Patents by Inventor Kun-Ming Tsai
Kun-Ming Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11923205Abstract: A method for manufacturing a semiconductor device includes: providing a wafer-bonding stack structure having a sidewall layer and an exposed first component layer; forming a photoresist layer on the first component layer; performing an edge trimming process to at least remove the sidewall layer; and removing the photoresist layer. In this way, contaminant particles generated from the blade during the edge trimming process may fall on the photoresist layer but not fall on the first component layer, so as to protect the first component layer from being contaminated.Type: GrantFiled: December 17, 2021Date of Patent: March 5, 2024Assignee: UNITED MICROELECTRONICS CORPORATIONInventors: Kun-Ju Li, Ang Chan, Hsin-Jung Liu, Wei-Xin Gao, Jhih-Yuan Chen, Chun-Han Chen, Zong-Sian Wu, Chau-Chung Hou, I-Ming Lai, Fu-Shou Tsai
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Publication number: 20230268272Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The first etch stop layer and the first buffer layer are made of different materials. The chip structure includes a second etch stop layer over the first buffer layer. The second etch stop layer and the first buffer layer are made of different materials. The chip structure includes a device element over the second etch stop layer.Type: ApplicationFiled: April 28, 2023Publication date: August 24, 2023Inventors: Ping-En CHENG, Wei-Li HUANG, Kun-Ming TSAI, Shih-Hao LIN
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Patent number: 11670590Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The chip structure includes a second etch stop layer over the first buffer layer. The chip structure includes a device element over the second etch stop layer.Type: GrantFiled: August 12, 2021Date of Patent: June 6, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ping-En Cheng, Wei-Li Huang, Kun-Ming Tsai, Shih-Hao Lin
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Publication number: 20230051280Abstract: A chip structure is provided. The chip structure includes a substrate. The chip structure includes an interconnect structure over the substrate. The chip structure includes a conductive pad over the interconnect structure. The chip structure includes a passivation layer covering the interconnect structure and exposing the conductive pad. The chip structure includes a first etch stop layer over the passivation layer. The chip structure includes a first buffer layer over the first etch stop layer. The chip structure includes a second etch stop layer over the first buffer layer. The chip structure includes a device element over the second etch stop layer.Type: ApplicationFiled: August 12, 2021Publication date: February 16, 2023Inventors: Ping-En CHENG, Wei-Li HUANG, Kun-Ming TSAI, Shih-Hao LIN
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Publication number: 20220293494Abstract: A method of forming a semiconductor device includes following steps. A first organic layer is formed to cover a first conductive layer. A first opening is formed in the first organic layer to expose a first surface of the first conductive layer. A first silicon layer is formed on a sidewall of the first opening and the first surface of the first conductive layer. A first dielectric layer is formed on the sidewall of the first opening and the first surface of the first conductive layer over the first silicon layer. By using a first mask, portions of the first silicon layer and the first dielectric layer on the first surface are simultaneously removed to expose the first surface, wherein after removing the portions of the first silicon layer and the first dielectric layer, the first dielectric layer covers a top surface of the first silicon layer.Type: ApplicationFiled: May 30, 2022Publication date: September 15, 2022Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
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Patent number: 11387168Abstract: A semiconductor device includes a first conductive layer, an organic layer and a silicon layer. The first conductive layer includes a first surface. The organic layer is disposed over the first surface of the first conductive layer. The silicon layer is disposed over the organic layer and extended onto and in contact with the first surface of the first conductive layer.Type: GrantFiled: July 9, 2020Date of Patent: July 12, 2022Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
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Publication number: 20200343162Abstract: A semiconductor device includes a first conductive layer, an organic layer and a silicon layer. The first conductive layer includes a first surface. The organic layer is disposed over the first surface of the first conductive layer. The silicon layer is disposed over the organic layer and extended onto and in contact with the first surface of the first conductive layer.Type: ApplicationFiled: July 9, 2020Publication date: October 29, 2020Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
