Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.

Abstract: The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

Abstract: A high-precision non-contact temperature measurement device includes: a thermal insulation box made of a thermal insulation material and having therein a receiving space; a dynamic constant-temperature feedback control module for controlling temperature of the receiving space; and a non-temperature-sensing thermal imager disposed in the receiving space. The device achieves system thermal insulation within a non-contact temperature measurement gauge, maintains the overall closed system dynamically at constant temperature, compensates for effects of internal chip self-heating effect and visual field background temperature variation, and finally calculates average temperature of surfaces of a target precisely with an imaging, non-contact temperature measurement gauge and a temperature calibration algorithm widely used in thermal-imaging non-contact temperature measurement.

Abstract: A temperature measurement correction method for a temperature detection device is provided. The temperature detection device includes a case and a focal plane array module disposed on an inner of the case. The temperature measurement correction method includes measuring an ambient temperature, a temperature of the case and a temperature of the focal plane array module, determining a plurality of radiometric regression coefficients according to the ambient temperature, the temperature of the case and the temperature of the focal plane array module, utilizing the temperature detection device to sense infrared energy radiated from an object to generate an electrical signal, and calculating an actual temperature value of the object according to the plurality of radiometric regression coefficients and the electrical signal.

Abstract: The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

Abstract: An infrared anti-reflection film structure, an anti-reflection film layer, including a material of zinc oxide, comprising a top anti-reflection film layer and a bottom anti-reflection film layer, wherein the top anti-reflection film layer is disposed on a top side of the base material and the bottom anti-reflection film layer is disposed on a bottom side of the base material; and the base material is manufactured by a floating zone crystal growth method. Through the silicon base material manufactured by the high purity crystal growth method, the silicon base material replaces germanium as the high refractive index material and base material. And coating the anti-reflection film layer on the surface of the silicon base material, so as to apply the infrared anti-reflection film structure to the thermal imaging technology.

Abstract: The present invention provides an arbor damping device, including a rod body, a damper, two flexible absorbers and at least one flexible damping adjusting member. The rod body has an internal chamber, and the internal chamber includes a circumferential wall and two end walls. The damper is received in the internal chamber. The damper includes a side surface opposite to the circumferential wall and two end surfaces respectively opposite to the two end walls. The two flexible absorbers are disposed between the two end walls and the two end surfaces respectively. The at least one flexible damping adjusting member is radially disposed between the circumferential wall and the side surface, and axially disposed between the end walls and the two flexible absorbers.

Abstract: The present invention provides an arbor damping device, including a rod body, a damper, two flexible absorbers and at least one flexible damping adjusting member. The rod body has an internal chamber, and the internal chamber includes a circumferential wall and two end walls. The damper is received in the internal chamber. The damper includes a side surface opposite to the circumferential wall and two end surfaces respectively opposite to the two end walls. The two flexible absorbers are disposed between the two end walls and the two end surfaces respectively. The at least one flexible damping adjusting member is radially disposed between the circumferential wall and the side surface, and axially disposed between the end walls and the two flexible absorbers.

Abstract: A temperature measurement correction method for a temperature detection device is provided. The temperature detection device includes a case and a focal plane array module disposed on an inner of the case. The temperature measurement correction method includes measuring an ambient temperature, a temperature of the case and a temperature of the focal plane array module, determining a plurality of radiometric regression coefficients according to the ambient temperature, the temperature of the case and the temperature of the focal plane array module, utilizing the temperature detection device to sense infrared energy radiated from an object to generate an electrical signal, and calculating an actual temperature value of the object according to the plurality of radiometric regression coefficients and the electrical signal.

Abstract: An infrared anti-reflection film structure, an anti-reflection film layer, including a material of zinc oxide, comprising a top anti-reflection film layer and a bottom anti-reflection film layer, wherein the top anti-reflection film layer is disposed on a top side of the base material and the bottom anti-reflection film layer is disposed on a bottom side of the base material; and the base material is manufactured by a floating zone crystal growth method. Through the silicon base material manufactured by the high purity crystal growth method, the silicon base material replaces germanium as the high refractive index material and base material. And coating the anti-reflection film layer on the surface of the silicon base material, so as to apply the infrared anti-reflection film structure to the thermal imaging technology.

Abstract: The present invention relates to a damping arbor, including a rod body and a damping mechanism. A diameter of the rod body is larger than or equal to 60 mm. The rod body includes an end surface for being connected with a cutter head assembly and further defining an axis. The damping mechanism includes at least three shock absorbing assemblies. The at least three shock absorbing assemblies are inserted into the end surface and surrounding the axis with equal intervals.