Patents by Inventor Kun MAO

Kun MAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250148043
    Abstract: A mathematical model solving method includes obtaining a problem description from a user; extracting a first feature in the problem description using a first artificial intelligence (AI) model; processing the first feature to obtain target data, where the target data includes a target model obtained by optimizing the problem description based on the first feature and/or a solving approach generated based on the first feature; and calculating, based on the target data, a value of each decision variable that meets the constraint in the problem description.
    Type: Application
    Filed: January 8, 2025
    Publication date: May 8, 2025
    Inventors: Jianshu Li, Muming Yang, Kun Mao
  • Patent number: 12266684
    Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.
    Type: Grant
    Filed: March 21, 2022
    Date of Patent: April 1, 2025
    Assignee: Taiwan Semicondcutor Manufacturing Company, Ltd.
    Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
  • Patent number: 12155368
    Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: November 26, 2024
    Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
    Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang, Yuefei Yang
  • Publication number: 20240282109
    Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.
    Type: Application
    Filed: May 1, 2024
    Publication date: August 22, 2024
    Inventors: Chong LI, Zhen ZHANG, Kun MAO
  • Publication number: 20240243723
    Abstract: A bulk acoustic resonator includes a stack structures, including a piezoelectric layer having a first side and an opposing second side; a first electrode disposed under the first side of the piezoelectric layer; a second electrode disposed over the second side of the piezoelectric layer; and a multistep structure with a bottom part having first dimensions disposed between the piezoelectric layer and second electrode and a second part having second dimensions, different from the first dimensions, disposed between the bottom part of the multistep structure and the second electrode. An active region of the stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode, and the multistep structure is arranged to provide destructive interference of lateral acoustic waves within the bulk acoustic resonator.
    Type: Application
    Filed: January 17, 2024
    Publication date: July 18, 2024
    Inventors: Romain Gerbe, Liping D. Hou, Shing-Kuo Wang, Yuefei Yang, Kun-Mao Pan, Andy Chien-Hsiang Chen
  • Patent number: 11995890
    Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: May 28, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Chong Li, Zhen Zhang, Kun Mao
  • Patent number: 11904581
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.
    Type: Grant
    Filed: August 11, 2022
    Date of Patent: February 20, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsin Shen, Yu-Chi Wang, Ming-Chia Yang, Yu-Bing Liou, Wei-Hong Chang, Yun-Han Lin, Hsin-Yi Hsu, Yun-Chung Teng, Chia-Jung Lu, Yi-Hsuan Lee, Jian-Wei Lin, Kun-Mao Kuo, Ching-Mei Chen
  • Patent number: 11909373
    Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.
    Type: Grant
    Filed: October 15, 2020
    Date of Patent: February 20, 2024
    Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
    Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
  • Patent number: 11863033
    Abstract: The present disclosure provides a displacement detection circuit of a maglev rotor system and a displacement self-sensing system thereof.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: January 2, 2024
    Assignees: Ningbo Institute of Technology, Beihang University, Beihang University
    Inventors: Shiqiang Zheng, Shitong Wei, Tong Wen, Kun Wang, Yun Le, Kun Mao, Di Wang
  • Publication number: 20230368051
    Abstract: The present disclosure relates to operations research and optimization methods, apparatuses, and computing devices One example method includes obtaining a hyperparameter of an operations research and optimization algorithm based on a feature of data of a current application scenario and a hyperparameter inference model. Optimization calculation is performed on the data of the current application scenario, according to the operations research and optimization algorithm and based on the obtained hyperparameter of the operations research and optimization algorithm, to obtain a calculation result, where the hyperparameter inference model is obtained through dynamic training based on training data obtained in a historical application scenario and training data obtained in the current application scenario.
    Type: Application
    Filed: July 27, 2023
    Publication date: November 16, 2023
    Inventors: Yalong HU, Kun MAO, Zhenping LI
  • Publication number: 20230299124
    Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.
    Type: Application
    Filed: March 21, 2022
    Publication date: September 21, 2023
    Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
  • Patent number: 11764750
    Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: September 19, 2023
    Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
    Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang
  • Publication number: 20230117718
    Abstract: The present disclosure provides a displacement detection circuit of a maglev rotor system and a displacement self-sensing system thereof.
    Type: Application
    Filed: July 27, 2020
    Publication date: April 20, 2023
    Applicants: Ningbo Institute of Technology, Beihang University, Beihang University
    Inventors: Shiqiang Zheng, Shitong Wei, Tong Wen, Kun Wang, Yun Le, Kun Mao, Di Wang
  • Publication number: 20220388293
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.
    Type: Application
    Filed: August 11, 2022
    Publication date: December 8, 2022
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
  • Patent number: 11458715
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: October 4, 2022
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsin-Hsin Shen, Yu-Chi Wang, Ming-Chia Yang, Yu-Bing Liou, Wei-Hong Chang, Yun-Han Lin, Hsin-Yi Hsu, Yun-Chung Teng, Chia-Jung Lu, Yi-Hsuan Lee, Jian-Wei Lin, Kun-Mao Kuo, Ching-Mei Chen
  • Publication number: 20210294852
    Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.
    Type: Application
    Filed: June 3, 2021
    Publication date: September 23, 2021
    Inventors: Chong LI, Zhen ZHANG, Kun MAO
  • Publication number: 20210250012
    Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.
    Type: Application
    Filed: April 26, 2021
    Publication date: August 12, 2021
    Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang
  • Publication number: 20210111702
    Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.
    Type: Application
    Filed: October 15, 2020
    Publication date: April 15, 2021
    Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
  • Publication number: 20200247101
    Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.
    Type: Application
    Filed: November 6, 2019
    Publication date: August 6, 2020
    Applicant: Industrial Technology Research Institute
    Inventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
  • Publication number: 20200028482
    Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.
    Type: Application
    Filed: June 27, 2019
    Publication date: January 23, 2020
    Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang