Abstract: A semiconductor package includes a semiconductor structure. The semiconductor structure includes a plurality of dielectric layers and a plurality of conductive interconnects embedded in the semiconductor structure. The semiconductor structure also includes a plurality of proximity communication signal input terminals. At least one of the plurality of proximity communication signal input terminals includes a first electrode and a second electrode. The first electrode and the second electrode are spaced apart so as to be configured to provide proximity communication through capacitive coupling. The first electrode is exposed proximate to a surface of the semiconductor structure.

Abstract: A reflective optical detecting device is for detecting movement of an object in a predetermined area. The reflective optical detecting device includes a light emitting unit, at least two optical detectors, and a comparing unit. The light emitting unit is used for illuminating the predetermined area. The optical detectors are disposed at opposite sides of the light emitting unit, and each of the optical detectors is associated with a respective detection region within the predetermined area for generating an output signal in response to light reflected from the object and detected thereby. The comparing unit is coupled to the optical detectors for receiving the output signal from each of the optical detectors, and is operable to output a comparison result according to the output signal of each of the optical detectors. The comparison result is to be used for determining the movement of the object.

Abstract: A one-way ratchet wheel element has engaged and linked driving wheel and driven wheel in a body. The side of the body that connects with the driving wheel has a shifting space. A tooth section is provided on a wedge opposite to the shifting space. When the driven wheel rolls and engages with the tooth section, there is a resistance to the rotation of the driving wheel, forming an engagement state. When the driven wheel is away from the tooth section on the wedge, it is in the idle state.

Abstract: A method of synthesizing ligand-conjugated gold nanoparticles (AuNPs) is disclosed. The method comprises: a) providing an amine-modified silica particle; b) providing a solution comprising Au+3 ions; c) suspending the amine-modified silica particle in the solution comprising Au+3 ions; d) allowing the Au3+ ions to be adsorbed and/or immobilized onto the surface of the amine-modified silica particle; e) exposing the Au3+ ions immobilized onto the surface of the amine-modified silica particle to radiation to obtain bare gold nanoparticles (AuNPs) adsorbed and/or immobilized onto the surface of the amine-modified silica particle, wherein the bare AuNPs are without organic surface modifications; and f) reacting a ligand with the bare AuNPs adsorbed and/or immobilized onto the surface of the amine-modified SiNP and thereby obtain ligand-conjugated gold nanoparticles (AuNPs).

Abstract: A method of signal adjustment in an optical sensing device is provided. The optical sensing device includes a first optical sensor and a first reference optical sensor. The first optical sensor corresponds to a first specified ideal spectral response and generates a first output signal corresponding to light detected thereby. The first reference optical sensor generates a first reference signal corresponding to light detected thereby, and is disposed adjacent to the first optical sensor such that the light detected by the first reference optical sensor is substantially the light detected by the first optical sensor. The method includes the steps of: a) receiving the first output signal and the first reference signal; and b) generating a first adjusted output signal having a spectral response that approximates the first specified ideal spectral response, by adjusting the first output signal according to the first reference signal.

Abstract: The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes a substrate, at least one first chip, a dielectric layer and at least one second chip. The first chip is attached and electrically connected to the substrate. The first chip includes a first active surface and a plurality of first signal coupling pads. The first signal coupling pads are disposed adjacent to the first active surface. The dielectric layer is disposed on the first active surface. The second chip is attached and electrically connected to the substrate by metal bumps. The second chip includes a second active surface and a plurality of second signal coupling pads. The second active surface contacts the dielectric layer. The second signal coupling pads are disposed adjacent to the second active surface, and capacitively coupled to the first signal coupling pads of the first chip, so as to provide proximity communication between the first chip and the second chip.

Abstract: A light-emitting diode (LED) apparatus includes a thermoconductive substrate, a thermoconductive adhesive layer, an epitaxial layer, a current spreading layer and a micro- or nano-roughing structure. The thermoconductive adhesive layer is disposed on the thermoconductive substrate. The epitaxial layer is disposed opposite to the thermoconductive adhesive layer and has a first semiconductor layer, an active layer and a second semiconductor layer. The current spreading layer is disposed between the second semiconductor layer of the epitaxial layer and the thermoconductive adhesive layer. The micro- or nano-roughing structure is disposed on the first semiconductor layer of the epitaxial layer. In addition, a manufacturing method of the LED apparatus is also disclosed.

Abstract: In an anode material of a lithium-ion secondary battery and its preparation method, a natural graphite, an artificial graphite or both are mixed to form a graphite powder, and the graphite powder is mixed with a resin of a high hard carbon content and processed by a mist spray drying process, and finally added or coated with a special resin material after a carburizing heat treatment takes place to prepare a graphite composite of the anode material of the lithium-ion secondary battery and achieve a smaller surface area of an anode graphite composite of the battery and extended cycle life and capacity.

Abstract: A light source driving device includes a power factor correction (PFC) circuit, a power stage circuit, a power conversion circuit, a balancing circuit, an inverter control signal processor, an inverter controller and an isolation component. Alternating current (AC) signals are converted into electrical signals to drive lamps via the PFC circuit, the power stage circuit, the power conversion circuit and the current balancing circuit. The power conversion circuit including a transformer divides the driving device into a primary side and a secondary side. The inverter control signal processor receives a first control signal output from a secondary side and generates a second control signal. The inverter controller is disposed on the secondary side to drive the power stage circuit. The isolation component transmits the second control signal to the inverter controller and isolates the inverter control signal processor from the inverter controller.

