Abstract: An illuminant component includes a carrier, a plurality of connecting pieces, a LED die, a first fluorescent layer, and a second fluorescent layer. The carrier includes a die-bonding area and the connecting pieces are placed on the die-bonding area. The LED die is placed on the die-bonding area and electrically connected to the connecting pieces. The first fluorescent layer placed on a top surface of the LED die includes a first light-transparent adhesive and a first phosphor powder uniformly suspended within the first light-transparent adhesive. The second fluorescent layer covering the first fluorescent layer and the LED die includes a second light-transparent adhesive and a second phosphor powder uniformly suspended within the second light-transparent adhesive. In the same quantity of the first light-transparent adhesive and the second light-transparent adhesive, the quantity of the second phosphor powder is less than that of the first phosphor powder.