Abstract: A camera and an electronic device are provided to improve image stabilization. The camera provides an integrated circuit board that includes a fastening assembly and a movable assembly. The movable assembly includes an image sensor carrying assembly, one or more suspended beam assemblies, and one or more flexible assemblies. The image sensor carrying assembly is configured to carry an image sensor. The one or more suspended beam assemblies are configured to fasten a first magnetic driver group or a second magnetic driver group. The one or more suspended beam assemblies and the image sensor carrying assembly are connected to the fastening assembly through the one or more flexible assemblies. The entire circuit board is compact in structure, and the first magnetic driver group or the second magnetic driver group may be directly fastened to the circuit board to drive the image sensor.

Abstract: A single-operator laparoscope auxiliary operating device is provided, including a laparoscope and universal rotating mechanisms, wherein two universal rotating mechanisms are provided on the laparoscope, each of the universal rotating mechanisms includes a ball sleeve and a sleeve plate, the ball sleeve is slidably sleeved on the laparoscope, the sleeve plate is sleeved in a middle of the ball sleeve, and the ball sleeve is universally rotatable on the sleeve plate; a direction controlling mechanism; a moving mechanism; a supporting mechanism; a connecting frame, one end of the connecting frame is fixedly connected to the sleeve plate close to the lens of the laparoscope, and another end of the connecting frame is fixedly connected to the supporting mechanism; and a foot controller connected to the direction controlling mechanism and the moving mechanism.

Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.

Abstract: A terminal includes a substrate and a photosensitive chip mounted on the substrate, where a side of the photosensitive chip away from the substrate has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, and the photosensitive chip is electrically connected to the substrate by using a metal wire; and the photosensitive chip package structure further includes: a frame, disposed on the side of the photosensitive chip away from the substrate, where an avoidance groove used to avoid the metal wire is disposed on a side of the frame facing the substrate, the avoidance groove extends along a side edge of the frame, and an inner wall of the avoidance groove is an arc-shaped inner wall; and a filling glue, filled in the avoidance groove, and used to wrap the metal wire and bond the frame to the non-photosensitive area of the photosensitive chip and the substrate.

Abstract: This application provides example camera assemblies and example assembly methods. One example method includes plastic-packaging a surface mount electronic component and an image sensor to form a target plastic-packaged module, where the target plastic-packaged module includes an active surface, and where a solder end of the surface mount electronic component and a solder end of the image sensor are exposed on the active surface. A redistribution layer (RDL) can then be prepared and the RDL can then be drilled to form a through-hole, where the through-hole is opposite to a photosensitive area of the image sensor, where the RDL includes a dielectric layer and metal wiring disposed at the dielectric layer. The metal wiring exposed on the first surface of the RDL can then be connected to a solder end on the active surface of the target plastic-packaged module.

Abstract: A camera module is disclosed. The camera module includes a rotatable reflector, a lens group, a housing, and an image sensor. The housing includes a first surface and a second surface. A first mirror surface of the rotatable reflector is a reflective surface, and a part of the first mirror surface located in a first reflective area is a first sub mirror surface. When the rotatable reflector is located at a first position, the first mirror surface reflects a first optical signal. An image is generated after the reflected first optical signal is transmitted along a straight line along which an optical axis lies. When the rotatable reflector is located at a second position, the first mirror surface reflects a second optical signal. An image is generated after the reflected second optical signal is transmitted along the straight line along which the optical axis lies.

Abstract: A transmission stream (TS) generating apparatus includes an adaptor which receives general data and generates a stream having a plurality of packets, and which provides adaptive field in some of the plurality of packets, and an inserter which inserts additional data into all the payload areas of some of the plurality of packets that are not provided with the adaptive fields. Because additional data is transmitted, without requiring adaptive field header in certain packet, a data transmission rate is increased.