Patents by Inventor Kun-Shin Huang

Kun-Shin Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of reworking layers over substrate
    Patent number: 6998347
    Abstract: A method of reworking an integrated circuit device is described. A substrate having a dielectric layer, a barrier layer, a conductive layer and an anti-reflective layer formed thereon, is provided. The method of reworking the barrier layer, the conductive layer and the anti-reflective layer comprises removing the anti-reflection layer by performing a dry etching process, removing the conductive layer by performing a wet etching process, and then removing the barrier layer by performing a chemical machine polishing process.
    Type: Grant
    Filed: September 17, 2003
    Date of Patent: February 14, 2006
    Assignee: Nanya Technology Corporation
    Inventors: Min-Yi Hsu, Hsin-Jung Ho, Kun-Shin Huang, Yi-Nan Chen, Kaanlu Tzou
  • [METHOD OF REWORKING INTEGRATED CIRCUIT DEVICE]
    Publication number: 20050037622
    Abstract: A method of reworking an integrated circuit device is described. A substrate having a dielectric layer, a barrier layer, a conductive layer and an anti-reflective layer formed thereon, is provided. The method of reworking the barrier layer, the conductive layer and the anti-reflective layer comprises removing the anti-reflection layer by performing a dry etching process, removing the conductive layer by performing a wet etching process, and then removing the barrier layer by performing a chemical machine polishing process.
    Type: Application
    Filed: September 17, 2003
    Publication date: February 17, 2005
    Inventors: Min-Yi Hsu, Hsin-Jung Ho, Kun-Shin Huang, Yi-Nan Chen, Kaanlu Tzou