Patents by Inventor Kun-Che Pai
Kun-Che Pai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20220314391Abstract: A polishing pad adapted for polishing an object and having a polishing track region is provided. The polishing pad includes a polishing layer and an adhesive layer. The polishing layer has a polishing surface and a rough bottom surface opposite to each other, and the rough bottom surface includes a plurality of discontinuous dents. The adhesive layer is adhered to the rough bottom surface.Type: ApplicationFiled: March 17, 2022Publication date: October 6, 2022Applicant: IV Technologies CO., Ltd.Inventors: Kun-Che Pai, WEI CHEN LIU, Chung-Ru Wu
-
Patent number: 10828745Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.Type: GrantFiled: January 12, 2018Date of Patent: November 10, 2020Assignee: IV Technologies CO., Ltd.Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
-
Patent number: 10421173Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.Type: GrantFiled: May 18, 2017Date of Patent: September 24, 2019Assignee: IV Technologies CO., Ltd.Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
-
Patent number: 10239182Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.Type: GrantFiled: June 1, 2017Date of Patent: March 26, 2019Assignee: IV Technologies CO., Ltd.Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
-
Publication number: 20180200864Abstract: A polishing pad is provided. The polishing pad, disposed on a polishing platen and suitable for a polishing process, includes a polishing layer, an adhesive layer and at least one adhesion-reducing interface layer. The adhesive layer is disposed between the polishing layer and the polishing platen. The at least one adhesion-reducing interface layer is disposed between the adhesive layer and the polishing layer and/or disposed between the adhesive layer and the polishing platen. An area of the at least one adhesion-reducing interface layer is smaller than an area of the adhesive layer.Type: ApplicationFiled: January 12, 2018Publication date: July 19, 2018Applicant: IV Technologies CO., Ltd.Inventors: Chung-Ru Wu, Yu-Hao Pan, Kun-Che Pai, Chun-Ming Ting
-
Patent number: 9969049Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.Type: GrantFiled: June 8, 2016Date of Patent: May 15, 2018Assignee: IV Technologies CO., Ltd.Inventors: Kun-Che Pai, Yu-Hao Pan
-
Publication number: 20170355061Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.Type: ApplicationFiled: June 1, 2017Publication date: December 14, 2017Applicant: IV Technologies CO., Ltd.Inventors: Yi Jian, Wen-Chang Shih, Kun-Che Pai, Chin-Chih Chen
-
Publication number: 20170334033Abstract: A base layer, a polishing pad with a base layer and a polishing method are provided. The polishing pad includes a polishing layer and a base layer. The base layer, underlaid below the polishing layer, is a three-dimensional fabric. The three-dimensional fabric comprises a top woven layer, a bottom woven layer, and a supporting woven layer disposed between the top woven layer and the bottom woven layer. The top woven layer and the bottom woven layer are respectively woven by a plurality of first set of yarns and a plurality of second set of yarns. The supporting woven layer comprises a plurality of supporting yarns interconnecting the top woven layer and the bottom woven layer, so that a space exists between the top woven layer and the bottom woven layer.Type: ApplicationFiled: May 18, 2017Publication date: November 23, 2017Applicant: IV Technologies CO., Ltd.Inventors: Geng-I Lin, Yu-Hao Pan, Kun-Che Pai
-
Patent number: 9707662Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: GrantFiled: November 1, 2013Date of Patent: July 18, 2017Assignee: IV TECHNOLOGIES CO., LTD.Inventors: Kun-Che Pai, Shiuan-Tzung Li, Chao-Chin Wang, Wei-Wen Yang
-
Publication number: 20160375546Abstract: A polishing layer of a polishing pad is provided. The polishing layer of the polishing pad includes a carrier layer and a plurality of embedded sections. The embedded sections embedded in the carrier layer are located in a polishing surface of the polishing layer, wherein in the polishing surface of the polishing layer, a groove is included in the carrier layer between every two adjacent embedded sections.Type: ApplicationFiled: June 8, 2016Publication date: December 29, 2016Inventors: Kun-Che Pai, Yu-Hao Pan
-
Publication number: 20140057540Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: ApplicationFiled: November 1, 2013Publication date: February 27, 2014Applicant: IV Technologies Co., Ltd.Inventors: Kun-Che PAI, Shiuan-Tzung LI, Chao-Chin WANG, Wei-Wen YANG
-
Patent number: 8609001Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: GrantFiled: June 8, 2010Date of Patent: December 17, 2013Assignee: IV Technologies Co., Ltd.Inventors: Kun-Che Pai, Shiuan-Tzung Li, Chao-Chin Wang, Wei-Wen Yang
-
Publication number: 20110159793Abstract: A polishing pad having a detection window and a method of manufacturing the polishing pad are provided. A dummy detection window is pre-disposed in a mold. A polishing layer precursor is filled into the mold, and then a solidifying process is performed to form a polishing layer, wherein the polishing layer and the dummy detection window are separable completely. The polishing layer and the dummy detection window are separated from each other so as to form a detection opening in the polishing layer. The detection opening can alternatively be formed in a mold having a protrusion structure to replace the dummy detection window. A detection window precursor is filled into the detection opening, and then a solidifying process is performed to form a detection window.Type: ApplicationFiled: June 8, 2010Publication date: June 30, 2011Applicant: IV TECHNOLOGIES CO., LTD.Inventors: Kun-Che Pai, Shiuan-Tzung Li, Chao-Chin Wang, Wei-Wen Yang