Patents by Inventor Kun-Hsun Lee

Kun-Hsun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120162135
    Abstract: An optical touch apparatus includes: a frame having a first side that has a first connecting unit; a lighting module for generating light, the lighting module having a second connecting unit connected to the first connecting unit of the first side of the frame such that the lighting module is mounted to the first side of the frame; and two optical sensors mounted on the frame and disposed respectively at two corners of the frame, each of the optical sensors sensing the light generated by the lighting module.
    Type: Application
    Filed: April 14, 2011
    Publication date: June 28, 2012
    Applicant: LITE-ON SEMICONDUCTOR CORP.
    Inventor: KUN-HSUN LEE
  • Patent number: 7791015
    Abstract: A motion-detecting module for combining a light-emitting function and a light-sensing function together includes a chip unit, a cover unit, and a light-guiding unit. The chip unit has a PCB, a light-emitting chip, and an image-sensing chip, and both the light-emitting chip and the image-sensing chip are electrically disposed on the PCB. The cover unit covers the light-emitting chip and the image-sensing chip. The cover unit has a receiving space for communicating the light-emitting chip and the image-sensing chip, a first opening for exposing the light-emitting chip, and a second opening for exposing the image-sensing chip. The light-guiding unit is disposed under the cover unit, and the light-guiding unit at least has a first refraction surface, a second refraction surface, a third refraction surface, a fourth refraction surface, and a reflection surface.
    Type: Grant
    Filed: May 8, 2008
    Date of Patent: September 7, 2010
    Assignee: Lite-On Semiconductor Corp.
    Inventors: Jau-Yu Chen, Kun-Hsun Lee
  • Publication number: 20090278035
    Abstract: A motion-detecting module for combining a light-emitting function and a light-sensing function together includes a chip unit, a cover unit, and a light-guiding unit. The chip unit has a PCB, a light-emitting chip, and an image-sensing chip, and both the light-emitting chip and the image-sensing chip are electrically disposed on the PCB. The cover unit covers the light-emitting chip and the image-sensing chip. The cover unit has a receiving space for communicating the light-emitting chip and the image-sensing chip, a first opening for exposing the light-emitting chip, and a second opening for exposing the image-sensing chip. The light-guiding unit is disposed under the cover unit, and the light-guiding unit at least has a first refraction surface, a second refraction surface, a third refraction surface, a fourth refraction surface, and a reflection surface.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 12, 2009
    Inventors: Jau-Yu Chen, Kun-Hsun Lee
  • Publication number: 20080193117
    Abstract: A motion-detecting device for reducing assembly tolerance includes a connection unit, a light-emitting unit, an image-sensing unit and a positioning unit. The connection unit has a first fixing portion formed on one side thereof and a second fixing portion formed on another side thereof. The second fixing portion has a receiving space and a through hole communicating with the receiving space. The light-emitting unit is fixed in the first fixing portion of the connection unit for generating a projection beam. The image-sensing unit is received in the receiving space of the second fixing portion for capturing images. The positioning unit is positioned over the receiving space of the second fixing portion and electrically connected to the image-sensing unit. The transparent base is disposed under the connection unit and mated with the second fixing portion of the connection unit.
    Type: Application
    Filed: February 12, 2008
    Publication date: August 14, 2008
    Applicant: LITE-ON SEMICONDUCTOR CORP.
    Inventors: Chia-Chu Cheng, Tzu-Heng Liu, Jau-Yu Chen, Kun-Hsun Lee
  • Publication number: 20080157252
    Abstract: The invention provides an optical sensor package. The package comprises a circuit board, an image sensor module and a packaging cap. The image sensor module electrically connects to the circuit board; the packaging cap is mounted on the circuit board and integrally packages the image sensor module. Hereby, the new architecture of the invention is not complex and its volume is small. The cost of the package is low, and the invention has the functions of electrostatic discharge and waterproofing; besides, the packaging cap can integrally package the image sensor module and a light-emitting module.
    Type: Application
    Filed: December 13, 2007
    Publication date: July 3, 2008
    Applicant: LITE-ON SEMICONDUCTOR CORP.
    Inventors: Chia-Chu Cheng, Tzu-Heng Liu, Wei-Chih Hsu, Kun-Hsun Lee