Abstract: A circuit includes a base silicon layer, a base oxide layer, a first top silicon layer, a second top silicon layer, a first semiconductor device, and a second semiconductor device. The base oxide layer is formed over the base silicon layer. The first top silicon layer is formed over a first region of the base oxide layer and has a first thickness. The second top silicon layer is formed over a second region of the base oxide layer and has a second thickness less than the first thickness. The first semiconductor device is formed over the first top silicon layer and the second semiconductor device is formed over the second top silicon layer. The ability to fabricate a top silicon layers with differing thicknesses can provide a single substrate having devices with different characteristics, such as having both fully depleted and partially depleted devices on a single substrate.

Abstract: A semiconductor device includes a stacked gate structure, a plurality of stacks and a first conductive layer. The stacks are disposed aside the stacked gate structure and arranged along both a first direction and a second direction perpendicular to the first direction, wherein the stacks are extended continuously along the first direction and segmented in the second direction. The first conductive layer is disposed between segmented portions of the stacks along the second direction, wherein top surfaces of the segmented portions of the stacks are higher than a top surface of the first conductive layer.

Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.

Abstract: A management system and method. The system comprises at least one delivery request, a plurality of equipment and a simulator. The delivery request indicates a plurality of devices, each comprising a respective quantity. The equipment tests the devices, each equipment comprising an equipment configuration. The simulator retrieves device configuration requirements of respective devices, maps the devices to the equipment according to the respective device configuration requirements and the equipment configurations to obtain a mapping result, and calculates at least one performance index based on the mapping result and the quantity of respective devices.

Abstract: A management system and method. The system comprises at least one delivery request, a plurality of equipment and a simulator. The delivery request indicates a plurality of devices, each comprising a respective quantity. The equipment tests the devices, each equipment comprising an equipment configuration. The simulator retrieves device configuration requirements of respective devices, maps the devices to the equipment according to the respective device configuration requirements and the equipment configurations to obtain a mapping result, and calculates at least one performance index based on the mapping result and the quantity of respective devices.

Abstract: A manufacturing management system and method. The system includes a manufacturing execution system and a plurality of manufacturing sites coupled to the manufacturing execution system. The manufacturing execution system comprises management data to support the manufacturing sites. Each manufacturing site comprises a corresponding site attribute. At least one of the manufacturing sites receives a lot, queries the management data for the lot from the manufacturing execution system according to lot identification and the site attribute of the manufacturing site receiving the lot, and processes the lot accordingly.

Abstract: A manufacturing management system and method. The system includes a manufacturing execution system and a plurality of manufacturing sites coupled to the manufacturing execution system. The manufacturing execution system comprises management data to support the manufacturing sites. Each manufacturing site comprises a corresponding site attribute. At least one of the manufacturing sites receives a lot, queries the management data for the lot from the manufacturing execution system according to lot identification and the site attribute of the manufacturing site receiving the lot, and processes the lot accordingly.