Patents by Inventor Kun Hoi KOO
Kun Hoi KOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11817251Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.Type: GrantFiled: October 29, 2021Date of Patent: November 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
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Patent number: 11574773Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: GrantFiled: September 30, 2021Date of Patent: February 7, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo Yi, Soung Jin Kim, Kun Hoi Koo, Jun Hyeon Kim, Kyung Ryul Lee
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Patent number: 11437192Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.Type: GrantFiled: May 12, 2021Date of Patent: September 6, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum Kim, Byeong Cheol Moon, Kun Hoi Koo, Jung Min Kim
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Patent number: 11398348Abstract: An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.Type: GrantFiled: September 16, 2020Date of Patent: July 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Patent number: 11393628Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.Type: GrantFiled: December 24, 2020Date of Patent: July 19, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Publication number: 20220189696Abstract: A multilayer electronic component includes a body including a dielectric layer and internal electrodes alternately stacked with the dielectric layer interposed therebetween; and an external electrode including a first electrode layer disposed externally on the body, connected to the internal electrodes, and including a conductive metal, a glass, a low melting point metal having a lower melting point than the conductive metal, and a pore, and a second electrode layer covering the first electrode layer and including a conductive metal, a glass, and a pore, wherein porosity of the first electrode layer is higher than porosity of the second electrode layer.Type: ApplicationFiled: September 30, 2021Publication date: June 16, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Soo YI, Soung Jin KIM, Kun Hoi KOO, Jun Hyeon KIM, Kyung Ryul LEE
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Patent number: 11342119Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.Type: GrantFiled: September 24, 2020Date of Patent: May 24, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Publication number: 20220051843Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.Type: ApplicationFiled: October 29, 2021Publication date: February 17, 2022Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi KOO, Byung Woo KANG, Ji Hye HAN, Bon Seok KOO
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Publication number: 20210375543Abstract: An electronic component includes a body, including a dielectric layer and an internal electrode, and an external electrode including a conductive resin layer, disposed on the body, and a plating layer disposed on the conductive resin layer. The conductive resin layer includes a metal particle, a first intermetallic compound, and a base resin, and a second intermetallic compound is disposed on a boundary between the conductive resin layer and the plating layer.Type: ApplicationFiled: September 16, 2020Publication date: December 2, 2021Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Patent number: 11183325Abstract: An electronic component includes an internal electrode and an external electrode electrically connected thereto. The external electrode includes a conductive base having a porous structure and a resin filled in voids in the porous structure of the conductive base. The electronic component further includes a connection layer disposed between the internal electrode and the external electrode.Type: GrantFiled: November 8, 2017Date of Patent: November 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Byung Woo Kang, Ji Hye Han, Bon Seok Koo
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Publication number: 20210265115Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.Type: ApplicationFiled: May 12, 2021Publication date: August 26, 2021Inventors: Mi Geum KIM, Byeong Cheol MOON, Kun Hoi KOO, Jung Min KIM
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Patent number: 11037732Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.Type: GrantFiled: August 12, 2019Date of Patent: June 15, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Mi Geum Kim, Byeong Cheol Moon, Kun Hoi Koo, Jung Min Kim
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Publication number: 20210118616Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.Type: ApplicationFiled: December 24, 2020Publication date: April 22, 2021Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Patent number: 10903010Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.Type: GrantFiled: April 18, 2019Date of Patent: January 26, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Publication number: 20210005388Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.Type: ApplicationFiled: September 24, 2020Publication date: January 7, 2021Inventors: Jung Min KIM, Bon Seok KOO, Jung Wook SEO, Yoon Hee LEE, Kun Hoi KOO
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Publication number: 20200312559Abstract: A multilayered capacitor includes a capacitor body including a plurality of dielectric layers and a plurality of internal electrodes; and external electrodes disposed on both end portions of the capacitor body and connected to exposed portions of the internal electrodes, respectively. Each of the external electrodes includes a conductive layer formed on the capacitor body and connected to the internal electrodes; an inner plated layer including nickel (Ni) and phosphorus (P), and covering the conductive layer; and an outer plated layer including palladium (Pd) and phosphorus (P), and covering the inner plated layer.Type: ApplicationFiled: August 12, 2019Publication date: October 1, 2020Inventors: Mi Geum KIM, Byeong Cheol MOON, Kun Hoi KOO, Jung Min KIM
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Patent number: 10770230Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and first and second internal electrodes, and external electrodes disposed on at least one surface of the body. The external electrodes each includes an electrode layer in contact with the first or second internal electrodes, an intermediate layer disposed on the electrode layer and including a first intermetallic compound, and a conductive resin layer disposed on the intermediate layer and including a plurality of metal particles, a second intermetallic compound and a base resin.Type: GrantFiled: May 7, 2018Date of Patent: September 8, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kun Hoi Koo, Bon Seok Koo, Jung Min Kim, Jun Hyeon Kim, Hae Sol Kang, Soung Jin Kim, Ji Hye Han, Byung Woo Kang, Chang Hak Choi
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Publication number: 20200176189Abstract: A multilayer ceramic capacitor includes a body including a dielectric layer and an internal electrode and an external electrode disposed on one surface of the body. The external electrode includes an electrode layer, in contact with the internal electrode, a first intermetallic compound layer disposed on the electrode layer and made of Cu3Sn, a first intermetallic compound, a second intermetallic compound layer disposed on the first intermetallic compound layer and made of Cu6Sn5, a second intermetallic compound, and a conductive resin layer disposed on the second intermetallic compound layer and including a plurality of metal particles, a base resin and a conductive metal having a melting point lower than a curing temperature of the base resin.Type: ApplicationFiled: April 18, 2019Publication date: June 4, 2020Inventors: Kun Hoi Koo, Soung Jin Kim, Bon Seok Koo
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Patent number: 10658116Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.Type: GrantFiled: February 1, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Patent number: 10658117Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.Type: GrantFiled: February 8, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo