, Kun Yan, Zhongquan Peng
  • Patent number: 12237024
    Abstract: A memory device and a programming method thereof are provided. The programming method includes the following steps. According to a step value, based on an incremental step pulse programming scheme, multiple programming operations are performed for a selected memory page. In a setting mode, multiple program verify operations are respectively performed corresponding to the programming operations to respectively generate multiple pass bit numbers. In the setting mode, a pass bit number difference value of two pass bit numbers corresponding to two programming operations is calculated. In the setting mode, an amount of the step value is adjusted according to the pass bit number difference value.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: February 25, 2025
    Assignee: MACRONIX International Co., Ltd.
    Inventors: Kun-Tse Lee, Han-Sung Chen, Shih-Chang Huang
  • Publication number: 20250063778
    Abstract: A method includes removing a first dummy gate stack and a second dummy gate stack to form a first trench and a second trench. The first dummy gate stack and the second dummy gate stack are in a first device region and a second device region, respectively. The method further includes depositing a first gate dielectric layer and a second gate dielectric layer extending into the first trench and the second trench, respectively, forming a fluorine-containing layer comprising a first portion over the first gate dielectric layer, and a second portion over the second gate dielectric layer, removing the second portion, performing an annealing process to diffuse fluorine in the first portion into the first gate dielectric layer, and at a time after the annealing process, forming a first work-function layer and a second work-function layer over the first gate dielectric layer and the second gate dielectric layer, respectively.
    Type: Application
    Filed: October 31, 2024
    Publication date: February 20, 2025
    Inventors: Hsin-Yi Lee, Weng Chang, Hsiang-Pi Chang, Huang-Lin Chao, Chung-Liang Cheng, Chi On Chui, Kun-Yu Lee, Tzer-Min Shen, Yen-Tien Tung, Chun-I Wu
  • Publication number: 20250056097
    Abstract: The present disclosure relates to a system and a method for stream distribution. The method includes: determining a viewer to be a helper viewer with respect to a content type; determining a distributor to have engaged in the content type in a stream; and suggesting the distributor to invite the viewer into the stream.
    Type: Application
    Filed: July 6, 2024
    Publication date: February 13, 2025
    Inventors: Wei-Kun LU, Yu-Cheng FAN, Chia-Han CHANG, Hung-Kuang TAI
  • Publication number: 20250047919
    Abstract: A method for facilitating streamer interaction with a viewer includes extracting a history topic based on an activity record of the viewer; calculating a score of each of the history topics based on at least one parameter; and generating a topic suggestion based on the history topic and the score which is corresponding to the history topic, and providing the topic suggestion to the streamer. The method is suitable for providing a topic suggestion (or interact topic suggestion) with respect to the viewer to the streamer via a live-streaming platform executed by a computing device. Thereby, the method can be used for facilitating streamer interaction with viewers and provides an appropriate topic suggestion. In addition, a computing device and a computer-readable storage medium which are capable of implementing the method are also provided.
    Type: Application
    Filed: January 24, 2024
    Publication date: February 6, 2025
    Inventors: YUNG-CHI HSU, CHI-WEI LIN, SHAO-TANG CHIEN, WEI-HSIANG HUNG, WEI-KUN LU, YU-CHENG FAN, CHIA-HAN CHANG, HUNG-KUANG TAI
  • Patent number: 12219693
    Abstract: A carrying structure is defined with a main area and a peripheral area adjacent to the main area, where a plurality of packaging substrates are disposed in the main area in an array manner, a plurality of positioning holes are disposed in the peripheral area, and a plurality of positioning traces are formed along a part of the edges of the plurality of positioning holes, such that the plurality of positioning traces are formed with notches.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: February 4, 2025
    Assignee: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chin-Wei Hsu, Jui-Kun Wang, Shu-Yu Ko, Fang-Wei Chang, Hsiu-Fang Chien
  • Patent number: 12218240
    Abstract: A method includes forming a semiconductor fin over a substrate, etching the semiconductor fin to form a recess, wherein the recess extends into the substrate, and forming a source/drain region in the recess, wherein forming the source/drain region includes epitaxially growing a first semiconductor material on sidewalls of the recess, wherein the first semiconductor material includes silicon germanium, wherein the first semiconductor material has a first germanium concentration from 10 to 40 atomic percent, epitaxially growing a second semiconductor material over the first semiconductor material, the second semiconductor material including silicon germanium, wherein the second semiconductor material has a second germanium concentration that is greater than the first germanium concentration, and epitaxially growing a third semiconductor material over the second semiconductor material, the third semiconductor material including silicon germanium, wherein the third semiconductor material has a third germanium con
    Type: Grant
    Filed: July 3, 2023
    Date of Patent: February 4, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kun-Mu Li, Heng-Wen Ting, Yen-Ru Lee, Hsueh-Chang Sung
  • Publication number: 20250033092
    Abstract: The present disclosure provides a silicon bar rinsing device comprising: a rinsing portion, wherein the rinsing portion is a cavity having a upper opening and is configured to rinse the silicon bar; an adjusting portion disposed in the rinsing portion; a compressed air pipeline disposed on a side of the rinsing portion and communicated with the rinsing portion; a reuse water pipeline disposed on an other side of the rinsing portion opposite to the compressed air pipeline and communicated with the rinsing portion; and a control unit disposed on a upper end of the rinsing portion and configured to control turning on or off of the silicon bar rinsing device.
