Abstract: A module comprises a tray, a mechanical switch, and a linkage system. The tray is configured to receive a circuit board thereon. The mechanical switch is mounted to the tray and movable between an unsecured position and a secured position. The linkage system is mechanically coupled to the mechanical switch, and moves between an unsecured configuration and a secured configuration in response to the mechanical switch moving between the unsecured position and the secured position. When the module is coupled to a computing device and the linkage system is in the secured configuration, the linkage system engages the computing device, such that the module is locked to the computing device. When the module is coupled to the computing device and the linkage system is in the unsecured configuration, the linkage system is disengaged from the computing device, such that the module is unlocked from the computing device.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: A method for manufacturing a semiconductor structure is provided. The method includes: providing a substrate and a dielectric layer on the substrate; forming a hole in the dielectric layer; forming an initial barrier material layer and a conductive layer on an upper surface of the dielectric layer and in the hole; removing part of the initial barrier material layer and part of the conductive layer to form a barrier material layer and a via element in the hole respectively and expose the upper surface of the dielectric layer. An upper surface of the barrier material layer is higher than the upper surface of the dielectric layer.

Abstract: A surge protector includes a first surge suppression assembly comprising a first conductive layer comprising an arm, an extension distal to the arm and having toothed edges, and a substantially C-shaped member projecting out of the extension and having toothed edges, and a substantially circular member with toothed edges formed at an open end of the extension; a second conductive layer comprising an arm including a terminal, an extension being distal the arm, a first substantially C-shaped member having toothed edges, and a second substantially C-shaped member at an open end of the extension wherein the first substantially C-shaped member, the substantially C-shaped member, the second substantially C-shaped member, and the substantially circular member are arranged concentrically; and an overvoltage protection assembly interconnecting the arm and the terminal. The overvoltage protection assembly is electrically connected to the first surge suppression assembly.

Abstract: A surge protector includes a first surge suppression assembly comprising a first conductive layer comprising an arm, an extension distal to the arm and having toothed edges, and a substantially C-shaped member projecting out of the extension and having toothed edges, and a substantially circular member with toothed edges formed at an open end of the extension; a second conductive layer comprising an arm including a terminal, an extension being distal the arm, a first substantially C-shaped member having toothed edges, and a second substantially C-shaped member at an open end of the extension wherein the first substantially C-shaped member, the substantially C-shaped member, the second substantially C-shaped member, and the substantially circular member are arranged concentrically; and an overvoltage protection assembly interconnecting the arm and the terminal. The overvoltage protection assembly is electrically connected to the first surge suppression assembly.