Patents by Inventor Kun-Peng Yeh

Kun-Peng Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7414838
    Abstract: The present invention discloses a heating dissipating structure of an external hard disk drive box that includes a retaining base for mounting a hard disk, and the retaining base has adjusting rods that can be moved vertically up and down, and the retaining base and hard disk are covered by a heat dissipating cover, such that when the invention is assembled, the adjusting rods are rotated and pressed onto the heat dissipating cover, and the heat dissipating cover is attached closely onto the surface of the hard disk, and there exists no gap between the heat dissipating cover and the hard disk, so as to conduct the heat produced by the hard disk rapidly from the heat dissipating cover to the avoid and prevent any breakdown or failure due to an overheating.
    Type: Grant
    Filed: April 24, 2006
    Date of Patent: August 19, 2008
    Assignee: Hotway Technology Corp.
    Inventor: Kun-Peng Yeh
  • Publication number: 20060274505
    Abstract: The present invention discloses a heating dissipating structure of an external hard disk drive box that includes a retaining base for mounting a hard disk, and the retaining base has adjusting rods that can be moved vertically up and down, and the retaining base and hard disk are covered by a heat dissipating cover, such that when the invention is assembled, the adjusting rods are rotated and pressed onto the heat dissipating cover, and the heat dissipating cover is attached closely onto the surface of the hard disk, and there exists no gap between the heat dissipating cover and the hard disk, so as to conduct the heat produced by the hard disk rapidly from the heat dissipating cover to the avoid and prevent any breakdown or failure due to an overheating.
    Type: Application
    Filed: April 24, 2006
    Publication date: December 7, 2006
    Applicant: HOTWAY TECHNOLOGY CORP.
    Inventor: Kun-Peng Yeh