Abstract: A semiconductor device and method of manufacturing the same are provided. The semiconductor device includes a substrate and a gate structure disposed on the substrate. The semiconductor device also includes a source region and a drain region disposed within the substrate. The substrate includes a drift region laterally extending between the source region and the drain region. The semiconductor device further includes a first stressor layer disposed over the drift region of the substrate. The first stressor layer is configured to apply a first stress to the drift region of the substrate. In addition, the semiconductor device includes a second stressor layer disposed on the first stressor layer. The second stressor layer is configured to apply a second stress to the drift region of the substrate, and the first stress is opposite to the second stress.

Abstract: Various embodiments of inter-medium bridging are described. In one aspect, a method may involve a plurality of inter-domain bridging devices transmitting a message that describes inter-domain routing capability of the inter-domain bridging devices to a respective domain master of each of a plurality domains to which the inter-domain bridging devices are connected. The method may also involve the plurality of domain masters exchanging messages that describe the inter-domain routing capability of the plurality of inter-domain bridging devices connected to the respective domain of each domain master. The method may further involve each domain master determining one of the domain masters to serve as a global domain master for calculating inter-domain routing paths.

Abstract: Various embodiments of inter-medium bridging are provided. In one aspect, a method may involve an inter-medium bridging device bridging between a plurality of mediums of a network connected to the first inter-medium bridging device at the Data Link Layer of the Open Systems Interconnection (OSI) model. The plurality of mediums may comprise at least a first medium and a second medium that comprise separate communications channels. The method may also involve the inter-medium bridging device facilitating communications between an external device and the network through an application interface of the first inter-medium bridging device.

Abstract: Various embodiments of inter-medium bridging are described. In one aspect, a method may involve a plurality of inter-domain bridging devices transmitting a message that describes inter-domain routing capability of the inter-domain bridging devices to a respective domain master of each of a plurality domains to which the inter-domain bridging devices are connected. The method may also involve the plurality of domain masters exchanging messages that describe the inter-domain routing capability of the plurality of inter-domain bridging devices connected to the respective domain of each domain master. The method may further involve each domain master determining one of the domain masters to serve as a global domain master for calculating inter-domain routing paths.

Abstract: Various embodiments of inter-medium bridging are provided. In one aspect, a method may involve an inter-medium bridging device bridging between a plurality of mediums of a network connected to the first inter-medium bridging device at the Data Link Layer of the Open Systems Interconnection (OSI) model. The plurality of mediums may comprise at least a first medium and a second medium that comprise separate communications channels. The method may also involve the inter-medium bridging device facilitating communications between an external device and the network through an application interface of the first inter-medium bridging device.

Abstract: Various embodiments of inter-medium bridging are provided. In one aspect, a method may involve an inter-medium bridging device bridging between a plurality of mediums of a network connected to the first inter-medium bridging device at the Data Link Layer of the Open Systems Interconnection (OSI) model. The plurality of mediums may comprise at least a first medium and a second medium that comprise separate communications channels. The method may also involve the inter-medium bridging device facilitating communications between an external device and the network through an application interface of the first inter-medium bridging device.

Abstract: Various embodiments of inter-medium bridging are provided. In one aspect, a method may involve an inter-medium bridging device bridging between a plurality of mediums of a network connected to the first inter-medium bridging device at the Data Link Layer of the Open Systems Interconnection (OSI) model. The plurality of mediums may comprise at least a first medium and a second medium that comprise separate communications channels. The method may also involve the inter-medium bridging device facilitating communications between an external device and the network through an application interface of the first inter-medium bridging device.