Patents by Inventor Kun Noh

Kun Noh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin composition for packaging a semiconductor device, method of making the same, and semiconductor device using the same
    Publication number: 20070031675
    Abstract: An epoxy resin composition, and a method of making the same, includes an epoxy resin and a curing agent, the epoxy resin composition also includes inorganic fillers, curing accelerators, and modified silicone oils. The epoxy resin is a modified epoxy resin prepared by glycidyl etherification of a mixture of a novolac type phenolic compound having a biphenyl derivative in the molecule and a 4,4?-dihydroxy biphenyl compound, and the curing agent is a mixture of a polyaromatic curing agent and a polyfunctional curing agent.
    Type: Application
    Filed: August 1, 2006
    Publication date: February 8, 2007
    Inventors: Jo Kim, Kun Noh, Yoon Park