Patents by Inventor Kun-Fang Wu

Kun-Fang Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20080065805
    Abstract: The present invention discloses a PCI-Express multimode expansion card comprising a PCI-Express interface port for insertion into a PCI-Express slot of a motherboard, a PCI-Express expansion port, a USB expansion port, and a jumper circuit connecting the PCI-Express interface port and the two expansion ports. The PCI-Express expansion port provides expandability by allowing the attachment of a PCI-Express interfaced peripheral device, and the USB expansion port provides expandability by allowing the attachment of a USB-interfaced peripheral device. As such, a single PCI-Express multimode expansion card inserted into a PCI-Express slot configured on the motherboard can be used to attach two peripheral devices with different interface, thereby achieving the function of multimode expansion.
    Type: Application
    Filed: September 11, 2006
    Publication date: March 13, 2008
    Inventors: Kun-Fang Wu, Fong-Ming Kuo, Yi-Jen Lin
  • Patent number: 6252561
    Abstract: A wireless LAN antenna comprises a dielectric substrate having a first surface and a second surface. The first surface of the dielectric substrate has a rectangular loop. A rectangular grounding copper foil is adhered within the rectangular loop. A signal feeding copper foil is further included. One end of the signal feeding copper foil is connected to the rectangular loop and the grounding copper foil, while another end of the signal feeding copper foil running across another end of the rectangular loop. Moreover, a layer of back surface copper foil is plated to the back side of the printed circuit board. This back surface copper foil covers one half of the loop on the front surface. Adjustment of the transversal dimensions of the grounding copper foil will impedance-match the antenna to the feeding structure of the antenna.
    Type: Grant
    Filed: August 2, 1999
    Date of Patent: June 26, 2001
    Assignee: Accton Technology Corporation
    Inventors: Ming-Hsiu Wu, Kun-Fang Wu, Wen-Hsiung Lin, Ji-Hong Hsiao