Abstract: A TGV substrate via waist depth detection device has a first DOF camera, a first collimated light source and microcontroller is illustrated. The first DOF camera and first collimated light source are respectively arranged above and below the glass substrate with at least one glass substrate via, and respectively obliquely face the upper surface and lower surface of the glass substrate. The microcontroller is coupled with the first DOF camera and first collimated light source. The first collimated light source is configured to emit the first collimated beam which obliquely irradiates the glass substrate, the first DOF camera is configured to obtain the first image, and the microcontroller is configured to obtain at least one detection result of at least one glass substrate via according to the first image.

Abstract: A device for stripping coated optical fiber ribbons, in cooperation with at least an optical fiber ribbon having a protective coating and an optical fiber array substrate having grooves, comprises a heating unit including at least a first trench and a cutting blade for gripping a first portion of the optical fiber ribbon having protective coatings and for heating; a stripping unit having at least a second trench, adjacent to and connected to the first trench, for gripping a second portion of the optical fiber ribbon having the protective coating; a fiber array seat for receiving an optical fiber array substrate; and a linear guiding unit for limitedly guiding the direction of the separation movement between the heating unit and the stripping unit.

Abstract: A fiber array module fabrication method. The method includes the steps of: (a) preparing a optical fiber ribbon, a solder/binder coated fiber array substrate, and two holder bases, one holder base having longitudinally extended locating grooves; (b) putting the fiber array substrate in between the holder bases and keeping the longitudinally extended grooves of the fiber array substrate in alignment with the longitudinally extended aligning grooves of the holder base and then loading the optical fiber ribbon in the holder bases and keeping the optical fibers of the fiber ribbon in the locating grooves of the holder base and the fixing grooves of the fiber array substrate; (c) heating the solder or radiating the binder to fixedly secure the optical fibers to the fiber array substrate and the fiber array cover plate, and (d) cutting off the optical fibers and removing the finished fiber array module from the holder bases.

Abstract: A V-groove mold fabrication method is disclosed. The method for fabricating a V-groove mold includes the following steps: (a) providing a matrix substrate having a plurality of V-grooves, and then forming a metal layer on said matrix substrate; immersing said matrix substrate having said metal layer thereon with an electroforming metal ion solution and forming a father mold by an electroforming process; and separating said father mold from said matrix substrate.

Abstract: A device for stripping coated optical fiber ribbons, in cooperation with at least an optical fiber ribbon having a protective coating and an optical fiber array substrate having grooves, comprises a heating unit including at least a first trench and a cutting blade for gripping a first portion of the optical fiber ribbon having protective coatings and for heating; a stripping unit having at least a second trench, adjacent to and connected to the first trench, for gripping a second portion of the optical fiber ribbon having the protective coating; a fiber array seat for receiving an optical fiber array substrate; and a linear guiding unit for limitedly guiding the direction of the separation movement between the heating unit and the stripping unit.

Abstract: A fiber array module fabrication method is disclosed including the steps of: (a) preparing a optical fiber ribbon, a solder/binder coated fiber array substrate, and two holder bases, one holder base having longitudinally extended locating grooves, (b) putting the fiber array substrate in between the holder bases and keeping the longitudinally extended grooves of the fiber array substrate in alignment with the longitudinally extended aligning grooves of the holder base and then loading the optical fiber ribbon in the holder bases and keeping the optical fibers of the fiber ribbon in the locating grooves of the holder base and the fixing grooves of the fiber array substrate, (c) heating the solder or radiating the binder to fixedly secure the optical fibers to the fiber array substrate and the fiber array cover plate, and (d) cutting off the optical fibers and removing the finished fiber array module from the holder bases.

Abstract: A fiber array module is constructed by using low-temperature solders or metal as fastening means to fixedly secure optical fibers in grooves between a fiber array substrate and a top cover plate covered on the fiber array substrate over the optical fibers.

Abstract: ABSTRACT OF THE DISCLOSURE A method for forming the soldering layer of fiber array substrate surface has been disclosed herein. A plurality of fiber array bases having V-shape grooves are formed on a substrate, and a solder layer is formed on the whole substrate via chemical plating method of following steps: forming a layer of nickel/chromium (Ni/Cr) alloy or aluminum (Al) metal on said substrate through evaporation or sputtering; treating said surface of said substrate having V-shape grooves with a sensitizing solution for plating said surface with Sn2+, wherein said sensitizing solution comprises deionized water and SnCl2; treating said sensitized surface of said substrate with an activating solution for precipitating catalytic element Pd0 on said surface, wherein said sensitizing solution comprises 2 to 10 g/l of PdCl2 and 0.01 to 0.1 M HCl; and (E) immersing said treated surface into an electroless nickel plating solution to form a nickel metal layer on said treated surface.

Abstract: A fiber array base block is disclosed for the positioning at least one optical fiber for making a fiber array module, the fiber array base block having parallel grooves in one side for the positioning of optical fibers, and at least one channel disposed below and intersected with the grooves and adapted for producing a vacuum suction force to secure the optical fibers in the grooves as air drawn away from the channel channels.