Abstract: The present disclosure is directed to a direct-current (DC) mechanical energy harvesting and storage method and apparatus, which can convert mechanical energy such as environmental vibration, automobile kinetic energy, human body motion, etc. directly into 10 sustained DC electricity, and store the electricity in the same materials. More specifically, the disclosure relates to quantum mechanical tunneling of triboelectric charges through a semiconductor-based sliding unit or its integrated system, and the storage of the charges in the unit or its integrated system. A triboelectric generator and storage device includes a first contact member made from a first material. A second contact member is in slidable contact with the first contact member. The second contact member is made from a second material which forms a Schottky barrier with the first material.

Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.

Abstract: A channel structure for signal transmission is provided. The channel structure includes a first common pad, disposed on a first layer; a second common pad, disposed on a second layer; a via, for electrically connecting the first common pad and the second common pad; a first device path pad, disposed on the second layer and located in a first direction of the second common pad; and a second device path pad disposed on the second layer and located in a second direction of the second common pad. The channel structure includes a first electrical element electrically coupled between the second common pad and the first device path pad, or includes a second electrical element electrically coupled between the second common pad and the second device path pad.

Abstract: A via design system includes a processor to execute operations of displaying a via design interface. The via design interface includes a data input area and a result display area. The data input area is for inputting a variety of data for designing a via. An actual impedance Zvia and an ideal impedance Zc are computed according to the input data and preset equations, and an impedance comparison graph according to the actual impedance Zvia and the ideal impedance Zc, is drawn. The impedance comparison graph is output to the result display area.

Abstract: An equalizer assembly for compensating transmission losses of electronic communication signals includes a circuit board and a first equalizer and a second equalizer. Two input pins of each equalizer are parallel to each other. The input pins of the first equalizer are perpendicular to the input pins of the second equalizer.