Patents by Inventor Kun-Chieh LIAO

Kun-Chieh LIAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240147665
    Abstract: A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.
    Type: Application
    Filed: February 28, 2023
    Publication date: May 2, 2024
    Inventors: Chia-Wei CHEN, Kun-Chieh LIAO, Yueh-Ming LIU
  • Publication number: 20240147673
    Abstract: A cooling device for rack servers and cooling method for rack servers are provided. The cooling device for rack servers includes an environmental temperature sensor, a humidity sensor, a coolant temperature sensor, an electronic valve, and a controller. The controller is configured to compute a dew point temperature according to an ambient temperature and an ambient humidity sensed by the environmental temperature sensor and the humidity sensor, compute a temperature difference between a outlet-liquid temperature of a coolant and the dew point temperature, and control an opening of the electronic valve according to the temperature difference to adjust a liquid flow of the coolant outputted, such that the outlet-liquid temperature dynamically changes following the adjustment of the liquid flow.
    Type: Application
    Filed: February 28, 2023
    Publication date: May 2, 2024
    Inventors: Chia-Wei CHEN, Kun-Chieh LIAO, Yueh-Ming LIU
  • Patent number: 11955070
    Abstract: A first driver circuit is configured to cooperate with a second driver circuit to control a display panel, wherein the first driver circuit is configured to output display data to a first area of the display panel and the second driver circuit is configured to output display data to a second area of the display panel. A method used for the first driver circuit includes outputting at least one emission control signal to control the second area of the display panel when the second driver circuit is disabled.
    Type: Grant
    Filed: November 22, 2021
    Date of Patent: April 9, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Kun-Zheng Lin, Chang-Hung Chen, Wei-Chieh Lin, Po-Sheng Liao
  • Publication number: 20240064936
    Abstract: A fluid immersion cooling system has a fluid tank containing a hydrocarbon dielectric fluid as a coolant fluid. One or more components of an electronic system is immersed in the coolant fluid. A gas cylinder contains a non-flammable, compressed filling gas. The temperature of the coolant fluid is monitored during operation of the electronic system. The filling gas is released from the gas cylinder and into the fluid tank when the temperature of the coolant fluid rises to a trigger temperature that is set based on the flash point of the coolant fluid. The filling gas covers a surface of the coolant fluid to block oxygen from interacting with vapors of the coolant fluid to prevent combustion.
    Type: Application
    Filed: August 19, 2022
    Publication date: February 22, 2024
    Inventors: Yueh-Ming LIU, Hsiao-Chung CHEN, Chia-Wei CHEN, Yu-Hsiang HUANG, Chia-Che CHANG, Hua-Kai TONG, Tan-Hsin CHANG, Yu-Chuan CHANG, Ming-Yu CHEN, Yu-Yen HSIUNG, Kun-Chieh LIAO
  • Patent number: 11473848
    Abstract: A thermosiphon heat exchanger includes a chassis, an evaporation assembly and a condensation assembly. The chassis has an internal circulation chamber and an external circulation chamber separated from each other. The evaporation assembly is disposed in the internal circulation chamber. The condensation assembly is disposed in the external circulation chamber and horizontally positioned higher than the evaporation assembly, and the condensation assembly is coupled to the evaporation assembly by plural separated loops.
    Type: Grant
    Filed: October 27, 2020
    Date of Patent: October 18, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Chia-Wei Chen, Wei-Zhi Huang, Kun-Chieh Liao
  • Publication number: 20210041180
    Abstract: A thermosiphon heat exchanger includes a chassis, an evaporation assembly and a condensation assembly. The chassis has an internal circulation chamber and an external circulation chamber separated from each other. The evaporation assembly is disposed in the internal circulation chamber. The condensation assembly is disposed in the external circulation chamber and horizontally positioned higher than the evaporation assembly, and the condensation assembly is coupled to the evaporation assembly by plural separated loops.
    Type: Application
    Filed: October 27, 2020
    Publication date: February 11, 2021
    Inventors: Chia-Wei CHEN, Wei-Zhi HUANG, Kun-Chieh LIAO