Patents by Inventor Kun-Hsiang TSAI

Kun-Hsiang TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTENNA STRUCTURE AND LOW EARTH ORBIT SATELLITE SYSTEM
    Publication number: 20250080211
    Abstract: An antenna structure includes an upper patch antenna, a lower patch antenna, a grounding layer, a transmission line layer, and a first feeding line and a second feeding line passing through the grounding layer. Each of the first feeding line and the second feeding line includes a first portion, a second portion and a third portion. The first portion is disposed between the lower patch antenna and the grounding layer and is perpendicular to the grounding layer. The second portion is disposed between the grounding layer and the transmission line layer and is perpendicular to the grounding layer. The third portion is disposed within the grounding layer and is parallel to the grounding layer. The third portion is coupled between the first portion and the second portion.
    Type: Application
    Filed: June 20, 2024
    Publication date: March 6, 2025
    Inventors: Kun Yen TU, Meng-Hua TSAI, Sin-Siang WANG, Wei Ting LEE, Ming-Hsiang HUANG
  • Interlocking assembly and electronic device having the same
    Patent number: 10303207
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: May 28, 2019
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Ming-Hsing Yang, Kun-Hsiang Tsai, Yung-Hsiang Chen, Li-Wei Hung
  • INTERLOCKING ASSEMBLY AND ELECTRONIC DEVICE HAVING THE SAME
    Publication number: 20180364755
    Abstract: An electronic device includes a support element, a second cover, a second guiding element and including a pushing element. The support element includes a first cover and a first guiding element. The first guiding element is connected to the first cover. The second guiding element is slidably jointed to the first guiding element to move relative to the first guiding element in a direction and is connected to the second cover. The pushing element is connected to the second cover and configured to push against the support when the second cover rotates relative to the second guiding element to make the support element move relative to the second guiding element.
    Type: Application
    Filed: June 7, 2018
    Publication date: December 20, 2018
    Inventors: Ming-Hsing YANG, Kun-Hsiang TSAI, Yung-Hsiang CHEN, Li-Wei HUNG