Abstract: A three-phase opposite rotating motor of a fan comprises a stator having a three-phase coil set without a core, a first rotor and a second rotor. The number of the poles of the first rotor is unequal to the number of the poles of the second rotor. The ratio of the number of solenoids of the three-phase coil set and the number of the first poles of the first rotor is 3:4, and the ratio of the number of solenoids of the three-phase coil set and the number of the second poles of the second rotor is 3:2, to ensure the motor works normally in an opposite rotating operation.

Abstract: A semiconductor structure and a testing method thereof are provided. The semiconductor structure comprises a substrate, a well, an isothermal heating layer, a first dielectric layer, an interconnection material layer and a second dielectric layer. Wherein, the well is disposed in the substrate, the isothermal heating layer is disposed over the well, the first dielectric layer is disposed between the well and the isothermal heating layer, the interconnection material layer is disposed over the isothermal heating layer, and the second dielectric layer is disposed between the isothermal heating layer and the interconnection material layer. The isothermal heating layer is adapted for maintaining the interconnection metal layer at a predetermined testing temperature so that the testing result can be precise and the testing time can be reduced. Moreover, a low level current can be used as the testing current.

Abstract: A magnetic bearing system for a rotating machine is disclosed. The magnetic bearing system provides a non-contacting radial rigid support for the rotating machine by employing two magnetic assemblies each being formed by stacked annular magnets. The magnetic assemblies are mounted separately on a shaft of the rotating machine and a shaft hole provided on the stator seat of the rotating machine for containing the shaft.

Abstract: Due to the test current and the test temperature of the wafer-level reliability depend on each other in those conventional arts, the result of electromigration etc is not sure cause of the test current or the test temperature and debases the reliability of the test result. In the present invention, the electromigration test and the stress migration test of the wafer-level reliability are independently controlled, respectively. Therefore, the cause of electromigration and the stress migration can be sure resulting from the test current or the test temperature respectively. Furthermore, the isothermal heater of the present invention not only can keep a whole test wafer at a more uniform test temperature, but also can offset the electromagnetism resulted from the current of the isothermal heater by the arrangement of circuits thereof for reducing the effect of the electromagnetism.