Patents by Inventor Kun-De LIN

Kun-De LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10002991
    Abstract: A light-emitting element, comprises a light-emitting stack comprising an active layer; a window layer on the light-emitting stack, wherein the window layer has a surface opposite to the light-emitting stack; and an insulative layer on the surface, wherein the surface comprises a cavity and the insulative layer substantially conformally covering the cavity, and wherein the insulative layer has a first refractive index equal to or smaller than 1.4.
    Type: Grant
    Filed: May 19, 2017
    Date of Patent: June 19, 2018
    Assignee: EPISTAR CORPORATION
    Inventors: Wen-Luh Liao, Chun-Yu Lin, Kun-De Lin
  • Publication number: 20170256681
    Abstract: A light-emitting element, comprises a light-emitting stack comprising an active layer; a window layer on the light-emitting stack, wherein the window layer has a surface opposite to the light-emitting stack; and an insulative layer on the surface, wherein the surface comprises a cavity and the insulative layer substantially conformally covering the cavity, and wherein the insulative layer has a first refractive index equal to or smaller than 1.4.
    Type: Application
    Filed: May 19, 2017
    Publication date: September 7, 2017
    Inventors: Wen-Luh LIAO, Chun-Yu LIN, Kun-De LIN
  • Patent number: 9461209
    Abstract: A semiconductor light-emitting device includes a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a periphery surface surrounding the active layer; a plurality of vias penetrating the semiconductor stack to expose the first semiconductor layer; and a patterned metal layer formed on the plurality of vias and covered the periphery surface of the first semiconductor layer.
    Type: Grant
    Filed: September 14, 2015
    Date of Patent: October 4, 2016
    Assignee: EPISTAR CORPORATION
    Inventors: Min-Yen Tsai, Chao-Hsing Chen, Tsung-Hsun Chiang, Wen-Hung Chuang, Bo-Jiun Hu, Tzu-Yao Tseng, Jia-Kuen Wang, Kuan-Yi Lee, Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
  • Patent number: 9337394
    Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.
    Type: Grant
    Filed: November 26, 2014
    Date of Patent: May 10, 2016
    Assignee: Epistar Corporation
    Inventors: Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
  • Publication number: 20160005941
    Abstract: A semiconductor light-emitting device includes a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, wherein the first semiconductor layer includes a periphery surface surrounding the active layer; a plurality of vias penetrating the semiconductor stack to expose the first semiconductor layer; and a patterned metal layer formed on the plurality of vias and covered the periphery surface of the first semiconductor layer.
    Type: Application
    Filed: September 14, 2015
    Publication date: January 7, 2016
    Inventors: Min-Yen Tsai, Chao-Hsing Chen, Tsung-Hsun Chiang, Wen-Hung Chuang, Bo-Jiun Hu, Tzu-Yao Tseng, Jia-Kuen Wang, Kuan-Yi Lee, Yi-Ming Chen, Chun-Yu Lin, Tsung-Hsien Yang, Tzu-Chieh Hsu, Kun-De Lin, Yao-Ning Chan, Chih-Chiang Lu
  • Patent number: 9136436
    Abstract: An optoelectronic device comprises a semiconductor stack having a first surface, a contact layer having a first pattern on the first surface for ohmically contacting the semiconductor stack, a void in the semiconductor stack and surrounding the contact layer, and a mirror structure on the first surface and covering the contact layer, wherein the first surface has a first portion which is not covered by the contact layer and a second portion covered by the contact layer, and the first portion is rougher than the second portion.
    Type: Grant
    Filed: September 17, 2014
    Date of Patent: September 15, 2015
    Assignee: EPISTAR CORPORATION
    Inventors: Kun-De Lin, Yao-Ning Chan, Yi-Ming Chen, Tzu-Chieh Hsu
  • Publication number: 20150144984
    Abstract: A semiconductor light-emitting device comprises a semiconductor stack comprising a side, a first surface and a second surface opposite to the first surface, wherein the semiconductor stack further comprises a conductive via extending from the first surface to the second surface; a transparent conductive layer formed on the second surface; a first pad portion and a second pad portion formed on the first surface and electrically connected to the semiconductor stack; and an insulating layer formed between the first pad portion and the semiconductor stack and between the second pad portion and the semiconductor stack.
    Type: Application
    Filed: November 26, 2014
    Publication date: May 28, 2015
    Inventors: Yi-Ming CHEN, Chun-Yu LIN, Tsung-Hsien YANG, Tzu-Chieh HSU, Kun-De LIN, Yao-Ning CHAN, Chih-Chiang LU
  • Publication number: 20150060924
    Abstract: An optoelectronic device comprises a semiconductor stack having a first surface, a contact layer having a first pattern on the first surface for ohmically contacting the semiconductor stack, a void in the semiconductor stack and surrounding the contact layer, and a mirror structure on the first surface and covering the contact layer, wherein the first surface has a first portion which is not covered by the contact layer and a second portion covered by the contact layer, and the first portion is rougher than the second portion.
    Type: Application
    Filed: September 17, 2014
    Publication date: March 5, 2015
    Inventors: Kun-De LIN, Yao-Ning CHAN, Yi-Ming CHEN, Tzu-Chieh HSU