Patents by Inventor Kun-Shu YANG

Kun-Shu YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing pad with offset concentric grooving pattern and method for polishing a substrate therewith
    Patent number: 9687956
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: June 27, 2017
    Assignee: Cabot Microelectronics Corporation
    Inventors: Ching-Ming Tsai, Shi-Wei Cheng, Kun-Shu Yang, Jia-Cheng Hsu, Sheng-Huan Liu, Feng-Chih Hsu, Craig Kokjohn
  • CMP polishing pad having edge exclusion region of offset concentric groove pattern
    Patent number: 9409276
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.
    Type: Grant
    Filed: October 16, 2014
    Date of Patent: August 9, 2016
    Assignee: Cabot Microelectronics Corporation
    Inventors: Ching-Ming Tsai, Shi-Wei Cheng, Jia-Cheng Hsu, Kun-Shu Yang, Hui-Feng Chen, Gregory Gaudet, Sheng-Huan Liu
  • POLISHING PAD WITH OFFSET CONCENTRIC GROOVING PATTERN AND METHOD FOR POLISHING A SUBSTRATE THEREWITH
    Publication number: 20150298287
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises a plurality of grooves composed of at least a first plurality of concentric grooves having a first center of concentricity, and a second plurality of concentric grooves having a second center of concentricity. The first center of concentricity is not coincident with the second center of concentricity, the axis of rotation of the polishing pad is not coincident with at least one of the first center of concentricity and the second center of concentricity, the plurality of grooves does not consist of a continuous spiral groove, and the polishing surface does not comprise a mosaic groove pattern.
    Type: Application
    Filed: November 5, 2013
    Publication date: October 22, 2015
    Inventors: Ching-Ming Tsai, Shi-Wei Cheng, Kun-Shu Yang, Jia-Cheng Hsu, Sheng-Huan Liu, Feng-Chih Hsu, Craig Kokjohn
  • CMP POLISHING PAD HAVING EDGE EXCLUSION REGION OF OFFSET CONCENTRIC GROOVE PATTERN
    Publication number: 20150111476
    Abstract: The invention provides a polishing pad and a method of using the polishing pad for chemically-mechanically polishing a substrate. The polishing pad comprises at least a grooved region and an exclusion region, wherein the exclusion region is adjacent to the circumference of the polishing pad, and wherein the exclusion region is devoid of grooves.
    Type: Application
    Filed: October 16, 2014
    Publication date: April 23, 2015
    Inventors: Ching-Ming TSAI, Shi-Wei CHENG, Jia-Cheng HSU, Kun-Shu YANG, Hui-Feng CHEN, Gregory GAUDET, Sheng-Huan LlU