Patents by Inventor Kun-Chi Chen

Kun-Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130221056
    Abstract: A nail gun includes a nail gun housing, a nail magazine detachably mounted in the nail gun housing and defining with the nail gun housing a nail crown receiving space and first, second and third nail leg receiving spaces, and a nail pusher for pushing a nail to a nailing position in the nail magazine, the nail pusher having a top portion positioned in the nail crown receiving space and first, second and third push portions respectively downwardly extended from two lateral sides and a second side of the top portion and respectively inserted into the first, second and third nail leg receiving spaces. Thus, a large contact surface area of the nail pusher can be abutted against the leg(s) of one of various types of nails to keep the nail accurately in the nailing position, avoiding tilting or any nailing errors.
    Type: Application
    Filed: July 3, 2012
    Publication date: August 29, 2013
    Inventor: Kun-Chi CHEN
  • Patent number: 8302299
    Abstract: A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: November 6, 2012
    Assignee: Unitech Printed Circuit Board Corp.
    Inventors: Cheng-Hsien Chou, Shun-Yueh Hsu, Kun-Chi Chen, Hung-Min Chen
  • Publication number: 20110225816
    Abstract: A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
    Type: Application
    Filed: January 25, 2011
    Publication date: September 22, 2011
    Inventors: Cheng-Hsien CHOU, Shun-Yueh HSU, Kun-Chi CHEN, Hung-Min CHEN