Patents by Inventor Kun MAO
Kun MAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20250148043Abstract: A mathematical model solving method includes obtaining a problem description from a user; extracting a first feature in the problem description using a first artificial intelligence (AI) model; processing the first feature to obtain target data, where the target data includes a target model obtained by optimizing the problem description based on the first feature and/or a solving approach generated based on the first feature; and calculating, based on the target data, a value of each decision variable that meets the constraint in the problem description.Type: ApplicationFiled: January 8, 2025Publication date: May 8, 2025Inventors: Jianshu Li, Muming Yang, Kun Mao
-
Patent number: 12266684Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.Type: GrantFiled: March 21, 2022Date of Patent: April 1, 2025Assignee: Taiwan Semicondcutor Manufacturing Company, Ltd.Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
-
Patent number: 12155368Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.Type: GrantFiled: April 26, 2021Date of Patent: November 26, 2024Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLCInventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang, Yuefei Yang
-
Publication number: 20240282109Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.Type: ApplicationFiled: May 1, 2024Publication date: August 22, 2024Inventors: Chong LI, Zhen ZHANG, Kun MAO
-
Publication number: 20240243723Abstract: A bulk acoustic resonator includes a stack structures, including a piezoelectric layer having a first side and an opposing second side; a first electrode disposed under the first side of the piezoelectric layer; a second electrode disposed over the second side of the piezoelectric layer; and a multistep structure with a bottom part having first dimensions disposed between the piezoelectric layer and second electrode and a second part having second dimensions, different from the first dimensions, disposed between the bottom part of the multistep structure and the second electrode. An active region of the stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode, and the multistep structure is arranged to provide destructive interference of lateral acoustic waves within the bulk acoustic resonator.Type: ApplicationFiled: January 17, 2024Publication date: July 18, 2024Inventors: Romain Gerbe, Liping D. Hou, Shing-Kuo Wang, Yuefei Yang, Kun-Mao Pan, Andy Chien-Hsiang Chen
-
Patent number: 11995890Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.Type: GrantFiled: June 3, 2021Date of Patent: May 28, 2024Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Chong Li, Zhen Zhang, Kun Mao
-
Patent number: 11904581Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.Type: GrantFiled: August 11, 2022Date of Patent: February 20, 2024Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Yu-Chi Wang, Ming-Chia Yang, Yu-Bing Liou, Wei-Hong Chang, Yun-Han Lin, Hsin-Yi Hsu, Yun-Chung Teng, Chia-Jung Lu, Yi-Hsuan Lee, Jian-Wei Lin, Kun-Mao Kuo, Ching-Mei Chen
-
Patent number: 11909373Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.Type: GrantFiled: October 15, 2020Date of Patent: February 20, 2024Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLCInventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
-
Patent number: 11863033Abstract: The present disclosure provides a displacement detection circuit of a maglev rotor system and a displacement self-sensing system thereof.Type: GrantFiled: July 27, 2020Date of Patent: January 2, 2024Assignees: Ningbo Institute of Technology, Beihang University, Beihang UniversityInventors: Shiqiang Zheng, Shitong Wei, Tong Wen, Kun Wang, Yun Le, Kun Mao, Di Wang
-
Publication number: 20230368051Abstract: The present disclosure relates to operations research and optimization methods, apparatuses, and computing devices One example method includes obtaining a hyperparameter of an operations research and optimization algorithm based on a feature of data of a current application scenario and a hyperparameter inference model. Optimization calculation is performed on the data of the current application scenario, according to the operations research and optimization algorithm and based on the obtained hyperparameter of the operations research and optimization algorithm, to obtain a calculation result, where the hyperparameter inference model is obtained through dynamic training based on training data obtained in a historical application scenario and training data obtained in the current application scenario.Type: ApplicationFiled: July 27, 2023Publication date: November 16, 2023Inventors: Yalong HU, Kun MAO, Zhenping LI
-
