Patents by Inventor Kun-Chi Chen

Kun-Chi Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250096000
    Abstract: A manufacturing method of a semiconductor structure includes the following steps. A first wafer is provided. The first wafer includes a first substrate and a first device layer. A second wafer is provided. The second wafer includes a second substrate and a second device layer. The second device layer is bonded to the first device layer. An edge trimming process is performed on the first wafer and the second wafer to expose a first upper surface of the first substrate and a second upper surface of the first substrate and to form a damaged region in the first substrate below the first upper surface and the second upper surface. The second upper surface is higher than the first upper surface. A first photoresist layer is formed. The first photoresist layer is located on the second wafer and the second upper surface and exposes the first upper surface and the damaged region. The damaged region is removed by using the first photoresist layer as a mask. The first photoresist layer is removed.
    Type: Application
    Filed: October 16, 2023
    Publication date: March 20, 2025
    Applicant: United Microelectronics Corp.
    Inventors: Kun-Ju Li, Hsin-Jung Liu, Jhih Yuan Chen, I-Ming Lai, Ang Chan, Wei Xin Gao, Hsiang Chi Chien, Hao-Che Hsu, Chau Chung Hou, Zong Sian Wu
  • Publication number: 20250080705
    Abstract: A projection device includes a light source module, a display panel, a freeform-surface reflective mirror, and a projection lens. The light source module includes a light source, a first Fresnel lens element, and a second Fresnel lens element. The first Fresnel lens element and the second Fresnel lens element are parallel to each other and located between the light source and the display panel. The display panel is arranged between the light source module and the freeform-surface reflective mirror. The projection lens is configured to transmit an image beam out of the projection device, and a direction of an optical axis of the projection lens is different from a direction of a normal of the first Fresnel lens element.
    Type: Application
    Filed: August 22, 2024
    Publication date: March 6, 2025
    Applicant: Coretronic Corporation
    Inventors: Kun-Zheng Lin, Wen-Chun Wang, Wei-Ting Wu, Wen-Chieh Chung, Jui-Chi Chen
  • Patent number: 9974186
    Abstract: A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.
    Type: Grant
    Filed: May 4, 2016
    Date of Patent: May 15, 2018
    Assignee: UNITECH PRINTED CIRCUIT BOARD CORP.
    Inventors: Ming Yi Yeh, Shun Yueh Hsu, Kun Chi Chen, Hung Min Chen
  • Publication number: 20170006708
    Abstract: A method of manufacturing a printed circuit board with embedded electronic components fixed by a solder paste includes: providing a carrier board with a copper foil layer on the carrier board, an insulating layer on the copper foil layer, and an opening on the insulating layer by laser; putting a solder paste into the opening to form a solder paste layer; performing a high-temperature reflow process of the electronic components on the solder paste layer until the solder paste layer is molten; curing the solder paste layer after cooling to fix the components to the center position of the opening; placing the copper foil layer below the electronic components and removing the solder paste layer; and performing copper plating and electroplating processes in an electroplating space to form a plating copper. The cohesion of the molten solder paste pulls the electronic components towards the center to eliminate position offset produced when the electronic components are installed.
    Type: Application
    Filed: May 4, 2016
    Publication date: January 5, 2017
    Inventors: MING YI YEH, SHUN YUEH HSU, KUN CHI CHEN, HUNG MIN CHEN
  • Patent number: 9443743
    Abstract: A method for directly attaching dielectric to a circuit board with embedded electronic devices is provided. That is, a plurality of through holes are produced before embedding an electronic device, wherein plural through holes are corresponding to a plurality of electrodes of the electronic device. So that the plural electrodes of the electronic device is accurately positioned with the through holes if the electronic device is being embedded. On the other hand, since the first dielectric layer is adhesive, the electronic device is directly stuck on the first dielectric layer in order to save cost of adhesive material or metal conductive paste in prior arts.
    Type: Grant
    Filed: June 10, 2015
    Date of Patent: September 13, 2016
    Assignee: UNITECH PRINTED CIRCUIT BOARD CORP.
    Inventors: Ming Yi Yeh, Shun Yueh Hsu, Kun Chi Chen, Hung Min Chen
  • Publication number: 20130221056
    Abstract: A nail gun includes a nail gun housing, a nail magazine detachably mounted in the nail gun housing and defining with the nail gun housing a nail crown receiving space and first, second and third nail leg receiving spaces, and a nail pusher for pushing a nail to a nailing position in the nail magazine, the nail pusher having a top portion positioned in the nail crown receiving space and first, second and third push portions respectively downwardly extended from two lateral sides and a second side of the top portion and respectively inserted into the first, second and third nail leg receiving spaces. Thus, a large contact surface area of the nail pusher can be abutted against the leg(s) of one of various types of nails to keep the nail accurately in the nailing position, avoiding tilting or any nailing errors.
    Type: Application
    Filed: July 3, 2012
    Publication date: August 29, 2013
    Inventor: Kun-Chi CHEN
  • Patent number: 8302299
    Abstract: A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: November 6, 2012
    Assignee: Unitech Printed Circuit Board Corp.
    Inventors: Cheng-Hsien Chou, Shun-Yueh Hsu, Kun-Chi Chen, Hung-Min Chen
  • Publication number: 20110225816
    Abstract: A method of manufacturing a multilayer printed circuit board of a built-in electronic device provides a substrate having a copper clad laminate and a first dielectric layer. The first dielectric layer is laminated onto the copper clad laminate and has a cavity for accommodating the electronic device. A second dielectric layer is laminated onto the substrate and electronic device to produce a base circuit board with an embedded electronic device. A build-up circuit layer is formed on the base circuit board. The first and second dielectric layers are made of a plastic material.
    Type: Application
    Filed: January 25, 2011
    Publication date: September 22, 2011
    Inventors: Cheng-Hsien CHOU, Shun-Yueh HSU, Kun-Chi CHEN, Hung-Min CHEN