Abstract: A heat dissipating device is disclosed. The heat dissipating device comprises a heat dissipating base, a frame and at least one resilient member. The heat dissipating base has a plate, and at least one hole is formed on the plate. The frame has at least one protruding column, and at least one side of the frame has a protrusion. The resilient member is put on the protruding column correspondingly. When the frame buckles an edge of the plate by the protrusion and be put on the heat dissipating base, the protruding column can pass through the hole on the plate to make the frame elastically associate with the heat dissipating base through the resilient member. Thus, the heat dissipating device makes the heat dissipating base keep closer contact with a chip, balances internal stresses, prevents hestsinks design from being restricted, and further lowers cost.

Abstract: A fastening board for cooling fins includes a board body, a plurality of side boards, and a plurality of fasteners. The side boards are respectively located at the two opposite sides of the board body side. The fasteners are respectively located at the ends of the side boards. The fastening board for cooling fins is used for a tubular radiator to prevent the last cooling fin from coming off the pipe.

Abstract: A heat dissipation structure including a wind cover, a heat sink and a wind-shielding plate is provided. The wind cover has an outlet and a fan connection portion corresponding to the outlet and having an inlet. In addition, the heat sink includes a base, multiple fins disposed in the wind cover, and at least a heat pipe passing through the fins and being fixed on the base. The wind-shielding plate is connected to a lowest one of the fins for leading an air flow to move around a heat source. Accordingly, the waste heat near the heat source can be taken away.

Abstract: A coated heat sink includes: a copper base seat, an aluminum heat-dissipating seat, a plurality of heat pipes, a solder, a heat-conducting adhesive glue, and a plurality of heat-dissipating fins. The aluminum heat-dissipating seat disposes on top of the copper base seat. The heat pipes dispose on the top of the copper base seat. The solder respectively forms on contact surfaces among the copper base seat and the heat pipes for joining the copper base seat and the heat pipes together. The glue respectively forms on contact surfaces between the copper base seat and the aluminum heat-dissipating seat and among the aluminum heat-dissipating seat and the heat pipes for joining the copper base seat and the aluminum heat-dissipating seat together, and the aluminum heat-dissipating seat and the heat pipes together. The fins dispose over the aluminum heat-dissipating seat, and the fins stack together and compactly joint with the heat pipes.