Abstract: The present disclosure provides a magnetic core assembly fixture and a power module assembly method. The magnetic core assembly fixture includes a first pressing module and a second pressing module. The first pressing module includes a first base plate, first elastic members and latches. The first elastic members are disposed on the first base plate, and configured to abut against the first magnetic cores on a connected-panel structure of a power module. The latches are disposed on the first base plate, and configured to engage with the connected-panel structure. The second pressing module includes a second base plate, second elastic members and latches. The second elastic members are disposed on the second base plate, and configured to abut against the second magnetic cores on the connected-panel structure. The latches are disposed on the second base plate, and configured to engage with first pressing module.

Abstract: A butterfly door hinge and a vehicle having the same are provided, which includes a mounting base, a door connecting arm, a hinge connecting arm, and a limiting assembly, wherein the hinge connecting arm has one end hinged with the mounting base, and the other end hinged with the door connecting arm; the limiting assembly includes a planar limiting portion arranged on the mounting base, and a limiting body arranged on the door connecting arm, the limiting body having a spiral-type outer contour. In the disclosure, first the hinge connecting arm is used to constrain the door to swing along a fixed point, and then a posture of the door is constrained through a frictional fit between the limiting body and the planar limiting portion.

Abstract: An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.

Abstract: A PCB component used in a voltage regulator module and a method for manufacturing the voltage regulator module are disclosed. The PCB component includes a PCB and an inductor. The PCB includes a top surface and a bottom surface. The inductor includes a magnetic core and a winding. The winding runs through the magnetic core, and the winding forms an upper outlet terminal on the upper surface and a lower outlet terminal on the lower surface. The inductor is embedded in the PCB. A plurality of conductive layers are respectively disposed above the upper surface and below the lower surface. The upper outlet terminal and the lower outlet terminal are electrically connected to a power device and an external circuit board. The power device, the PCB component and the external circuit board are stacked vertically in sequence and connected through one reflow welding process to form a voltage regulator module.

Abstract: An auxiliary production clamp including a first clamp element, a second clamp element, a pivot shaft, an elastic component and an ejector assembly for a power module and a using method thereof are disclosed. The second clamp element includes a through opening running through a second pressing end and spatially corresponding to a first pressing end of the first clamp element. The pivot shaft is pivotally connected between the first clamp element and the second clamp element. The elastic component is sleeved on the pivot shaft to provide a pressing force. The ejector assembly is provided on the second pressing end and spatially corresponding to the through opening. In a working state, the first pressing end presses against a upper first magnetic core of the power module, and an abutting end of the ejector assembly is driven to run through the through opening and push against the second magnetic core.

Abstract: The present disclosure provides a press-fit test device and a press-fit module. The press-fit test device is configured for testing the electrical performance and the electrical connection of an electronic device under test. The press-fit test device includes a base and a press-fit module. The press-fit module is disposed on the base. The electronic device is positioned between the press-fit module and the test module of the base. When the press-fit module presses against the electronic device, the electronic device establishes an electrical connection to the test module, thereby generating test signals and enabling the electrical performance and connection testing to be performed.

Abstract: A compound represented by formula I and a racemate, a stereoisomer, a tautomer, an isotopic marker, nitrogen oxide, a solvate, a polymorph, a metabolite, an ester, a pharmaceutically acceptable salt or a prodrug thereof, a pharmaceutical composition comprising same, a preparation method therefor, and a pharmaceutical use thereof are described. The compound has the activity of inhibiting USP28 and/or USP25. The structure of the formula I is as follows.

Abstract: A power module and a manufacturing method are provided. The power module includes a first electronic assembly and a second electronic assembly. The first electronic assembly includes at least one pin. The second electronic assembly includes a first surface and a second surface opposite to each other. The first surface is more adjacent to the first electronic assembly than the second surface. A direction from the first surface toward the second surface is defined as a reference direction. The second electronic assembly includes a first region and a second region. The first region has a first thickness in the reference direction. The second region has a second thickness in the reference direction. The second thickness is less than the first thickness. The second region includes at least one through hole. The pin is penetrated through the at least one through hole and fixed on the second electronic assembly.

Abstract: According to embodiments of the disclosure, a method, an apparatus, a device and a storage medium for live streaming interface interaction are provided. The method includes receiving a predetermined request for a live streaming interface, the live streaming interface providing, in real time, an audio-visual content associated with a target session established in a live streaming room; causing a target interface corresponding to the predetermined request to be presented; and superimposing, on the target interface, a window associated with the live streaming interface, the window at least displaying description information associated with at least one participant in the target session. In this way, with embodiments of the disclosure, it may present relevant information of a target session (e.g., voice chat or video chat) established in the live streaming room that the user is interested in, thereby improving efficiency of the user in obtaining information in the live streaming room.

Abstract: The present invention relates to a compound represented by formula (I) or a racemate, a stereoisomer, a tautomer, an isotope-labeled form, an N-oxide, a solvate, a polymorph, a metabolite, an ester, a pharmaceutically acceptable salt or a prodrug thereof, a pharmaceutical composition comprising same, and pharmaceutical use thereof. The compound has the activity of inhibiting USP28 and/or USP25, and has potential pharmaceutical use as a medicament for treating a related disease such as a cancer, an inflammation, an autoimmune disease, a virus infection, and a bacterial infection.

Abstract: The present disclosure is related to an electronic module assembly structure including a system board, an electronic module and an adhesive material. The system board includes a first upper surface and a first lower surface opposite to each other. The electronic module spatially corresponds to the first upper surface and includes plurality leading pins and a carrier. Each leading pin has a soldering surface and is connected to the first upper surface through a first reflow soldering process. When the plurality leading pins are connected to the first upper surface, a height difference is formed between the carrying surface of the carrier and the soldering surfaces. The adhesive material is disposed on the carrying surface or the first upper surface. The carrier is connected with the first upper surface through the adhesive material, so that the electronic module is fixed to the first upper surface through the adhesive material.

Abstract: The present disclosure relates to a use of Genipin-1-?-D-gentiobioside in preparation of a drug, specifically for use in a drug that treats respiratory inflammatory injury caused by coronavirus, respiratory syncytial virus, or Mycoplasma pneumoniae infection. The present disclosure has discovered that Genipin-1-?-D-gentiobioside possesses the characteristics of reducing viral load, lung index, and inflammatory cytokines in lung tissue following coronavirus infection, respiratory syncytial virus infection, or Mycoplasma pneumoniae infection. It also demonstrates a significant protective effect against death caused by coronavirus infection.

Abstract: A vehicle emblem raising and retracting device includes a driving mechanism, a clutch mechanism and a linkage rod mechanism. Driving mechanism is assembled in vehicle body of vehicle. Clutch mechanism is assembled below a three-dimensional vehicle emblem and is selectively connected to driving mechanism; when clutch mechanism is engaged with driving mechanism, driving mechanism drives clutch mechanism to cause three-dimensional vehicle emblem to move up and down relative to vehicle body; when clutch mechanism is disengaged from driving mechanism, clutch mechanism and three-dimensional vehicle emblem descend to inside of vehicle body under effect of their own gravity.