Patents by Inventor Kun-Che Chen

Kun-Che Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE HAVING STACKS ASIDE STACKED GATE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20240172434
    Abstract: A semiconductor device includes a stacked gate structure, a plurality of stacks and a first conductive layer. The stacks are disposed aside the stacked gate structure and arranged along both a first direction and a second direction perpendicular to the first direction, wherein the stacks are extended continuously along the first direction and segmented in the second direction. The first conductive layer is disposed between segmented portions of the stacks along the second direction, wherein top surfaces of the segmented portions of the stacks are higher than a top surface of the first conductive layer.
    Type: Application
    Filed: January 31, 2024
    Publication date: May 23, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
  • Semiconductor device having a wall structure surrounding a stacked gate structure
    Patent number: 11925017
    Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.
    Type: Grant
    Filed: January 13, 2020
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chien-Hsuan Liu, Chiang-Ming Chuang, Chih-Ming Lee, Kun-Tsang Chuang, Hung-Che Liao, Chia-Ming Pan, Hsin-Chi Chen
  • Electrical connecting structure of a tape carrier package for a LCD driver
    Patent number: 6579106
    Abstract: An electrical connecting structure of a tape carrier package for a LCD driver is provided. The present electrical connecting structure comprises a circuit board having a plurality of conductive terminals, a conductive member having a plurality of rows of conductive portions formed thereon and a tape carrier package of a LCD driver having a plurality of input/output leads. The conductive member is disposed between the circuit board and the tape carrier package. The pitch of the conductive portions is smaller than that of the conductive terminals and that of the input/output leads such that the conductive portions can electrically connect the conductive terminals to the input/output leads. The present electrical connecting structure also can be provided in a mounting structure of a LCD driver tape carrier package with a circuit board for advantageously performing failure analysis.
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: June 17, 2003
    Assignee: Winbond Electronics Corporation
    Inventors: Yi-Ming Cheng, Kun-Che Chen, Jih-Huang Huang