Publication number: 20230299124Abstract: A method of forming a capacitor is disclosed. The method includes forming a portion of a metallization layer on a substrate, forming a via layer on the substrate, and forming a first electrode between the metallization layer and the via layer, where the first electrode is electrically connected to the metallization layer. The method also includes forming a second electrode between the metallization layer and the via layer, where the second electrode is electrically connected to the via layer, and forming a dielectric layer between the first electrode and the second electrode, where the first electrode is not electrically connected to any other conductors other than through the metallization layer, and where the second electrode is not electrically connected to any conductors other than through the via layer.Type: ApplicationFiled: March 21, 2022Publication date: September 21, 2023Inventors: Pei-Jen Wang, Ching-Hung Kao, Tzy-Kuang Lee, Meng-Chang Ho, Kun-Mao Wu
-
Patent number: 11764750Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.Type: GrantFiled: June 27, 2019Date of Patent: September 19, 2023Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLCInventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang
-
Publication number: 20230117718Abstract: The present disclosure provides a displacement detection circuit of a maglev rotor system and a displacement self-sensing system thereof.Type: ApplicationFiled: July 27, 2020Publication date: April 20, 2023Applicants: Ningbo Institute of Technology, Beihang University, Beihang UniversityInventors: Shiqiang Zheng, Shitong Wei, Tong Wen, Kun Wang, Yun Le, Kun Mao, Di Wang
-
Publication number: 20220388293Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.Type: ApplicationFiled: August 11, 2022Publication date: December 8, 2022Applicant: Industrial Technology Research InstituteInventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
-
Patent number: 11458715Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.Type: GrantFiled: November 6, 2019Date of Patent: October 4, 2022Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Hsin-Hsin Shen, Yu-Chi Wang, Ming-Chia Yang, Yu-Bing Liou, Wei-Hong Chang, Yun-Han Lin, Hsin-Yi Hsu, Yun-Chung Teng, Chia-Jung Lu, Yi-Hsuan Lee, Jian-Wei Lin, Kun-Mao Kuo, Ching-Mei Chen
-
Publication number: 20210294852Abstract: A data processing method and apparatus are described. The data processing apparatus obtains an input tensor corresponding to input data. The data processing apparatus determines M1 first-type tensor blocks and M2 second-type tensor blocks. P processing units in the data processing apparatus process the M tensor blocks concurrently. In a first time period, all of the tensor blocks that are processed concurrently by the P processing units are first-type tensor blocks. In a second time period, all of the tensor blocks that are processed concurrently by the P processing units are second-type tensor blocks.Type: ApplicationFiled: June 3, 2021Publication date: September 23, 2021Inventors: Chong LI, Zhen ZHANG, Kun MAO
-
Publication number: 20210250012Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.Type: ApplicationFiled: April 26, 2021Publication date: August 12, 2021Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang
-
Publication number: 20210111702Abstract: A bulk acoustic wave (BAW) resonator includes a substrate, a stack over the substrate and including a piezoelectric layer disposed between two electrode layers, and one or more edge frames. The one or more edge frames can be a raised metal frame extending parallel to a periphery of an active region of the stack and has one or more slanted cuts such that the edge frame does not form a closed loop and loss of acoustic energy in the active region through the one or more cuts is reduced, minimized or prevented. Alternatively or additionally, the one or more edge frames include a recessed edge frame in the form of a trench in the piezoelectric layer extending parallel to a boundary of the active region, and may further include a second edge frame formed on the first electrode and embedded in the piezoelectric layer.Type: ApplicationFiled: October 15, 2020Publication date: April 15, 2021Inventors: Shing-Kuo Wang, Liping D. Hou, Kun-Mao Pan, Andy Chien-Hsiang Chen, Robert B. Stokes
-
Publication number: 20200247101Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer; and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution 1:0.01-1. Moreover, the second polymer solution consists of a second hydrophilic solution.Type: ApplicationFiled: November 6, 2019Publication date: August 6, 2020Applicant: Industrial Technology Research InstituteInventors: Hsin-Hsin SHEN, Yu-Chi WANG, Ming-Chia YANG, Yu-Bing LIOU, Wei-Hong CHANG, Yun-Han LIN, Hsin-Yi HSU, Yun-Chung TENG, Chia-Jung LU, Yi-Hsuan LEE, Jian-Wei LIN, Kun-Mao KUO, Ching-Mei CHEN
-
Publication number: 20200028482Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack includes a first electrode that is coupled to a first side of a piezoelectric layer and a second electrode that is coupled to a second side of the piezoelectric layer. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode. A cavity frame is coupled to the first electrode and to the substrate. The cavity frame forms a perimeter around a cavity. Optionally, a heat dissipating frame is formed and coupled to the second electrode. The cavity frame and/or the heat dissipating frame improve the thermal stability of the bulk acoustic resonator.Type: ApplicationFiled: June 27, 2019Publication date: January 23, 2020Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang