Patents by Inventor Kun-Jun CHUNG

Kun-Jun CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200401745
    Abstract: The present invention relates to a structure analyzing method, characterized in that a computer is configured to execute a process, including steps of establishing a spatial-temporal discrete governing model for a discontinuous nonlinear structure based on a finite element analysis, in which the spatial-temporal discrete governing model includes an equivalent nodal secant damping coefficient and an equivalent nodal secant stiffness coefficient at current time step; repeatedly calculating until convergence a secant damping coefficient slope and a secant stiffness coefficient slope based on known parameters, the known equivalent nodal secant damping coefficient and the known equivalent nodal secant stiffness coefficient at previous time step through a computer iteration algorithm; and replacing the equivalent nodal secant damping coefficient and the equivalent nodal secant stiffness coefficient by the converged secant damping coefficient slope and the converged secant stiffness coefficient slope acting as initi
    Type: Application
    Filed: November 19, 2019
    Publication date: December 24, 2020
    Applicant: National Central University
    Inventors: Tzu-Ying LEE, Wen-Hsiao HUNG, Kun-Jun CHUNG, Hao CHANG