Abstract: An optical module with detachable optical port includes a module body and an optical port plastic part. The optical port of the module body is provided with a groove for inserting the optical port plastic part, and the optical port plastic part and the groove are detachably connected. A test method for an AOC optical module is provided, where the AOC optical module is the above-mentioned optical module with detachable optical port. According to the optical module with a detachable optical port, the detachable optical port plastic part can be disassembled and replaced independently without disassembling the module body, which can make this optical module scheme more convenient to change into the AOC module by replacing the plastic part of the optical port, and there is no need to re-do the performance test, which effectively improves the flexibility of the product scheme.

Abstract: An optical module optimized for EMI shielding performance and electromagnetic shielding structure of the optical module includes a base, an upper cover, and an unlocking device connected by an unlocking handle and a movable unlocking piece; the base is butted and clamped with the upper cover to form a limiting groove for accommodating the unlocking latch on both sides of the movable unlocking piece, the unlocking latch is correspondingly slidably fitted in the limiting groove; the upper end of the unlocking latch on each side is provided with a first notch, which is used to make way for the base EMI lug boss set on the base, the lower end of the unlocking latch on each side is provided with a second notch, which is used to make way for the upper cover EMI lug boss set on the upper cover.

Abstract: An optical module with detachable optical port includes a module body and an optical port plastic part. The optical port of the module body is provided with a groove for inserting the optical port plastic part, and the optical port plastic part and the groove are detachably connected. A test method for an AOC optical module is provided, where the AOC optical module is the above-mentioned optical module with detachable optical port. According to the optical module with a detachable optical port, the detachable optical port plastic part can be disassembled and replaced independently without disassembling the module body, which can make this optical module scheme more convenient to change into the AOC module by replacing the plastic part of the optical port, and there is no need to re-do the performance test, which effectively improves the flexibility of the product scheme.

Abstract: An optical module optimized for EMI shielding performance and electromagnetic shielding structure of the optical module includes a base, an upper cover, and an unlocking device connected by an unlocking handle and a movable unlocking piece; the base is butted and clamped with the upper cover to form a limiting groove for accommodating the unlocking latch on both sides of the movable unlocking piece, the unlocking latch is correspondingly slidably fitted in the limiting groove; the upper end of the unlocking latch on each side is provided with a first notch, which is used to make way for the base EMI lug boss set on the base, the lower end of the unlocking latch on each side is provided with a second notch, which is used to make way for the upper cover EMI lug boss set on the upper cover.

Abstract: An ion source head structure of a semiconductor ion implanter including a filament, a filament clamp, a cathode, a cathode clamp, an insulation assembly is provided. The filament clamp clamps the filament. The cathode presents a shell shape and has a receiving space. The filament is located in the receiving space. The cathode clamp clamps the cathode. The insulation assembly is disposed between the filament clamp and the cathode clamp such that the filament clamp is insulated from the cathode clamp. The insulation assembly has a first surface, a second surface opposite to the first surface, and an outer surface between the first surface and the second surface, wherein the first surface of the insulation assembly is in contact with the filament clamp, and the second surface of the insulation assembly is in contact with the cathode clamp. A step difference exists on the outer surface of the insulation assembly.

Abstract: Provided is a semiconductor device including a substrate, a pad, a protective layer, a plurality of convex patterns, a redistribution layer (RDL), and a bump. The pad is disposed on the substrate. The protective layer is disposed on the substrate. The protective layer has a first opening exposing a portion of a surface of the pad. The convex patterns are disposed on the protective layer. The RDL is disposed on the convex patterns. The RDL extends from the pad to the convex patterns. The bump is disposed on the convex patterns.

Abstract: Provided is a semiconductor device including a substrate, a pad, a protective layer, a plurality of convex patterns, a redistribution layer (RDL), and a bump. The pad is disposed on the substrate. The protective layer is disposed on the substrate. The protective layer has a first opening exposing a portion of a surface of the pad. The convex patterns are disposed on the protective layer. The RDL is disposed on the convex patterns. The RDL extends from the pad to the convex patterns. The bump is disposed on the convex patterns.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

Abstract: A canister comprises a vessel defining a volume and an opening having a rim and a lid. The lid comprises a flexible bulb and a conformal outer edge configured to create an airtight vacuum seal with the rim to close the opening. The flexible bulb is configured to release pressure from the vessel and break the airtight vacuum seal in response to compression of the bulb. The lid can be configured to be completely contained within the rim.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.

Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.

Abstract: A connecting structure for connecting heat-radiation fins comprises a plurality of heat-radiation fins each having a heat conductive portion with both edges folded into wing portions. The wing portions of the respective heat-radiation fins are different in width, and the heat-radiation fins are classified into narrow and wide heat-radiation fins, between each narrow heat-radiation fin and wide heat-radiation fin is connected a connecting fin, each wing portion of the respective heat-radiation fins and the connecting fins is defined with receiving apertures, an outer portion of the respective receiving apertures extends outward to form a connecting portion to be received in a corresponding receiving aperture of a neighboring fin. The connecting fins are provided with receiving apertures and connecting portions which are sized corresponding to that of neighboring narrow and wide heat-radiation fins.

Abstract: A canister comprises a vessel defining a volume and an opening having a rim and a lid. The lid comprises a flexible bulb and a conformal outer edge configured to create an airtight seal with the rim to close the opening. The flexible bulb is configured to release pressure from the vessel and break the airtight seal in response to compression of the bulb. The lid can be configured to be completely contained within the rim.

Abstract: A heat-dissipating element with connecting structures comprises at least two opposite stop edges. Each stop edge is formed with at least one connecting structure, and each connecting structure includes a first connecting portion which has a fastener and a fastening hole and a second connecting portion which has a positioning concave portion and a positioning protrusion. The heat-dissipating elements are assuredly assembled with each other through the engagement and fastening connection of the first connecting portion and the second connecting portion.

Abstract: A hemispherical silicon grain (HSG) process is described. A doped poly-Si layer is formed on a substrate, and then an oxidative gas is used to oxidize the surface of the doped poly-Si layer to form an oxide layer. An a-Si layer is then formed on the oxide layer, and the a-Si layer is converted into HSG.