Patents by Inventor Kun-Shu Chuang

Kun-Shu Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10068861
    Abstract: Provided is a semiconductor device including a substrate, a pad, a protective layer, a plurality of convex patterns, a redistribution layer (RDL), and a bump. The pad is disposed on the substrate. The protective layer is disposed on the substrate. The protective layer has a first opening exposing a portion of a surface of the pad. The convex patterns are disposed on the protective layer. The RDL is disposed on the convex patterns. The RDL extends from the pad to the convex patterns. The bump is disposed on the convex patterns.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: September 4, 2018
    Assignee: ChipMOS Technologies Inc.
    Inventor: Kun-Shu Chuang
  • SEMICONDUCTOR DEVICE
    Publication number: 20170352631
    Abstract: Provided is a semiconductor device including a substrate, a pad, a protective layer, a plurality of convex patterns, a redistribution layer (RDL), and a bump. The pad is disposed on the substrate. The protective layer is disposed on the substrate. The protective layer has a first opening exposing a portion of a surface of the pad. The convex patterns are disposed on the protective layer. The RDL is disposed on the convex patterns. The RDL extends from the pad to the convex patterns. The bump is disposed on the convex patterns.
    Type: Application
    Filed: September 30, 2016
    Publication date: December 7, 2017
    Applicant: ChipMOS Technologies Inc.
    Inventor: Kun-Shu Chuang