Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.

Abstract: A lens device and a light source module using the same are provided. The lens device comprises a lens and a patterned light shielding layer. The lens has a middle light emitting surface and a periphery light emitting surface surrounding the middle light emitting surface. The patterned light shielding layer is formed on the periphery light emitting surface of the lens.

Abstract: A lighting apparatus includes a wavelength converting apparatus. The wavelength converting apparatus includes a hollow tube and a wavelength converting material. The hollow tube has an accommodating chamber. The wavelength converting material is positioned in the accommodating chamber.

Abstract: A lens device and a light source module using the same are provided. The lens device comprises a lens and a patterned light shielding layer. The lens has a middle light emitting surface and a periphery light emitting surface surrounding the middle light emitting surface. The patterned light shielding layer is formed on the periphery light emitting surface of the lens.

Abstract: A luminous element includes a heat dissipation plate, a body, a plurality of LED chips, a first connector and a second connector. The heat dissipation plate includes a die-bonding area and a heat dissipation area opposite to the die-bonding area. The body surrounds the heat dissipation plate, and includes a first body surface and a second body surface opposite to the first body surface. The first body surface includes a concave part exposing the die-bonding area. The second body surface includes an opening exposing the heat dissipation area. The LED chips are mounted on the die-bonding area. The first and the second connectors are disposed on the body, and they can be pluggably connected to an external power source or other connectors. The LED chips are connected to the electrical input terminals in the first and the second connectors.

Abstract: A LED (Light-Emitting Diode) lighting fixture and a manufacturing method thereof are disclosed. The LED lighting fixture comprises a LED module generating light at a wavelength range of 300-700 nm, a lamp cover shielding the LED module, and a phosphor layer. The phosphor layer which is coated on an inner surface towards the LED module comprises at least two types of phosphor mixed at a default ratio for transforming the light of 300-700 nm in wavelength to luminary light in the wavelength range of 400-700 nm.

Abstract: A LED (Light-Emitting Diode) lighting fixture and a manufacturing method thereof are disclosed. The LED lighting fixture comprises a LED module generating light at a wavelength range of 300-700 nm, a lamp cover shielding the LED module, and a phosphor layer. The phosphor layer which is coated on an inner surface towards the LED module comprises at least two types of phosphor mixed at a default ratio for transforming the light of 300-700 nm in wavelength to luminary light in the wavelength range of 400-700 nm.

Abstract: An LED (Light-Emitting Diode) lighting device is provided. The LED lighting device comprises an LED module, a lamp cover, and a phosphor layer. The LED module comprises a circuit board comprising a driving circuit and a plurality of LEDs mounted on the circuit board and driven by the driving circuit so as to emit light of 300-700 nm in wavelength. The lamp cover is configured to shield the LED module. The phosphor layer is coated on an inner surface of the lamp cover towards the LED module and configured to transform the light of 300-700 nm in wavelength to a luminary light of 400-700 nm in wavelength.

Abstract: An LED (Light-Emitting Diode) light tube includes a transparent tube, a phosphor layer and a base board. The phosphor layer is coated on a surface of the transparent tube, wherein a thickness of the phosphor layer is 10-100 ?m. The base board is arranged inside the transparent tube for carrying a plurality of LEDs (Light-Emitting Diodes), wherein the length between the base board and the top of the transparent tube is H, and the distance between every two adjacent LEDs is P, and H/P is not smaller than 0.134 and H is 9.5-38 mm.