Abstract: A LED package structure includes a supporting substrate, a first electrically-conductive structure, a LED chip, an insulating layer and a second electrically-conductive structure. The supporting substrate includes a top surface, a bottom surface and a first channel. The first electrically-conductive structure is filled in the first channel and partially formed on the top and bottom surfaces of the supporting substrate. The LED chip is disposed over the supporting substrate. The insulating layer is formed over the supporting substrate and on bilateral sides of the LED chip. The insulating layer has a second channel corresponding to the first electrically-conductive structure. The second electrically-conductive structure is filled in the second channel and partially formed on the insulating layer, and connected with an electrode of the LED chip. The LED chip and the top and bottom surfaces of the supporting substrate are connected with each other through the first and second electrically-conductive structures.

Abstract: A package structure is provided, which includes a dielectric layer having opposing first and second surfaces, and through holes penetrating the surfaces; a strengthening layer formed on the first surface; a circuit layer formed on the second surface, and having wire bonding pads formed thereon and exposed from the through holes, and ball pads electrically connected to the wire bonding pads; a first solder mask layer formed on the first surface and the strengthening layer, and having first apertures formed therethrough for exposing the wire bonding pads; a second solder mask layer formed on the second surface and the circuit layer, and having second apertures formed therethrough for exposing the ball pads; and a semiconductor chip disposed on the first solder mask layer and electrically connected via conductive wires to the wire bonding pads exposed from the through holes. The strengthening layer ensures the steadiness of the chip to be mounted thereon without position shifting.

Abstract: The present invention relates to a semiconductor package and a method for making the same. The semiconductor package includes at least one first layer chip, a plurality of first metal bumps, at least one second layer chip and a package body. The first layer chip includes a first active surface and a plurality of first signal coupling pads. The first signal coupling pads are disposed adjacent to the first active surface. The first metal bumps are disposed on the first active surface of the first layer chip. The second layer chip is electrically connected to the first layer chip, and includes a second active surface and a plurality of second signal coupling pads. The second active surface faces the first active surface of the first layer chip. The second signal coupling pads are disposed adjacent to the second active surface, and capacitively coupled to the first signal coupling pads of the first layer chip, so as to provide proximity communication between the first layer chip and the second layer chip.

Abstract: A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.

Abstract: A removable and short-circuit-avoidable lithium battery module mainly makes use of a protective device mounted between a control circuit and any two cells. Wherein, the protective device includes a base plate and a conductive surface connecting with the cell, an output tab connecting with the control circuit, and a protective unit mounted on the conductive surface and the output tab. Whereby, the conductive surface and the output tab have larger areas to respectively link the cell and the control circuit. While connecting with electricity, the cell and the control circuit would be more accurately connected. Moreover, the protective unit would become disconnected while the cell and the control circuit are fell and collided, so as to prevent the cell and the control circuit from the inaccurate connection and destruction. The present invention also facilitates to swiftly replace the protective device while it is damaged and to contribute a convenient utility.

Abstract: An MEMS carrier is provided that includes a core board having a first surface and an opposite second surface, a circuit layer formed on the first surface and having a plurality of conductive pads, and a through hole formed through the first and the second surfaces; a carrier layer formed on the second surface of the core board and covering an end of the through hole; a patterned metal layer formed on a portion of the carrier layer that covers the end of the through hole; a solder mask layer formed on the first surface of the core board and the circuit layer, wherein the solder mask layer has a plurality of openings for exposing the conductive pads; and a shielding metal layer disposed on a sidewall of the through hole, the patterned metal layer, and the portion of the carrier layer that covers the end of the through hole. Without the use of a circuit board, the MEMS carrier has reduced height and size.

Abstract: The present invention provides a method of and a system for providing buffer management mechanism in an on-Demand environment to keep the popular content sections in server memory so as to reduce the repeatable disk I/O and improve the server performance. The method comprises: setting the state of a buffer to be ACTIVE when a file section stored in the buffer is requested by any users; setting the state of the buffer to be INACTIVE when users no longer request the file section stored in the buffer, the buffer in INACTIVE state having a lifetime; changing the state of the buffer from INACTIVE to FREE when the lifetime decreases to zero.

Abstract: A data line repair structure for a liquid crystal display panel is disclosed. The data line repair structure includes a first repair line parallel to the scan line and crossing a first end of the data line; a fourth repair line formed in an oblique line area of the liquid crystal panel, coupled to the first repair line; a second repair line parallel to the data line, coupled to the gate driving chip and the fourth repair line; a third repair line parallel to the scan line, coupled to the second repair line and separated from a second end of the data line; and a floating line connected between the third repair line and the second end of the data line when the data line has a broken point.

Abstract: A liquid crystal display (LCD) and a back light module are provided. The back light module includes a light guide plate (LGP) and a plurality of light-emitting devices. The LGP has a plurality of partitioning grooves, a bottom surface, a light exiting surface, a first side and a second side. The bottom surface is opposite to the light exiting surface. The first side and the second side are located at the two opposite side surfaces of the LGP. The extension direction of each of the partitioning grooves extends from the first side towards the second side. Each of the partitioning grooves has an opening and the opening is located at the bottom surface. The plurality of light-emitting devices are disposed at least one of the first side and the second side. The liquid crystal panel of the LCD is disposed at the light exiting surface.