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Patent number: 10741477Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor devices includes a first conductive layer, an organic layer, a silicon layer, a magnetic layer and a second conductive layer. The organic layer is disposed over and exposes a portion of the first conductive layer. The silicon layer is disposed on and in contact with the organic layer. The magnetic layer is disposed over the first conductive layer. The second conductive layer is disposed over the organic layer and the magnetic layer to electrically connect the first conductive layer.Type: GrantFiled: March 23, 2018Date of Patent: August 11, 2020Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Lung Yang, Chih-Hung Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
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Publication number: 20190295925Abstract: Semiconductor devices and methods of forming the same are disclosed. One of the semiconductor devices includes a first conductive layer, an organic layer, a silicon layer, a magnetic layer and a second conductive layer. The organic layer is disposed over and exposes a portion of the first conductive layer. The silicon layer is disposed on and in contact with the organic layer. The magnetic layer is disposed over the first conductive layer. The second conductive layer is disposed over the organic layer and the magnetic layer to electrically connect the first conductive layer.Type: ApplicationFiled: March 23, 2018Publication date: September 26, 2019Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.Inventors: Cheng-Lung Yang, CHIH-HUNG Su, Chen-Shien Chen, Hon-Lin Huang, Kun-Ming Tsai, Wei-Je Lin
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Patent number: 10172541Abstract: A motion recognition device includes a sensing unit and a processing unit. The sensing unit generates a sense signal in response to a body motion occurring at a specific position on a user's body, wherein the sense signal includes a first sense signal portion and a second sense signal portion different from the first sense signal portion, and the body motion belongs to a motion segment of a motion type. The processing unit processes the sense signal to generate a motion parameter signal structure including a fusion signal of the first and the second sense signal portions, and recognizes the specific position to determine an effective reference signal for recognition of the motion type based on the motion parameter signal structure.Type: GrantFiled: February 4, 2016Date of Patent: January 8, 2019Assignee: J-MEX INC.Inventors: Wen-Hsuan Liao, Chi-hung Chen, Meng-Yu Lee, Chao-Ling Chen, Chih-Hung Hsu, Chi-Hung Hsieh, Chun-Yuan Huang, Deng-Huei Hwang, Kun-Ming Tsai, Tsang-Der Ni, I-Tang Chen, Kwang-Sing Tone
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Publication number: 20170086711Abstract: A motion recognition device includes a sensing unit and a processing unit. The sensing unit generates a sense signal in response to a body motion occurring at a specific position on a user's body, wherein the sense signal includes a first sense signal portion and a second sense signal portion different from the first sense signal portion, and the body motion belongs to a motion segment of a motion type. The processing unit processes the sense signal to generate a motion parameter signal structure including a fusion signal of the first and the second sense signal portions, and recognizes the specific position to determine an effective reference signal for recognition of the motion type based on the motion parameter signal structure.Type: ApplicationFiled: February 4, 2016Publication date: March 30, 2017Applicant: J-MEX Inc.Inventors: Wen-Hsuan Liao, Chi-hung Chen, Meng-Yu Lee, Chao-Ling Chen, Chih-Hung Hsu, Chi-Hung Hsieh, Chun-Yuan Huang, Deng-Huei Hwang, Kun-Ming Tsai, Tsang-Der Ni, I-Tang Chen, Kwang-Sing Tone
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Patent number: 9481070Abstract: The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad is a cast polyurethane polymeric matrix formed from an isocyanate-terminated molecule and a curative agent. The cast polyurethane polymeric matrix contains 4.2 to 7.5 weight percent fluid-filled microspheres in the isocyanate-terminated molecule. The fluid-filled-microspheres is polymeric and has an average diameter of 10 to 80 ?m and the polishing pad having a conditioner sensitivity (CS) of 0 to 2.6.Type: GrantFiled: December 19, 2014Date of Patent: November 1, 2016Assignees: Rohm and Haas Electronic Materials CMP Holdings, Inc., Dow Global Technologies LLCInventors: Bainian Qian, George C. Jacob, Kun-Ming Tsai
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Publication number: 20160176012Abstract: The invention provides a polishing pad suitable for planarizing at least one of semiconductor, optical and magnetic substrates. The polishing pad is a cast polyurethane polymeric matrix formed from an isocyanate-terminated molecule and a curative agent. The cast polyurethane polymeric matrix contains 4.2 to 7.5 weight percent fluid-filled microspheres in the isocyanate-terminated molecule. The fluid-filled-microspheres is polymeric and has an average diameter of 10 to 80 ?m and the polishing pad having a conditioner sensitivity (CS) of 0 to 2.6.Type: ApplicationFiled: December 19, 2014Publication date: June 23, 2016Inventors: Bainian Qian, George C. Jacob, Kun-Ming Tsai
