Patents by Inventor KUN-LIN CHIH

KUN-LIN CHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240344783
    Abstract: A cooling structure having a metal plating layer is provided with a substrate, a first metal plating layer and a second metal plating layer that are made of materials different from each other and formed on the substrate by different processes. The first metal plating layer is formed on the substrate by a wetting process. The second metal plating layer having a thickness ranging from 0.1 ?m to 5 ?m is formed on the first metal plating layer by a sputtering process. The second metal plating layer includes at least three blocks arranged at intervals, and at least two adjacent ones of the at least three blocks have a distance therebetween that is not equal to a distance between another two adjacent ones of the at least three blocks.
    Type: Application
    Filed: April 13, 2023
    Publication date: October 17, 2024
    Inventors: CHING-MING YANG, KUN-LIN CHIH, YI-SHENG LU, TZE-YANG YEH
  • Publication number: 20240266921
    Abstract: A cooler having an optimized coating structure for an electric vehicle power module is provided. The cooler includes a metal cooling substrate and a coating structure. The coating structure has at least a barrier layer and a function layer. The barrier layer is formed on the metal cooling substrate. The barrier layer is a nickel coating layer or a nickel alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m. The function layer is a silver/silver alloy coating layer, or a copper/copper alloy coating layer having a thickness of between 0.1 ?m and 0.5 ?m.
    Type: Application
    Filed: February 2, 2023
    Publication date: August 8, 2024
    Inventors: TZE-YANG YEH, YU-HSIANG LEE, HSUEH-LIN LU, KUN-LIN CHIH