Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A locking device for use in a bicycle brake system in order to retain a hand-operated brake lever thereof in a braked state includes a locking member of resilient material, and a bearing device for bearing the locking member on the brake lever. The brake system includes a mounting seat fixed on a bicycle handlebar for connecting a brake cable to the brake lever. The brake lever has a first end mounted pivotally to the mounting seat and turnable about a first axis. The locking member includes a pressure bearing portion, a pair of spaced bracing arm portions which extend traversely and respectively from two ends of the pressure bearing portion, and a pair of leg portions which extend inwardly and respectively from the bracing arm portions. The bearing device includes a pair of pivot holes formed in two opposite lateral walls of the brake lever to receive the leg portions therein such that the pressure bearing portion and the leg portions of the locking member are generally parallel to the first axis.