Abstract: A signal integrity optimized package is provided. An apparatus includes a core comprising a top surface, bottom surface, and a first plane coupled to the top surface of the core. The first plane includes a first region circumscribed by a first ditch, wherein the first region includes an electrically conductive material, and wherein the first ditch is configured to electrically isolate the first region.

Abstract: A command to perform a memory access operation on a logical block address (LBA) associated with a blockstripe is received from a high-speed processing device. Data associated with a plurality of LBAs, including the LBA, is read from a memory device based on receiving the command. The data associated with the plurality of LBAs is stored in a data segment. A status of each LBA of the plurality of LBAs associated with the data segment is determined. Based on determining that one or more LBAs of the plurality of LBAs associated with the data segment correspond to a logical translation unit mismatch status, data associated with the one or more LBAs is provided to the high-speed processing device. An updated data segment comprising data corresponding to the LBA is received from the high-speed processing device. The memory access operation is performed on the memory device using the updated data segment.

Abstract: The electronic module includes a first circuit board and a second circuit board. The first circuit board includes a first side and a second side opposite to each other. Soldering pads are disposed on the second side. A second circuit board includes a third side and a fourth side opposite to each other. First connection components and second connection components are disposed on the third side, and solder balls are provided on the fourth side. First ends of the first and second connection components are fixed to the third side through a first reflow soldering process. Second ends of the first and second connection components are fixed to the soldering pads through a second reflow soldering process. A first space between adjacent ones of the first connection components is greater than a second space between adjacent ones of the second connection components.

Abstract: The present disclosure provides a magnetic core assembly fixture and a power module assembly method. The magnetic core assembly fixture includes a first pressing module and a second pressing module. The first pressing module includes a first base plate, first elastic members and latches. The first elastic members are disposed on the first base plate, and configured to abut against the first magnetic cores on a connected-panel structure of a power module. The latches are disposed on the first base plate, and configured to engage with the connected-panel structure. The second pressing module includes a second base plate, second elastic members and latches. The second elastic members are disposed on the second base plate, and configured to abut against the second magnetic cores on the connected-panel structure. The latches are disposed on the second base plate, and configured to engage with first pressing module.

Abstract: A butterfly door hinge and a vehicle having the same are provided, which includes a mounting base, a door connecting arm, a hinge connecting arm, and a limiting assembly, wherein the hinge connecting arm has one end hinged with the mounting base, and the other end hinged with the door connecting arm; the limiting assembly includes a planar limiting portion arranged on the mounting base, and a limiting body arranged on the door connecting arm, the limiting body having a spiral-type outer contour. In the disclosure, first the hinge connecting arm is used to constrain the door to swing along a fixed point, and then a posture of the door is constrained through a frictional fit between the limiting body and the planar limiting portion.

Abstract: An assembling method of an electronic module is disclosed and includes steps of: (a) providing a first circuit board including a first side and a second side; (b) providing a second circuit board including a third side and a fourth side, and a connection component connected to the third side; (c) providing a solder ball, and stacking the first circuit board, the second circuit board and the solder ball; and (d) performing a reflow soldering process to a stacked structure of the first circuit board, the second circuit board and the solder ball.

Abstract: A PCB component used in a voltage regulator module and a method for manufacturing the voltage regulator module are disclosed. The PCB component includes a PCB and an inductor. The PCB includes a top surface and a bottom surface. The inductor includes a magnetic core and a winding. The winding runs through the magnetic core, and the winding forms an upper outlet terminal on the upper surface and a lower outlet terminal on the lower surface. The inductor is embedded in the PCB. A plurality of conductive layers are respectively disposed above the upper surface and below the lower surface. The upper outlet terminal and the lower outlet terminal are electrically connected to a power device and an external circuit board. The power device, the PCB component and the external circuit board are stacked vertically in sequence and connected through one reflow welding process to form a voltage regulator module.

Abstract: An auxiliary production clamp including a first clamp element, a second clamp element, a pivot shaft, an elastic component and an ejector assembly for a power module and a using method thereof are disclosed. The second clamp element includes a through opening running through a second pressing end and spatially corresponding to a first pressing end of the first clamp element. The pivot shaft is pivotally connected between the first clamp element and the second clamp element. The elastic component is sleeved on the pivot shaft to provide a pressing force. The ejector assembly is provided on the second pressing end and spatially corresponding to the through opening. In a working state, the first pressing end presses against a upper first magnetic core of the power module, and an abutting end of the ejector assembly is driven to run through the through opening and push against the second magnetic core.

Abstract: The present disclosure provides a press-fit test device and a press-fit module. The press-fit test device is configured for testing the electrical performance and the electrical connection of an electronic device under test. The press-fit test device includes a base and a press-fit module. The press-fit module is disposed on the base. The electronic device is positioned between the press-fit module and the test module of the base. When the press-fit module presses against the electronic device, the electronic device establishes an electrical connection to the test module, thereby generating test signals and enabling the electrical performance and connection testing to be performed.

Abstract: A compound represented by formula I and a racemate, a stereoisomer, a tautomer, an isotopic marker, nitrogen oxide, a solvate, a polymorph, a metabolite, an ester, a pharmaceutically acceptable salt or a prodrug thereof, a pharmaceutical composition comprising same, a preparation method therefor, and a pharmaceutical use thereof are described. The compound has the activity of inhibiting USP28 and/or USP25. The structure of the formula I is as follows.