Patents by Inventor Kun Ming Yang

Kun Ming Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961768
    Abstract: A method includes forming a first transistor, which includes forming a first gate dielectric layer over a first channel region in a substrate and forming a first work-function layer over the first gate dielectric layer, wherein forming the first work-function layer includes depositing a work-function material using first process conditions to form the work-function material having a first proportion of different crystalline orientations and forming a second transistor, which includes forming a second gate dielectric layer over a second channel region in the substrate and forming a second work-function layer over the second gate dielectric layer, wherein forming the second work-function layer includes depositing the work-function material using second process conditions to form the work-function material having a second proportion of different crystalline orientations.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Wen Chiu, Da-Yuan Lee, Hsien-Ming Lee, Kai-Cyuan Yang, Yu-Sheng Wang, Chih-Hsiang Fan, Kun-Wa Kuok
  • Patent number: 6429533
    Abstract: An electronic device includes a first conductive polymer layer sandwiched between a first external metal foil electrode and a first internal metal foil electrode, a second conductive polymer layer sandwiched between a second internal metal foil electrode and a second external metal foil electrode, a layer of fiber-reinforced epoxy resin bonding the first and second internal electrodes together, a first terminal providing electrical contact between the first internal electrode and the second external electrode, and a second terminal providing electrical contact between the second internal electrode and the first external electrode. In a preferred embodiment, the polymer layers exhibit PTC behavior, and the terminals are formed by a solder layer applied over a plated layer of conductive metal. Insulative layers are preferably provided on the external electrodes, and located so as to insulate the first and second terminals from each other.
    Type: Grant
    Filed: November 23, 1999
    Date of Patent: August 6, 2002
    Assignee: Bourns Inc.
    Inventors: Wen Been Li, Kun Ming Yang
  • Patent number: 6242997
    Abstract: An electronic device has three conductive polymer layers sandwiched between two external electrodes and two internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal.
    Type: Grant
    Filed: December 18, 1998
    Date of Patent: June 5, 2001
    Assignee: Bourns, Inc.
    Inventors: Andrew Brian Barrett, Steven D. Hogge, Wen Been Li, Kun Ming Yang
  • Publication number: 20010000658
    Abstract: An electronic device has three conductive polymer layers sandwiched between two external electrodes and two internal electrodes. The electrodes are staggered to create a first set of electrodes, in contact with a first terminal, alternating with a second set of electrodes in contact with a second terminal.
    Type: Application
    Filed: December 6, 2000
    Publication date: May 3, 2001
    Inventors: Andrew Brian Barrett, Steven D. Hogge, Wen Been Li, Kun Ming Yang