Abstract: The present invention relates to a light-emitting diode (LED) which comprises a light-emitting layer, an upper electrode, a lower electrode, a first semiconductor layer, a second semiconductor layer, a third semiconductor layer, and a low refractive index dielectric layer. The upper electrode and the lower electrode are respectively disposed on two opposite sides of the light-emitting layer. The first semiconductor layer is disposed between the light-emitting layer and the upper electrode. The second semiconductor layer is disposed between the light-emitting layer and the lower electrode. The third semiconductor layer is disposed between the second semiconductor layer and the lower electrode. The low refractive index dielectric layer is disposed to surround the lower electrode. The upper electrode is vertically overlapped with the lower electrode and the first semiconductor layer and the third semiconductor layer are electrically opposite to the second semiconductor layer.

Abstract: An electroluminescence device, including an epitaxial layer, a first contact electrode, a bonding layer, a substrate, a first metal pad, a second contact electrode and a second metal pad, is provided. The epitaxial layer has a trench which vertically divides the epitaxial layer into a first region and a second region so that the first region and the second region are separated from each other. The first contact electrode is disposed over the epitaxial layer and has an aperture. The bonding layer is disposed over the first contact electrode. The substrate is disposed over the bonding layer. The first metal pad is disposed below the first region and extends vertically to be electrically connected to the first contact electrode. The second contact electrode is disposed below the second region. The second metal pad is disposed below the second region with the second contact electrode therebetween.

Abstract: An illuminant component includes a carrier, a plurality of connecting pieces, a LED die, a first fluorescent layer, and a second fluorescent layer. The carrier includes a die-bonding area and the connecting pieces are placed on the die-bonding area. The LED die is placed on the die-bonding area and electrically connected to the connecting pieces. The first fluorescent layer placed on a top surface of the LED die includes a first light-transparent adhesive and a first phosphor powder uniformly suspended within the first light-transparent adhesive. The second fluorescent layer covering the first fluorescent layer and the LED die includes a second light-transparent adhesive and a second phosphor powder uniformly suspended within the second light-transparent adhesive. In the same quantity of the first light-transparent adhesive and the second light-transparent adhesive, the quantity of the second phosphor powder is less than that of the first phosphor powder.