Abstract: An interposer comprises a first conductive wire having a first terminal and a second terminal, a first oxide layer, and an encapsulant. The first oxide layer covers the first conductive wire and exposes the first terminal and the second terminal of the first conductive wire. The encapsulant covers the first oxide layer and exposes the first terminal and the second terminal of the first conductive wire.

Abstract: An interposer comprises a first conductive wire having a first terminal and a second terminal, a first oxide layer, and an encapsulant. The first oxide layer covers the first conductive wire and exposes the first terminal and the second terminal of the first conductive wire. The encapsulant covers the first oxide layer and exposes the first terminal and the second terminal of the first conductive wire.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A flexible environmental sensitive electronic device package including a flexible electronic device, a thin film encapsulation (TFE) and a sealing member is provided. The TFE covers the flexible electronic device as well as the sealing member covers the TFE and the flexible electronic device. The sealing member includes a first portion and a second portion, wherein the first portion covers the flexible electronic device and the TFE, and the second portion covers the first portion. Young's modulus of the second portion is between the 0 MPa and 100 MPa. Young's modulus of the first portion is greater than that of the second portion. The thickness of the first portion is less than that of the second portion.

Abstract: A method comprises computing respective regression models for each of a plurality of failure bins based on a plurality of failures identified during wafer electrical tests. Each regression model outputs a wafer yield measure as a function of a plurality of device performance variables. For each failure bin, sensitivity of the wafer yield measure to each of the plurality of device performance variables is determined, and the device performance variables are ranked with respect to sensitivity of the wafer yield measure. A subset of the device performance variables which have highest rankings and which have less than a threshold correlation with each other are selected. The wafer yield measures for each failure bin corresponding to one of the selected subset of device performance variables are combined, to provide a combined wafer yield measure. At least one new process parameter value is selected to effect a change in the one device performance variable, based on the combined wafer yield measure.

Abstract: Provided is a CoCrPt-based alloy sputtering target containing cobalt (Co), chromium (Cr), platinum (Pt), cobalt oxide and non-magnetic oxide composition, wherein the lengths of ceramic phases of Cr2O3 and Co(Cr)—X—O formed in the sputtering targets are respectively less than 3 ?m (“X” represents the metal element of the non-magnetic oxide). The sputtering target is obtained via controlling suitable composition proportion of the prealloy powder with Cr and the sintering factor to decrease the size of ceramic phases of Cr2O3 and Co(Cr)—X—O. Sputtering targets made by the methods of the present invention decrease the arcing effects and unnecessary formation of particles upon sputtering in addition to making the components of the sputtering targets distribute more uniformly therein.

Abstract: A method comprises computing respective regression models for each of a plurality of failure bins based on a plurality of failures identified during wafer electrical tests. Each regression model outputs a wafer yield measure as a function of a plurality of device performance variables. For each failure bin, sensitivity of the wafer yield measure to each of the plurality of device performance variables is determined, and the device performance variables are ranked with respect to sensitivity of the wafer yield measure. A subset of the device performance variables which have highest rankings and which have less than a threshold correlation with each other are selected. The wafer yield measures for each failure bin corresponding to one of the selected subset of device performance variables are combined, to provide a combined wafer yield measure. At least one new process parameter value is selected to effect a change in the one device performance variable, based on the combined wafer yield measure.

Abstract: The present invention discloses a zoom lens assembly with capability of assuring concentricity of at least a lens group even during activity. The zoom lens assembly includes a plurality of optical lenses, at least two internal barrels, a lens holder and an alignment element wherein the lenses can be divided into at least two lens groups. The two internal barrels are used to respectively retain corresponding lens group therein to define a first and second lens sets. The lens holder is utilized to accommodate the first and second lens set therein. After twice alignment procedures in an assembled method, an internal barrel retained with one lens group is accommodated within the other internal barrel retained with another lens group to be precisely coupled. The two lens sets with mating structures are coupled to a guiding groove defined on the lens holder thereby the lens sets can slide inside the lens holder.

Abstract: A portable electronic device includes a body and a signal transmitter/receiver. The body has a display having a first display mode and a second display mode. The signal transmitter/receiver is pivotally connected to the body through the first pivot and the second pivot. The transmitter/receiver may be rotated to a first signal receiving position or a second signal receiving position corresponding to the first display mode or the second display mode. Therefore, signals can be better transmitted or received when the display is in a given display mode.

Abstract: A device monitor for RF and DC measurement. The device monitor comprises a plurality of test cells arranged substantially in line. The test cell comprises a device under test, an input pad, an output pad and at least two reference pads. The input pad is electrically connected to an input of the DUT. The output pad is electrically connected to an output of the DUT. At least one of the reference pads is electrically connected to the DUT to provide a reference level. The input pad, the output pad and the reference pads are arranged substantially in line and at least one of the reference pads is located between the input pad and the output pad.

Abstract: The present invention discloses a zoom lens assembly with capability of assuring concentricity of at least a lens group even during activity. The zoom lens assembly includes a plurality of optical lenses, at least two internal barrels, a lens holder and an alignment element wherein the lenses can be divided into at least two lens groups. The two internal barrels are used to respectively retain corresponding lens group therein to define a first and second lens sets. The lens holder is utilized to accommodate the first and second lens set therein. After twice alignment procedures in an assembled method, an internal barrel retained with one lens group is accommodated within the other internal barrel retained with another lens group to be precisely coupled. The two lens sets with mating structures are coupled to a guiding groove defined on the lens holder thereby the lens sets can slide inside the lens holder.

Abstract: A device monitor for RF and DC measurement. The device monitor comprises a plurality of test cells arranged substantially in line. The test cell comprises a device under test, an input pad, an output pad and at least two reference pads. The input pad is electrically connected to an input of the DUT. The output pad is electrically connected to an output of the DUT. At least one of the reference pads is electrically connected to the DUT to provide a reference level. The input pad, the output pad and the reference pads are arranged substantially in line and at least one of the reference pads is located between the input pad and the output pad.