Patents by Inventor KUN-HUNG TSAI

KUN-HUNG TSAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250062194
    Abstract: A semiconductor device includes a first conductive layer, a second conductive layer, a third conductive layer, a first organic layer, a first inorganic layer and a first silicon-containing layer. The third conductive layer is disposed between and electrically isolated from the first conductive layer and the second conductive layer. The first organic layer continuously covers the first conductive layer and the third conductive layer. The first inorganic layer is disposed over the first organic layer. The first silicon-containing layer is inserted between the first organic layer and the first inorganic layer, wherein the second conductive layer is disposed on and disposed in the first organic layer, the first silicon-containing layer and the first inorganic layer, to electrically connect to the first conductive layer.
    Type: Application
    Filed: November 4, 2024
    Publication date: February 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
  • Publication number: 20250043045
    Abstract: A method for preparing a long-chain branched polypropylene includes subjecting a T-reagent to a polymerization reaction with propylene in the presence of a catalyst composition. The catalyst composition includes an alkylaluminoxane and a metallocene-based catalyst. The metallocene-based catalyst contains a metal selected from the group consisting of titanium (Ti), zirconium (Zr), and hafnium (Hf). The T-reagent having an alkenyl silyl functional group is selected from the group consisting of 1,2-bis[dimethyl(vinyl)silyl]ethane, dimethyldivinylsilane, 7-octenyldimethyl(vinyl)silane, 7-octenyldimethyl(allyl)silane, 4-(but-3-enyl)phenyldimethyl(vinyl)silane, 4-(but-3-enyl)phenyldimethyl(allyl)silane, and combinations thereof.
    Type: Application
    Filed: July 30, 2024
    Publication date: February 6, 2025
    Inventors: Jing-Cherng Tsai, Kwang-Ming Chen, Jung-Hung Kao, Kun-Pei Hsieh, Chao-Shun Chang, Hsing-Chun Chen, Chun-Wei Chiu, Cheng-Hung Chiang, Yu-Chuan Sung, Shang-Lin Tsai, Yu-Sheng Lin
  • Publication number: 20230216432
    Abstract: The present disclosure is directed to a direct-current (DC) mechanical energy harvesting and storage method and apparatus, which can convert mechanical energy such as environmental vibration, automobile kinetic energy, human body motion, etc. directly into 10 sustained DC electricity, and store the electricity in the same materials. More specifically, the disclosure relates to quantum mechanical tunneling of triboelectric charges through a semiconductor-based sliding unit or its integrated system, and the storage of the charges in the unit or its integrated system. A triboelectric generator and storage device includes a first contact member made from a first material. A second contact member is in slidable contact with the first contact member. The second contact member is made from a second material which forms a Schottky barrier with the first material.
    Type: Application
    Filed: April 19, 2021
    Publication date: July 6, 2023
    Inventors: Jun LIU, Thomas THUNDAT, Kun-Hung TSAI
  • Patent number: 11348868
    Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: May 31, 2022
    Assignee: Wistron Corporation
    Inventors: Kun-Hung Tsai, Yu-Jhan Lin
  • Publication number: 20220115318
    Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.
    Type: Application
    Filed: November 17, 2020
    Publication date: April 14, 2022
    Inventors: Kun-Hung Tsai, Yu-Jhan Lin
  • Publication number: 20140304668
    Abstract: A via design system includes a processor to execute operations of displaying a via design interface. The via design interface includes a data input area and a result display area. The data input area is for inputting a variety of data for designing a via. An actual impedance Zvia and an ideal impedance Zc are computed according to the input data and preset equations, and an impedance comparison graph according to the actual impedance Zvia and the ideal impedance Zc, is drawn. The impedance comparison graph is output to the result display area.
    Type: Application
    Filed: July 18, 2013
    Publication date: October 9, 2014
    Inventor: KUN-HUNG TSAI
  • Publication number: 20140125435
    Abstract: An equalizer assembly for compensating transmission losses of electronic communication signals includes a circuit board and a first equalizer and a second equalizer. Two input pins of each equalizer are parallel to each other. The input pins of the first equalizer are perpendicular to the input pins of the second equalizer.
    Type: Application
    Filed: December 26, 2012
    Publication date: May 8, 2014
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: KUN-HUNG TSAI, PO-CHUAN HSIEH