Patents by Inventor Kun Joo

Kun Joo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10963619
    Abstract: A method of designing a memory system, which includes a semiconductor device and a power supply circuit supplying power to the semiconductor device via a board power distribution network, includes analyzing power characteristics of respective components of the power supply circuit by using a power characteristic model of the power supply circuit, and analyzing power characteristics of the memory system. The power characteristic model of the power supply circuit includes an encrypted model.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: March 30, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kun Joo, Jaeyoung Shin
  • Publication number: 20200117769
    Abstract: A method of designing a memory system, which includes a semiconductor device and a power supply circuit supplying power to the semiconductor device via a board power distribution network, includes analyzing power characteristics of respective components of the power supply circuit by using a power characteristic model of the power supply circuit, and analyzing power characteristics of the memory system. The power characteristic model of the power supply circuit includes an encrypted model.
    Type: Application
    Filed: October 7, 2019
    Publication date: April 16, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kun JOO, Jaeyoung SHIN
  • Patent number: 8842443
    Abstract: A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.
    Type: Grant
    Filed: September 8, 2011
    Date of Patent: September 23, 2014
    Assignee: LG Electronics Inc.
    Inventors: Gukchan Lim, Seehyung Lee, Kun Joo, Sangmo Park, Jinsu Lee, Dongchul Jin, Sooyoul Yang, Yoonho Kim
  • Publication number: 20120243195
    Abstract: A printed circuit board (PCB) assembly includes a main PCB, a body PCB and a cover PCB. The main PCB has a first electronic component mounted thereon. The body PCB is mounted on the main PCB and includes a cavity therethrough. The first electronic component is positioned within the cavity when the body PCB is mounted on the main PCB. The cover PCB is aligned and mounted on the body PCB to cover the cavity. The cover PCB has a second electronic component mounted on a surface thereof. When the cover PCB is mounted on the body PCB, the second electronic component is positioned within the cavity and faces the main PCB. A method of fabricating the PCB assembly and a mobile terminal including the PCB assembly are also provided.
    Type: Application
    Filed: September 8, 2011
    Publication date: September 27, 2012
    Inventors: Gukchan Lim, Seehyung Lee, Kun Joo, Sangmo Park, Jinsu Lee, Dongchul Jin, Sooyoul Yang, Yoonho Kim