Patents by Inventor Kun-Chen Wang

Kun-Chen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240109224
    Abstract: A method of manufacturing a waffle slab includes providing a bottom mold separately on columns and exposing joint heads of the columns from the bottom mold; providing first sets of beam bars separately on the bottom mold to be parallel along a first direction; and providing second sets of beam bars separately on the bottom mold to be parallel along a second direction, wherein the second sets b of beam bars are configured to intersect with the first sets of beam bars without interference and together they form accommodation spaces for waffle molds.
    Type: Application
    Filed: September 6, 2023
    Publication date: April 4, 2024
    Inventors: Samuel YIN, Kun-Jung HSU, Jui-Chen WANG, Jhih-Syuan CHEN
  • Patent number: 6066183
    Abstract: A liquid dispersed dye of the azo or anthraquinone type that includes a dispersing agent and dispersing assistant in order to keep the dye dissolved in liquid without sedimentation. The preferred dispersing agent is a sulfonated lignin salt and the preferred dispersing assistant is a surfactant such as polyethylene glycol epoxide ether (EO-1), polyethylene glycol phenolic-formaldehyde epoxide ether (EO-2), or polyethylene glycol amino methylene epoxide ether (EO-3).
    Type: Grant
    Filed: April 13, 1998
    Date of Patent: May 23, 2000
    Assignee: I-Hwa Industrial Co., Ltd.
    Inventor: Kun-Chen Wang