Patents by Inventor Kun-Sheng Chien

Kun-Sheng Chien has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device package with a heat sink and method for fabricating the same
    Patent number: 7485496
    Abstract: A semiconductor package with a heat sink and a method for fabricating the same are proposed. A first adhesive of a low Young's modulus is disposed on a corner region of a heat sink mounting area of a substrate. A second adhesive of a high Young's modulus is disposed on the heat sink mounting area except the corner region. The heat sink is mounted on the heat sink mounting area and thereby secured in position to the substrate, by the first and second adhesives. The disposition of the first and second adhesives of different Young's moduli not only prevents detachment of the heat sink from the substrate, but also controls the flatness of the heat sink. The prevent invention does not affect the appearance of the semiconductor package and its ensuing assembly process.
    Type: Grant
    Filed: December 29, 2006
    Date of Patent: February 3, 2009
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Kun-Sheng Chien, Shih-Kuang Chiu, Han-Ping Pu, Cheng-Hsu Hsiao
  • Semiconductor device package with a heat sink and method for fabricating the same
    Publication number: 20070235861
    Abstract: A semiconductor package with a heat sink and a method for fabricating the same are proposed. A first adhesive of a low Young's modulus is disposed on a corner region of a heat sink mounting area of a substrate. A second adhesive of a high Young's modulus is disposed on the heat sink mounting area except the corner region. The heat sink is mounted on the heat sink mounting area and thereby secured in position to the substrate, by the first and second adhesives. The disposition of the first and second adhesives of different Young's moduli not only prevents detachment of the heat sink from the substrate, but also controls the flatness of the heat sink. The prevent invention does not affect the appearance of the semiconductor package and its ensuing assembly process.
    Type: Application
    Filed: December 29, 2006
    Publication date: October 11, 2007
    Applicant: Siliconware Precision Industries Co., Ltd.
    Inventors: Kun-Sheng Chien, Shih-Kuang Chiu, Han-Ping Pu, Cheng-Hsu Hsiao