Abstract: A cooling device for rack servers and cooling method for rack servers are provided. The cooling device for rack servers includes an environmental temperature sensor, a humidity sensor, a coolant temperature sensor, an electronic valve, and a controller. The controller is configured to compute a dew point temperature according to an ambient temperature and an ambient humidity sensed by the environmental temperature sensor and the humidity sensor, compute a temperature difference between a outlet-liquid temperature of a coolant and the dew point temperature, and control an opening of the electronic valve according to the temperature difference to adjust a liquid flow of the coolant outputted, such that the outlet-liquid temperature dynamically changes following the adjustment of the liquid flow.

Abstract: A precooling device integrated with a cooling distribution unit and a server liquid cooling system are provided. The precooling device includes a liquid cooling row, an adapter assembly, and a cooling distribution unit. The adapter assembly includes a flow joining row and a flow distribution row. The cooling distribution unit supplies a refrigerant from an interior thereof, and includes an outlet and an inlet communicating with the interior. The outlet communicates with the flow distribution row of the adapter assembly to deliver the refrigerant for heat exchange. The refrigerant being performed the heat exchange returns to the liquid cooling row through the flow joining row of the adapter assembly for precooling, and then returns from the liquid cooling row to the cooling distribution unit through the inlet. The refrigerant is precooled before returning to the cooling distribution unit.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a stacked gate structure, and a wall structure. The stacked gate structure is on the substrate and extending along a first direction. The wall structure is on the substrate and laterally aside the stacked gate structure. The wall structure extends along the first direction and a second direction perpendicular to the first direction. The stacked gate structure is overlapped with the wall structure in the first direction and the second direction.

Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.

Abstract: An interposer comprises a first conductive wire having a first terminal and a second terminal, a first oxide layer, and an encapsulant. The first oxide layer covers the first conductive wire and exposes the first terminal and the second terminal of the first conductive wire. The encapsulant covers the first oxide layer and exposes the first terminal and the second terminal of the first conductive wire.

Abstract: An interposer comprises a first conductive wire having a first terminal and a second terminal, a first oxide layer, and an encapsulant. The first oxide layer covers the first conductive wire and exposes the first terminal and the second terminal of the first conductive wire. The encapsulant covers the first oxide layer and exposes the first terminal and the second terminal of the first conductive wire.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A method comprises computing respective regression models for each of a plurality of failure bins based on a plurality of failures identified during wafer electrical tests. Each regression model outputs a wafer yield measure as a function of a plurality of device performance variables. For each failure bin, sensitivity of the wafer yield measure to each of the plurality of device performance variables is determined, and the device performance variables are ranked with respect to sensitivity of the wafer yield measure. A subset of the device performance variables which have highest rankings and which have less than a threshold correlation with each other are selected. The wafer yield measures for each failure bin corresponding to one of the selected subset of device performance variables are combined, to provide a combined wafer yield measure. At least one new process parameter value is selected to effect a change in the one device performance variable, based on the combined wafer yield measure.

Abstract: Provided is a CoCrPt-based alloy sputtering target containing cobalt (Co), chromium (Cr), platinum (Pt), cobalt oxide and non-magnetic oxide composition, wherein the lengths of ceramic phases of Cr2O3 and Co(Cr)—X—O formed in the sputtering targets are respectively less than 3 ?m (“X” represents the metal element of the non-magnetic oxide). The sputtering target is obtained via controlling suitable composition proportion of the prealloy powder with Cr and the sintering factor to decrease the size of ceramic phases of Cr2O3 and Co(Cr)—X—O. Sputtering targets made by the methods of the present invention decrease the arcing effects and unnecessary formation of particles upon sputtering in addition to making the components of the sputtering targets distribute more uniformly therein.

Abstract: A method comprises computing respective regression models for each of a plurality of failure bins based on a plurality of failures identified during wafer electrical tests. Each regression model outputs a wafer yield measure as a function of a plurality of device performance variables. For each failure bin, sensitivity of the wafer yield measure to each of the plurality of device performance variables is determined, and the device performance variables are ranked with respect to sensitivity of the wafer yield measure. A subset of the device performance variables which have highest rankings and which have less than a threshold correlation with each other are selected. The wafer yield measures for each failure bin corresponding to one of the selected subset of device performance variables are combined, to provide a combined wafer yield measure. At least one new process parameter value is selected to effect a change in the one device performance variable, based on the combined wafer yield measure.

Abstract: The present invention discloses a zoom lens assembly with capability of assuring concentricity of at least a lens group even during activity. The zoom lens assembly includes a plurality of optical lenses, at least two internal barrels, a lens holder and an alignment element wherein the lenses can be divided into at least two lens groups. The two internal barrels are used to respectively retain corresponding lens group therein to define a first and second lens sets. The lens holder is utilized to accommodate the first and second lens set therein. After twice alignment procedures in an assembled method, an internal barrel retained with one lens group is accommodated within the other internal barrel retained with another lens group to be precisely coupled. The two lens sets with mating structures are coupled to a guiding groove defined on the lens holder thereby the lens sets can slide inside the lens holder.

Abstract: A portable electronic device includes a body and a signal transmitter/receiver. The body has a display having a first display mode and a second display mode. The signal transmitter/receiver is pivotally connected to the body through the first pivot and the second pivot. The transmitter/receiver may be rotated to a first signal receiving position or a second signal receiving position corresponding to the first display mode or the second display mode. Therefore, signals can be better transmitted or received when the display is in a given display mode.

Abstract: A device monitor for RF and DC measurement. The device monitor comprises a plurality of test cells arranged substantially in line. The test cell comprises a device under test, an input pad, an output pad and at least two reference pads. The input pad is electrically connected to an input of the DUT. The output pad is electrically connected to an output of the DUT. At least one of the reference pads is electrically connected to the DUT to provide a reference level. The input pad, the output pad and the reference pads are arranged substantially in line and at least one of the reference pads is located between the input pad and the output pad.

Abstract: The present invention discloses a zoom lens assembly with capability of assuring concentricity of at least a lens group even during activity. The zoom lens assembly includes a plurality of optical lenses, at least two internal barrels, a lens holder and an alignment element wherein the lenses can be divided into at least two lens groups. The two internal barrels are used to respectively retain corresponding lens group therein to define a first and second lens sets. The lens holder is utilized to accommodate the first and second lens set therein. After twice alignment procedures in an assembled method, an internal barrel retained with one lens group is accommodated within the other internal barrel retained with another lens group to be precisely coupled. The two lens sets with mating structures are coupled to a guiding groove defined on the lens holder thereby the lens sets can slide inside the lens holder.

Abstract: A device monitor for RF and DC measurement. The device monitor comprises a plurality of test cells arranged substantially in line. The test cell comprises a device under test, an input pad, an output pad and at least two reference pads. The input pad is electrically connected to an input of the DUT. The output pad is electrically connected to an output of the DUT. At least one of the reference pads is electrically connected to the DUT to provide a reference level. The input pad, the output pad and the reference pads are arranged substantially in line and at least one of the reference pads is located between the input pad and the output pad.