    Type: Application
    Filed: June 29, 2023
    Publication date: January 30, 2025
    Applicant: TCL ZHONGHUAN RENEWABLE ENERGY TECHNOLOGY CO., LTD.
    Inventors: Yan SHI, Zhihui LIANG, Yiqiang GONG, Meng WANG, Xiaopeng WANG, Shusheng YANG, Yanhui ZHAO, Shun CHANG, Wei ZHAO, Kun YIN, Guangyu WANG, Xizhen LI
  • Publication number: 20250030337
    Abstract: A circuit of a resonant power converter comprising: a high-side switch and a low-side switch, coupled to form a half-bridge switching circuit which is configured to switch a transformer for generating an output voltage; a high-side drive circuit, generating a high-side drive signal coupled to drive the high-side switch in response to a high-side control signal; a bias voltage, coupled to a bootstrap diode and a bootstrap capacitor providing a power source from the bootstrap capacitor for the high-side drive circuit; wherein the high-side drive circuit generates the high-side drive signal with a fast slew rate to turn on the high-side switch when the high-side switch is to be turned on with soft-switching; the high-side drive circuit generates the high-side drive signal with a slow slew rate to turn on the high-side switch when the high-side switch is to be turned on without soft-switching.
    Type: Application
    Filed: February 6, 2024
    Publication date: January 23, 2025
    Inventors: Kun-Yu Lin, Hsin-Yi Wu, Yu-Chang Chen, Fu-Ciao Syu, Chia-Hsien Yang, Chien-Fu Tang, Ta-Yung Yang
  • Publication number: 20250022723
    Abstract: An electronic package is provided, in which a cover layer is embedded in a circuit structure to form a groove, and an electronic element is disposed on the cover layer in the groove. A cladding layer encapsulates the electronic element, and an external connection structure is disposed on the circuit structure and the cladding layer. Therefore, the electronic element is embedded in the groove, such that a thickness of the electronic package can be greatly reduced to meet the requirement of thinning.
    Type: Application
    Filed: April 19, 2024
    Publication date: January 16, 2025
    Applicant: AaltoSemi Inc.
    Inventors: Min-Yao Chen, Yin-Ju Chen, Sung-Kun Lin, Andrew C. Chang
  • Publication number: 20240410694
    Abstract: A laser level assembly includes a mounting bracket and a laser level on the mounting bracket. The mounting bracket includes a base part and a back cap. The laser level includes a laser generator, the laser level projects at least one of a horizontal line, a vertical line or a laser spot. The laser level also includes a battery pack receptacle configured to selectively receive a removable battery pack, a wireless transmitter, a circuit board in the mounting bracket, and a secondary power device on the circuit board. The removable battery pack is configured to power the at least one laser generator. The secondary power device is configured to selectively power the wireless transmitter.
    Type: Application
    Filed: June 5, 2024
    Publication date: December 12, 2024
    Applicant: Stanley Black & Decker Inc.
    Inventors: Oleksiy P. SERGYEYENKO, Thomas S. WOLF, Devansh K. JHAWAR, Michael C. SCHMITTDIEL, Kun CHANG, Dominic M. LEONE, Kenneth M. NORR, Kavya JAIN, Anthony TOPF