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Patent number: 8452338Abstract: Control methods for a cell phone are provided upon occurrence of a particular event, which receive a contact-related information from a touch screen of the cell phone, analyze the contact-related information to identify the contact position, the number of contact objects, or a gesture, to determine a further step to deal with the particular event. The particular event may include receipt of a call, sounding of an alarm of the cell phone, displaying of a short message on the touch screen, receipt of an interrupting call, or a standby mode of the cell phone.Type: GrantFiled: March 22, 2010Date of Patent: May 28, 2013Assignee: Elan Microelectronics CorporationInventors: I-Hau Yeh, Kun-Ming Tsai, Joe Tsung-Ying Yeh, Theresa I-Hsing Yeh
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Patent number: 8401792Abstract: A navigation system includes a touch screen for receiving a touch input and displaying a navigation map, mode-switching means for issuing a mode-switching command to switch the navigation system into an input mode, a memory for storing a database, and a controller to recognize a handwriting input or a gesture input to acquire an input information, search the database for a facility information corresponding to the input information, and show facilities represented by the facility information in the navigation map.Type: GrantFiled: November 23, 2009Date of Patent: March 19, 2013Assignee: Elan Microelectronics CorporationInventors: Joe Tsung-Ying Yeh, Theresa I-Hsing Yeh, Kun-Ming Tsai
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Patent number: 8378987Abstract: A sensing method for a capacitive touch panel includes charging a measure capacitor, setting the voltage across a mutual capacitor at the intersection of two traces of the capacitive touch panel, and then injecting partial charges of the measure capacitor into the mutual capacitor. When the intersection is touched, the capacitance value of the mutual capacitor is changed, and consequently the amount of charges injected into the mutual capacitor is changed. Hence, the voltage of the measure capacitor could be detected to determine whether or not the intersection is touched.Type: GrantFiled: July 14, 2010Date of Patent: February 19, 2013Assignee: Elan Microelectronics CorporationInventors: Chun-Chung Huang, I-Shu Lee, Hsiu-Ju Yang, Ching-Chung Wang, Kun-Ming Tsai, Yu-Hui Lin
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Publication number: 20110012862Abstract: A sensing method for a capacitive touch panel includes charging a measure capacitor, setting the voltage across a mutual capacitor at the intersection of two traces of the capacitive touch panel, and then injecting partial charges of the measure capacitor into the mutual capacitor. When the intersection is touched, the capacitance value of the mutual capacitor is changed, and consequently the amount of charges injected into the mutual capacitor is changed. Hence, the voltage of the measure capacitor could be detected to determine whether or not the intersection is touched.Type: ApplicationFiled: July 14, 2010Publication date: January 20, 2011Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: CHUN-CHUNG HUANG, I-SHU LEE, HSIU-JU YANG, CHING-CHUNG WANG, KUN-MING TSAI, YU-HUI LIN
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Publication number: 20100261505Abstract: Control methods for a cell phone are provided upon occurrence of a particular event, which receive a contact-related information from a touch screen of the cell phone, analyze the contact-related information to identify the contact position, the number of contact objects, or a gesture, to determine a further step to deal with the particular event. The particular event may include receipt of a call, sounding of an alarm of the cell phone, displaying of a short message on the touch screen, receipt of an interrupting call, or a standby mode of the cell phone.Type: ApplicationFiled: March 22, 2010Publication date: October 14, 2010Applicant: ELAN MICROELECTRONICS CORPORATIONInventors: I-HAU YEH, KUN-MING TSAI, JOE TSUNG-YING YEH, THERESA I-HSING YEH
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Publication number: 20100131188Abstract: A navigation system includes a touch screen for receiving a touch input and displaying a navigation map, mode-switching means for issuing a mode-switching command to switch the navigation system into an input mode, a memory for storing a database, and a controller to recognize a handwriting input or a gesture input to acquire an input information, search the database for a facility information corresponding to the input information, and show facilities represented by the facility information in the navigation map.Type: ApplicationFiled: November 23, 2009Publication date: May 27, 2010Inventors: Joe Tsung-Ying Yeh, Theresa I-Hsing Yeh, Kun-Ming Tsai
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Patent number: 5887962Abstract: A foot for stabilizing a case includes a circular mounting plate to be secured to the bottom of the case, and an elongate foot plate which has a longitudinal channel to receive the mounting plate. The foot plate is rotatable about the axis of the mounting plate, and the mounting plate is slidable along the foot plate. Therefore, the angle and position of the foot plate are adjustable relative to the mounting plate for accommodation on the space where the case is located.Type: GrantFiled: July 17, 1997Date of Patent: March 30, 1999Inventor: Kun-Ming Tsai